Reinhard Ploss

Person

Muenchen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a semiconductor device
- Patent number 11,888,024
- Issue date Jan 30, 2024
- Infineon Technologies AG
- Reinhard Ploss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including trench gate structure and manufactur...
- Patent number 11,251,269
- Issue date Feb 15, 2022
- Infineon Technologies AG
- Reinhard Ploss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device
- Patent number 11,139,369
- Issue date Oct 5, 2021
- Infineon Technologies AG
- Reinhard Ploss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device
- Patent number 10,340,335
- Issue date Jul 2, 2019
- Infineon Technologies AG
- Reinhard Ploss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a defined oxygen concentration
- Patent number 10,014,400
- Issue date Jul 3, 2018
- Infineon Technologies AG
- Helmut Oefner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device having a trench at l...
- Patent number 9,842,904
- Issue date Dec 12, 2017
- Infineon Technologies Austria AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor wafer, and semiconductor d...
- Patent number 9,728,395
- Issue date Aug 8, 2017
- Infineon Technologies AG
- Helmut Oefner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a trench at least partially filled w...
- Patent number 9,570,566
- Issue date Feb 14, 2017
- Infineon Technologies Austria AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for postdoping a semiconductor wafer
- Patent number 9,559,020
- Issue date Jan 31, 2017
- Infineon Technologies AG
- Reinhard Ploss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device with a continuous si...
- Patent number 9,384,960
- Issue date Jul 5, 2016
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for postdoping a semiconductor wafer
- Patent number 9,245,811
- Issue date Jan 26, 2016
- Infineon Technologies AG
- Reinhard Ploss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a trench in a semiconductor substrat...
- Patent number 9,219,144
- Issue date Dec 22, 2015
- Infineon Technologies Austria AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 9,142,401
- Issue date Sep 22, 2015
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a silicate glass structure and metho...
- Patent number 8,785,997
- Issue date Jul 22, 2014
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Panel, semiconductor device and method for the production thereof
- Patent number 8,164,173
- Issue date Apr 24, 2012
- Infineon Technologies AG
- Adolf Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Panel, semiconductor device and method for the production thereof
- Patent number 7,772,693
- Issue date Aug 10, 2010
- Infineon Technologies AG
- Adolf Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal semiconductor wafer for high-voltage semiconductor compon...
- Patent number 6,646,304
- Issue date Nov 11, 2003
- Infineon Technologies AG
- Jenö Tihanyi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR DEVICE
- Publication number 20210376068
- Publication date Dec 2, 2021
- INFINEON TECHNOLOGIES AG
- Reinhard PLOSS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including Trench Gate Structure and Manufactur...
- Publication number 20200098868
- Publication date Mar 26, 2020
- Reinhard Ploss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR DEVICE
- Publication number 20190319091
- Publication date Oct 17, 2019
- INFINEON TECHNOLOGIES AG
- Reinhard PLOSS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having a Defined Oxygen Concentration
- Publication number 20170316929
- Publication date Nov 2, 2017
- INFINEON TECHNOLOGIES AG
- Helmut Oefner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR DEVICE
- Publication number 20170186838
- Publication date Jun 29, 2017
- INFINEON TECHNOLOGIES AG
- Reinhard PLOSS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Semiconductor Device Having a Trench at L...
- Publication number 20170148887
- Publication date May 25, 2017
- Infineon Technologies Austria AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Semiconductor Device with a Polysilicon-F...
- Publication number 20160300920
- Publication date Oct 13, 2016
- INFINEON TECHNOLOGIES AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing a Semiconductor Wafer, and Semiconductor D...
- Publication number 20160104622
- Publication date Apr 14, 2016
- INFINEON TECHNOLOGIES AG
- Helmut Oefner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR POSTDOPING A SEMICONDUCTOR WAFER
- Publication number 20160099186
- Publication date Apr 7, 2016
- INFINEON TECHNOLOGIES AG
- Reinhard Ploss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including a Trench at Least Partially Filled w...
- Publication number 20160035842
- Publication date Feb 4, 2016
- Infineon Technologies Austria AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Semiconductor Device with a Continuous Si...
- Publication number 20150348776
- Publication date Dec 3, 2015
- INFINEON TECHNOLOGIES AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR POSTDOPING A SEMICONDUCTOR WAFER
- Publication number 20150050754
- Publication date Feb 19, 2015
- Infineon Technonogies AG
- Reinhard Ploss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20140291816
- Publication date Oct 2, 2014
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A TRENCH IN A SEMICONDUCTOR SUBSTRAT...
- Publication number 20140042593
- Publication date Feb 13, 2014
- Infineon Technologies Austria AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including A Silicate Glass Structure and Metho...
- Publication number 20130307127
- Publication date Nov 21, 2013
- Infineon Technologies Austria AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Panel, Semiconductor Device and Method for the Production Thereof
- Publication number 20100264523
- Publication date Oct 21, 2010
- Infineon Technologies AG
- Adolf Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Panel, semiconductor device and method for the production thereof
- Publication number 20080191359
- Publication date Aug 14, 2008
- Adolf Koller
- H01 - BASIC ELECTRIC ELEMENTS

Reinhard Ploss

Person

Patents Grantslast 30 patents

Method of forming a semiconductor device

Semiconductor device including trench gate structure and manufactur...

Method of forming a semiconductor device

Method of forming a semiconductor device

Semiconductor device having a defined oxygen concentration

Method of manufacturing a semiconductor device having a trench at l...

Method for manufacturing a semiconductor wafer, and semiconductor d...

Semiconductor device including a trench at least partially filled w...

Method for postdoping a semiconductor wafer

Method of manufacturing a semiconductor device with a continuous si...

Method for postdoping a semiconductor wafer

Semiconductor device including a trench in a semiconductor substrat...

Semiconductor device and method of manufacturing a semiconductor de...

Semiconductor device including a silicate glass structure and metho...

Panel, semiconductor device and method for the production thereof

Panel, semiconductor device and method for the production thereof

Universal semiconductor wafer for high-voltage semiconductor compon...

Patents Applicationslast 30 patents

METHOD OF FORMING A SEMICONDUCTOR DEVICE

Semiconductor Device Including Trench Gate Structure and Manufactur...

METHOD OF FORMING A SEMICONDUCTOR DEVICE

Semiconductor Device Having a Defined Oxygen Concentration

METHOD OF FORMING A SEMICONDUCTOR DEVICE

Method of Manufacturing a Semiconductor Device Having a Trench at L...

Method of Manufacturing a Semiconductor Device with a Polysilicon-F...

Method for Manufacturing a Semiconductor Wafer, and Semiconductor D...

METHOD FOR POSTDOPING A SEMICONDUCTOR WAFER

Semiconductor Device Including a Trench at Least Partially Filled w...

Method of Manufacturing a Semiconductor Device with a Continuous Si...

METHOD FOR POSTDOPING A SEMICONDUCTOR WAFER

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE INCLUDING A TRENCH IN A SEMICONDUCTOR SUBSTRAT...

Semiconductor Device Including A Silicate Glass Structure and Metho...

Panel, Semiconductor Device and Method for the Production Thereof

Panel, semiconductor device and method for the production thereof