Reid F. Cooper

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Madison, WI, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of bonding a stack of layers by electromagnetic induction he...
- Patent number 6,951,798
- Issue date Oct 4, 2005
- Wisconsin Alumni Research Foundation
- John H. Booske
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of bonding a stack of layers by electromagnetic induction he...
- Publication number 20030000638
- Publication date Jan 2, 2003
- Wisconsin Alumni Research Foundation
- John H. Booske
- B32 - LAYERED PRODUCTS