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Rei Fujimaki

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Patents Grantslast 30 patents

  • Information Patent Grant

    Lead-free solder alloy
    • Patent number 10,343,238
    • Issue date Jul 9, 2019
    • Senju Metal Industry Co., Ltd.
    • Masayuki Suzuki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder alloy, and LED module
    • Patent number 10,272,527
    • Issue date Apr 30, 2019
    • Senju Metal Industry Co., Ltd.
    • Minoru Ueshima
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder alloy and module
    • Patent number 10,265,807
    • Issue date Apr 23, 2019
    • Senju Metal Industry Co., Ltd.
    • Minoru Ueshima
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    High-temperature lead-free solder alloy
    • Patent number 9,796,053
    • Issue date Oct 24, 2017
    • Senju Metal Industry Co., Ltd.
    • Rei Fujimaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    High-temperature lead-free solder alloy
    • Patent number 8,865,062
    • Issue date Oct 21, 2014
    • Senju Metal Industry Co., Ltd.
    • Minoru Ueshima
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    Solder Alloy for LED, and LED Module
    • Publication number 20180264601
    • Publication date Sep 20, 2018
    • SENJU METAL INDUSTRY CO., LTD.
    • Minoru UESHIMA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    LEAD-FREE SOLDER ALLOY
    • Publication number 20180001426
    • Publication date Jan 4, 2018
    • SENJU METAL INDUSTRY CO., LTD.
    • Masayuki SUZUKI
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Solder Alloy for LED, and LED Module
    • Publication number 20170014955
    • Publication date Jan 19, 2017
    • SENJU METAL INDUSTRY CO., LTD.
    • Minoru UESHIMA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    LEAD-FREE SOLDER ALLOY
    • Publication number 20150328722
    • Publication date Nov 19, 2015
    • SENJU METAL INDUSTRY CO., LTD
    • Masayuki SUZUKI
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    HIGH-TEMPERATURE LEAD-FREE SOLDER ALLOY
    • Publication number 20150217410
    • Publication date Aug 6, 2015
    • SENJUMETAL INDUSTRY CO., LTD.
    • Rei Fujimaki
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    SN-CU-BASED LEAD-FREE SOLDER ALLOY
    • Publication number 20150029670
    • Publication date Jan 29, 2015
    • SENJU METAL INDUSTRY CO., LTD.
    • Tsukasa Ohnishi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HIGH-TEMPERATURE LEAD-FREE SOLDER ALLOY
    • Publication number 20140044479
    • Publication date Feb 13, 2014
    • Minoru Ueshima
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...