Reed A. George

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El Reno, OK, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for marking functional integrated circuit chips with underfi...
- Patent number 5,918,363
- Issue date Jul 6, 1999
- Motorola, Inc.
- Reed Allen George
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming solder bumps on bond pads
- Patent number 5,829,668
- Issue date Nov 3, 1998
- Motorola Corporation
- Reed A. George
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for an integrated circuit chip carrier having...
- Patent number 5,625,224
- Issue date Apr 29, 1997
- Motorola, Inc.
- Jonathon Greenwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid phase conformal coating suitable for use with electronic devices
- Patent number 5,475,379
- Issue date Dec 12, 1995
- Motorola, Inc.
- Reed A. George
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct chip attachment structure and method
- Patent number 5,439,162
- Issue date Aug 8, 1995
- Motorola, Inc.
- Reed A. George
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for underencapsulating components on circuit supporting subs...
- Patent number 5,386,624
- Issue date Feb 7, 1995
- Motorola, Inc.
- Reed A. George
- H01 - BASIC ELECTRIC ELEMENTS