Reinhard Pufall

Person

Munchen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Metallic interconnect, a method of manufacturing a metallic interco...
- Patent number 10,734,352
- Issue date Aug 4, 2020
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with interlocked connection
- Patent number 10,090,216
- Issue date Oct 2, 2018
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with interlocked connection
- Patent number 9,627,305
- Issue date Apr 18, 2017
- Infineon Technologies AG
- Georg Meyer-Berg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device comprising a ductile layer and method of making the same
- Patent number 9,576,867
- Issue date Feb 21, 2017
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device comprising a ductile layer and method of making the same
- Patent number 9,331,019
- Issue date May 3, 2016
- Infineon Technologies AG
- Georg Meyer-Berg
- G01 - MEASURING TESTING
Information Patent Grant
Method for producing a mask set for lithography including at least...
- Patent number 7,183,022
- Issue date Feb 27, 2007
- Infineon Technolgies AG
- Molela Moukara
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for determining the construction of a mask for the micropatt...
- Patent number 6,993,455
- Issue date Jan 31, 2006
- Infineon Technologies AG
- Roderick Koehle
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP HAVING A CRACK STOP STRUCTURE
- Publication number 20220270985
- Publication date Aug 25, 2022
- Sergey Ananiev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallic Interconnect, a Method of Manufacturing a Metallic Interco...
- Publication number 20190103378
- Publication date Apr 4, 2019
- INFINEON TECHNOLOGIES AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package With Interlocked Connection
- Publication number 20170170082
- Publication date Jun 15, 2017
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Comprising a Ductile Layer and Method of Making the Same
- Publication number 20160218044
- Publication date Jul 28, 2016
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution layer and method of forming a redistribution layer
- Publication number 20150115442
- Publication date Apr 30, 2015
- INFINEON TECHNOLOGIES AG
- Georg MEYER-BERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE WITH INTERLOCKED CONNECTION
- Publication number 20150014845
- Publication date Jan 15, 2015
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Device Comprising a Ductile Layer and Method of Making the Same
- Publication number 20140145333
- Publication date May 29, 2014
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- G01 - MEASURING TESTING
Information Patent Application
Method for determining the construction of a mask for the micropatt...
- Publication number 20050148195
- Publication date Jul 7, 2005
- Infineon Technologies AG
- Roderick Koehle
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Method for producing a mask set for lithography including at least...
- Publication number 20030232255
- Publication date Dec 18, 2003
- Molela Moukara
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Reinhard Pufall

Person

Patents Grantslast 30 patents

Metallic interconnect, a method of manufacturing a metallic interco...

Semiconductor package with interlocked connection

Semiconductor module with interlocked connection

Device comprising a ductile layer and method of making the same

Device comprising a ductile layer and method of making the same

Method for producing a mask set for lithography including at least...

Method for determining the construction of a mask for the micropatt...

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP HAVING A CRACK STOP STRUCTURE

Metallic Interconnect, a Method of Manufacturing a Metallic Interco...

Semiconductor Package With Interlocked Connection

Device Comprising a Ductile Layer and Method of Making the Same

Redistribution layer and method of forming a redistribution layer

SEMICONDUCTOR MODULE WITH INTERLOCKED CONNECTION

Device Comprising a Ductile Layer and Method of Making the Same

Method for determining the construction of a mask for the micropatt...

Method for producing a mask set for lithography including at least...