Raymond W. Thompson

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Sugar Land, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Ball grid package with multiple power/ground planes
- Patent number 6,396,136
- Issue date May 28, 2002
- Texas Instruments Incorporated
- Navinchandra Kalidas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making plastic package for a surface mounted integrated c...
- Patent number 5,976,914
- Issue date Nov 2, 1999
- Texas Instruments Incorporated
- John H. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic packaging for a surface mounted integrated circuit
- Patent number 5,777,382
- Issue date Jul 7, 1998
- Texas Instruments Incorporated
- John H. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intelligent electronic connection socket
- Patent number 4,540,226
- Issue date Sep 10, 1985
- Texas Instruments Incorporated
- Raymond W. Thompson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BALL GRID PACKAGE WITH MULTIPLE POWER/ GROUND PLANES
- Publication number 20010013654
- Publication date Aug 16, 2001
- NAVINCHANDRA KALIDAS
- H01 - BASIC ELECTRIC ELEMENTS