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Real Joseph Tetreault
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Granby, CA
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Patents Grants
last 30 patents
Information
Patent Grant
Transfer molding of integrated circuit packages
Patent number
6,988,882
Issue date
Jan 24, 2006
International Business Machines Corporation
Marie-France Boyaud
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Transfer molding of integrated circuit packages
Patent number
6,956,296
Issue date
Oct 18, 2005
International Business Machines Corporation
Marie-France Boyaud
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Assembly of opto-electronic module with improved heat sink
Patent number
6,822,875
Issue date
Nov 23, 2004
International Business Machines Corporation
Benson Chan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Transfer molding of integrated circuit packages
Patent number
6,656,773
Issue date
Dec 2, 2003
International Business Machines Corporation
Marie-France Boyaud
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Alignment systems for subassemblies of overmolded optoelectronic mo...
Patent number
6,547,452
Issue date
Apr 15, 2003
International Business Machines Corporation
Benson Chan
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Assembly of opto-electronic module with improved heat sink
Patent number
6,508,595
Issue date
Jan 21, 2003
International Business Machines Corporation
Benson Chan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Transfer molding method for forming integrated circuit package
Patent number
6,309,575
Issue date
Oct 30, 2001
International Business Machines Corporation
Lynda Boutin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Biasing mold for integrated circuit chip assembly encapsulation
Patent number
5,997,798
Issue date
Dec 7, 1999
International Business Machines Corporation
Real Joseph Tetreault
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Integrated circuit chip package
Patent number
5,939,778
Issue date
Aug 17, 1999
International Business Machines Corporation
Lynda Boutin
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Transfer molding of integrated circuit packages
Publication number
20050275091
Publication date
Dec 15, 2005
International Business Machines Corporation
Marie-France Boyaud
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Transfer holding of integrated circuit packages
Publication number
20040071805
Publication date
Apr 15, 2004
International Business Machines Corporation
Marie-France Boyaud
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Assembly of opto-electronic module with improved heat sink
Publication number
20030059176
Publication date
Mar 27, 2003
International Business Machines Corporation
Benson Chan
G02 - OPTICS
Information
Patent Application
Transfer molding of integrated circuit packages
Publication number
20020192876
Publication date
Dec 19, 2002
Marie-France Boyaud
H01 - BASIC ELECTRIC ELEMENTS