Raymundo M. Camenforte

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Single unit automated assembly of flex enhanced ball grid array pac...
- Patent number 6,759,752
- Issue date Jul 6, 2004
- ST Assembly Test Services Ltd.
- Raymundo M. Camenforte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Super thin/super thermal ball grid array package
- Patent number 6,744,125
- Issue date Jun 1, 2004
- ST Assembly Test Services Ltd.
- Raymundo M. Camenforte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for an integrated circuit chip
- Patent number 6,621,151
- Issue date Sep 16, 2003
- Institute of Microelectronics
- Tai Chong Chai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded stiffener for flexible circuit molding
- Patent number 6,617,525
- Issue date Sep 9, 2003
- ST Assembly Test Services Ltd.
- John Briar
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Single unit automated assembly of flex enhanced ball grid array pac...
- Patent number 6,544,812
- Issue date Apr 8, 2003
- ST Assembly Test Service Ltd.
- Raymundo M. Camenforte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Super thin/super thermal ball grid array package
- Patent number 6,537,848
- Issue date Mar 25, 2003
- ST Assembly Test Services Ltd.
- Raymundo M. Camenforte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of molding flexible circuit with molded stiffener
- Patent number 6,355,199
- Issue date Mar 12, 2002
- ST Assembly Test Services PTE LTD
- John Briar
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Molded tape support for a molded circuit package prior to dicing
- Patent number 6,103,550
- Issue date Aug 15, 2000
- ST Assembly Test Services, Pte Ltd.
- Raymundo M. Camenforte
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Single unit automated assembly of flex enhanced ball grid array pac...
- Publication number 20030151148
- Publication date Aug 14, 2003
- ST ASSEMBLY TEST SERVICES PTE LTD
- Raymundo M. Camenforte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Super thin/super thermal ball grid array package
- Publication number 20030143777
- Publication date Jul 31, 2003
- ST Assembly Test Services Ltd.
- Raymundo M. Camenforte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Super thin/super thermal ball grid array package
- Publication number 20020180040
- Publication date Dec 5, 2002
- ST ASSEMBLY TEST SERVICES PTE LTD
- Raymundo M. Camenforte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame for an integrated circuit chip (integrated circuit perip...
- Publication number 20020163078
- Publication date Nov 7, 2002
- Tai-Chong Chai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded stiffener for flexible circuit molding
- Publication number 20020056570
- Publication date May 16, 2002
- ST ASSEMBLY TEST SERVICES PTE LTD
- John Briar
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Raymundo M. Camenforte

Person

Patents Grantslast 30 patents

Single unit automated assembly of flex enhanced ball grid array pac...

Super thin/super thermal ball grid array package

Lead frame for an integrated circuit chip

Molded stiffener for flexible circuit molding

Single unit automated assembly of flex enhanced ball grid array pac...

Super thin/super thermal ball grid array package

Method of molding flexible circuit with molded stiffener

Molded tape support for a molded circuit package prior to dicing

Patents Applicationslast 30 patents

Single unit automated assembly of flex enhanced ball grid array pac...

Super thin/super thermal ball grid array package

Super thin/super thermal ball grid array package

Lead frame for an integrated circuit chip (integrated circuit perip...

Molded stiffener for flexible circuit molding