RAYMUNDO M. CAMENFORTE

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ALLEN, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Laser-assisted cleaving of a reconstituted wafer for stacked die as...
- Patent number 8,815,642
- Issue date Aug 26, 2014
- Texas Instruments Incorporated
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-assisted cleaving of a reconstituted wafer for stacked die as...
- Patent number 8,575,758
- Issue date Nov 5, 2013
- Texas Instruments Incorporated
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for increased stand-off height in stud bumping pr...
- Patent number 7,521,284
- Issue date Apr 21, 2009
- Texas Instruments Incorporated
- Ariel Lizaba Miranda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Laser-Assisted Cleaving of a Reconstituted Wafer for Stacked Die As...
- Publication number 20140038359
- Publication date Feb 6, 2014
- TEXAS INSTRUMENTS INCORPORATED
- JEFFREY ALAN WEST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER-ASSISTED CLEAVING OF A RECONSTITUTED WAFER FOR STACKED DIE AS...
- Publication number 20130032946
- Publication date Feb 7, 2013
- TEXAS INSTRUMENTS INCORPORATED
- JEFFREY ALAN WEST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER CHIP SCALE PACKAGE TEST FLOW AND DICING PROCESS
- Publication number 20110193200
- Publication date Aug 11, 2011
- Kevin P. Lyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method for increased stand-off height in stud bumping pr...
- Publication number 20080217768
- Publication date Sep 11, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Ariel Lizaba Miranda
- H01 - BASIC ELECTRIC ELEMENTS