Reginald W. Smith

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Arlington, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Process of packaging a semiconductor device with reduced stress forces
- Patent number 4,874,722
- Issue date Oct 17, 1989
- Texas Instruments Incorporated
- George A. Bednarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked interdigitated lead frame assembly
- Patent number 4,496,965
- Issue date Jan 29, 1985
- Texas Instruments Incorporated
- John W. Orcutt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier for integrated circuit
- Patent number 4,495,376
- Issue date Jan 22, 1985
- Texas Instruments Incorporated
- Angus W. Hightower
- H01 - BASIC ELECTRIC ELEMENTS