TREA

Rei Kiumi

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Plating method and apparatus
    • Patent number 8,317,993
    • Issue date Nov 27, 2012
    • Ebara Corporation
    • Fumio Kuriyama
    • B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
  • Information Patent Grant

    Plating apparatus
    • Patent number 8,252,167
    • Issue date Aug 28, 2012
    • Ebara Corporation
    • Fumio Kuriyama
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Plating apparatus
    • Patent number 7,875,158
    • Issue date Jan 25, 2011
    • Ebara Corporation
    • Fumio Kuriyama
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Lead free bump and method of forming the same
    • Patent number 7,012,333
    • Issue date Mar 14, 2006
    • Ebara Corporation
    • Masashi Shimoyama
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20110073482
    • Publication date Mar 31, 2011
    • Fumio Kuriyama
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating method and apparatus
    • Publication number 20090311429
    • Publication date Dec 17, 2009
    • Fumio Kuriyama
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating apparatus
    • Publication number 20090218231
    • Publication date Sep 3, 2009
    • Toshikazu Yajima
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating method and apparatus
    • Publication number 20070117365
    • Publication date May 24, 2007
    • EBARA CORPORATION
    • Fumio Kuriyama
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating apparatus
    • Publication number 20060113185
    • Publication date Jun 1, 2006
    • Fumio Kuriyama
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Method of forming a lead-free bump and a plating apparatus therefor
    • Publication number 20050279640
    • Publication date Dec 22, 2005
    • Masashi Shimoyama
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating device
    • Publication number 20040262150
    • Publication date Dec 30, 2004
    • Toshikazu Yajima
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Lead free bump and method of forming the same
    • Publication number 20040219775
    • Publication date Nov 4, 2004
    • Masashi Shimoyama
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR