Rei-Lin Chu

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
MIM capacitor with a symmetrical capacitor insulator structure
- Patent number 12,199,029
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D trench capacitor for integrated passive devices
- Patent number 11,862,612
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to reduce breakdown failure in a MIM capacitor
- Patent number 11,594,593
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MIM capacitor with a symmetrical capacitor insulator structure
- Patent number 11,430,729
- Issue date Aug 30, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of optimizing film deposition process in semiconductor fabri...
- Patent number 11,232,946
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Rei-Lin Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D trench capacitor for integrated passive devices
- Patent number 11,211,362
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to reduce breakdown failure in a MIM capacitor
- Patent number 11,152,455
- Issue date Oct 19, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MIM CAPACITOR WITH A SYMMETRICAL CAPACITOR INSULATOR STRUCTURE
- Publication number 20250105137
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D TRENCH CAPACITOR FOR INTEGRATED PASSIVE DEVICES
- Publication number 20240088103
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO REDUCE BREAKDOWN FAILURE IN A MIM CAPACITOR
- Publication number 20230187478
- Publication date Jun 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM CAPACITOR WITH A SYMMETRICAL CAPACITOR INSULATOR STRUCTURE
- Publication number 20220352065
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF OPTIMIZING FILM DEPOSITION PROCESS IN SEMICONDUCTOR FABRI...
- Publication number 20220139695
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Rei-Lin CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED TRENCH ISOLATION STRUCTURE
- Publication number 20220123031
- Publication date Apr 21, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D TRENCH CAPACITOR FOR INTEGRATED PASSIVE DEVICES
- Publication number 20220115358
- Publication date Apr 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM CAPACITOR WITH A SYMMETRICAL CAPACITOR INSULATOR STRUCTURE
- Publication number 20220084935
- Publication date Mar 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO REDUCE BREAKDOWN FAILURE IN A MIM CAPACITOR
- Publication number 20220069068
- Publication date Mar 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D TRENCH CAPACITOR FOR INTEGRATED PASSIVE DEVICES
- Publication number 20210296283
- Publication date Sep 23, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF OPTIMIZING FILM DEPOSITION PROCESS IN SEMICONDUCTOR FABRI...
- Publication number 20210249255
- Publication date Aug 12, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Rei-Lin CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO REDUCE BREAKDOWN FAILURE IN A MIM CAPACITOR
- Publication number 20210091169
- Publication date Mar 25, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS

Rei-Lin Chu

Person

Patents Grantslast 30 patents

MIM capacitor with a symmetrical capacitor insulator structure

3D trench capacitor for integrated passive devices

Method to reduce breakdown failure in a MIM capacitor

MIM capacitor with a symmetrical capacitor insulator structure

Method of optimizing film deposition process in semiconductor fabri...

3D trench capacitor for integrated passive devices

Method to reduce breakdown failure in a MIM capacitor

Patents Applicationslast 30 patents

MIM CAPACITOR WITH A SYMMETRICAL CAPACITOR INSULATOR STRUCTURE

3D TRENCH CAPACITOR FOR INTEGRATED PASSIVE DEVICES

METHOD TO REDUCE BREAKDOWN FAILURE IN A MIM CAPACITOR

MIM CAPACITOR WITH A SYMMETRICAL CAPACITOR INSULATOR STRUCTURE

METHOD OF OPTIMIZING FILM DEPOSITION PROCESS IN SEMICONDUCTOR FABRI...

ENHANCED TRENCH ISOLATION STRUCTURE

3D TRENCH CAPACITOR FOR INTEGRATED PASSIVE DEVICES

MIM CAPACITOR WITH A SYMMETRICAL CAPACITOR INSULATOR STRUCTURE

METHOD TO REDUCE BREAKDOWN FAILURE IN A MIM CAPACITOR

3D TRENCH CAPACITOR FOR INTEGRATED PASSIVE DEVICES

METHOD OF OPTIMIZING FILM DEPOSITION PROCESS IN SEMICONDUCTOR FABRI...

METHOD TO REDUCE BREAKDOWN FAILURE IN A MIM CAPACITOR