Raymundo M. Camenforte

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Molded silicon on passive package
- Patent number 12,165,956
- Issue date Dec 10, 2024
- Apple Inc.
- Kumar Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectable monolithic or external scalable die-to-die interconnecti...
- Patent number 12,087,689
- Issue date Sep 10, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible package architecture concept in fanout
- Patent number 12,074,077
- Issue date Aug 27, 2024
- Apple Inc.
- Karthik Shanmugam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectable monolithic or external scalable die-to-die interconnecti...
- Patent number 11,862,557
- Issue date Jan 2, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stitching and harvesting of arrayed structures
- Patent number 11,728,266
- Issue date Aug 15, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level passive array packaging
- Patent number 11,395,408
- Issue date Jul 19, 2022
- Apple Inc.
- Scott D. Morrison
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Selectable Monolithic or External Scalable Die-to-Die Interconnecti...
- Publication number 20240047353
- Publication date Feb 8, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STITCHING AND HARVESTING OF ARRAYED STRUCTURES
- Publication number 20230402373
- Publication date Dec 14, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Silicon on Passive Package
- Publication number 20230178458
- Publication date Jun 8, 2023
- Apple Inc.
- Kumar Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selectable Monolithic or External Scalable Die-to-Die Interconnecti...
- Publication number 20230085890
- Publication date Mar 23, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STITCHING AND HARVESTING OF ARRAYED STRUCTURES
- Publication number 20220199517
- Publication date Jun 23, 2022
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible Package Architecture Concept in Fanout
- Publication number 20220157680
- Publication date May 19, 2022
- Apple Inc.
- Karthik Shanmugam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-Level Passive Array Packaging
- Publication number 20220071013
- Publication date Mar 3, 2022
- Apple Inc.
- Scott D. Morrison
- H01 - BASIC ELECTRIC ELEMENTS

Raymundo M. Camenforte

Person

Patents Grantslast 30 patents

Molded silicon on passive package

Selectable monolithic or external scalable die-to-die interconnecti...

Flexible package architecture concept in fanout

Selectable monolithic or external scalable die-to-die interconnecti...

Die stitching and harvesting of arrayed structures

Wafer-level passive array packaging

Patents Applicationslast 30 patents

Selectable Monolithic or External Scalable Die-to-Die Interconnecti...

DIE STITCHING AND HARVESTING OF ARRAYED STRUCTURES

Molded Silicon on Passive Package

Selectable Monolithic or External Scalable Die-to-Die Interconnecti...

DIE STITCHING AND HARVESTING OF ARRAYED STRUCTURES

Flexible Package Architecture Concept in Fanout

Wafer-Level Passive Array Packaging