Reiko SASAHARA

Person

Nirasaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for processing oxygen-containing workpiece
- Patent number 11,548,804
- Issue date Jan 10, 2023
- Tokyo Electron Limited
- Reiko Sasahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method
- Patent number 11,127,597
- Issue date Sep 21, 2021
- Tokyo Electron Limited
- Reiko Sasahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and method for removing boron-doped sil...
- Patent number 10,964,546
- Issue date Mar 30, 2021
- Tokyo Electron Limited
- Reiko Sasahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing condition inspection and optimization method of damage r...
- Patent number 8,282,984
- Issue date Oct 9, 2012
- Tokyo Electron Limited
- Reiko Sasahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and storage medium
- Patent number 8,026,150
- Issue date Sep 27, 2011
- Tokyo Electron Limited
- Reiko Sasahara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ETCHING METHOD AND ETCHING APPARATUS
- Publication number 20240006187
- Publication date Jan 4, 2024
- Tokyo Electron Limited
- Toshinori DEBARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS TREATMENT APPARATUS
- Publication number 20220301821
- Publication date Sep 22, 2022
- TOKYO ELECTRON LIMITED
- Yuji SAEGUSA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ETCHING METHOD
- Publication number 20200111674
- Publication date Apr 9, 2020
- TOKYO ELECTRON LIMITED
- Reiko SASAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PROCESSING OXYGEN-CONTAINING WORKPIECE
- Publication number 20200048134
- Publication date Feb 13, 2020
- TOKYO ELECTRON LIMITED
- Reiko SASAHARA
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
SUBSTRATE PROCESSING METHOD AND METHOD FOR REMOVING BORON-DOPED SIL...
- Publication number 20190157093
- Publication date May 23, 2019
- TOKYO ELECTRON LIMITED
- Reiko SASAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING CONDITION INSPECTION AND OPTIMIZATION METHOD OF DAMAGE R...
- Publication number 20130025537
- Publication date Jan 31, 2013
- Reiko SASAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND STORAGE MEDIUM
- Publication number 20090305480
- Publication date Dec 10, 2009
- TOKYO ELECTRON LIMITED
- Reiko SASAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING CONDITION INSPECTION AND OPTIMIZATION METHOD OF DAMAGE R...
- Publication number 20090146145
- Publication date Jun 11, 2009
- TOKYO ELECTRON LIMITED
- Reiko SASAHARA
- H01 - BASIC ELECTRIC ELEMENTS

Reiko SASAHARA

Person

Patents Grantslast 30 patents

Method and apparatus for processing oxygen-containing workpiece

Etching method

Substrate processing method and method for removing boron-doped sil...

Processing condition inspection and optimization method of damage r...

Semiconductor device manufacturing method and storage medium

Patents Applicationslast 30 patents

ETCHING METHOD AND ETCHING APPARATUS

GAS TREATMENT APPARATUS

ETCHING METHOD

METHOD AND APPARATUS FOR PROCESSING OXYGEN-CONTAINING WORKPIECE

SUBSTRATE PROCESSING METHOD AND METHOD FOR REMOVING BORON-DOPED SIL...

PROCESSING CONDITION INSPECTION AND OPTIMIZATION METHOD OF DAMAGE R...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND STORAGE MEDIUM

PROCESSING CONDITION INSPECTION AND OPTIMIZATION METHOD OF DAMAGE R...