Remi Brechignac

Person

Grenoble, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Perforated electronic package and method of fabrication
- Patent number 9,196,590
- Issue date Nov 24, 2015
- STMicroelectronics (Grenoble 2) SAS
- Francis Steffen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical electronic package having a blind cavity for covering an op...
- Patent number 9,136,292
- Issue date Sep 15, 2015
- STMicroelectronics (Grenoble 2) SAS
- Romain Coffy
- G01 - MEASURING TESTING
Information Patent Grant
Electronic system comprising stacked electronic devices comprising...
- Patent number 9,076,749
- Issue date Jul 7, 2015
- STMicroelectronics (Grenoble 2) SAS
- Romain Coffy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual side package on package
- Patent number 9,006,904
- Issue date Apr 14, 2015
- STMicroelectronics (Grenoble 2) SAS
- Dominique Marais
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having stacked components
- Patent number 8,482,116
- Issue date Jul 9, 2013
- STMicroelectronics (Grenoble 2) SAS
- Romain Coffy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging unit with sliding cage
- Patent number 7,326,968
- Issue date Feb 5, 2008
- STMicroelectronics S.A.
- Rémi Brechignac
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor package with incorporated lens and shielding
- Patent number 7,327,005
- Issue date Feb 5, 2008
- STMicroelectronics S.A.
- Remi Brechignac
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for fixing a lens of an optic group with respect to an optic...
- Patent number 7,061,697
- Issue date Jun 13, 2006
- STMicroelectronics S.A.
- Pierangelo Magni
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Device for mounting a semiconductor package on a support plate via...
- Patent number 7,012,331
- Issue date Mar 14, 2006
- STMicroelectronics S.A.
- Rémi Brechignac
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical semiconductor housing and method for making same
- Patent number 6,969,898
- Issue date Nov 29, 2005
- STMicroelectronics S.A.
- Juan Exposito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor package and process for fabricating the same
- Patent number 6,893,169
- Issue date May 17, 2005
- STMicroelectronics S.A.
- Juan Exposito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded housing for optical semiconductor component
- Patent number 6,870,238
- Issue date Mar 22, 2005
- STMicroelectronics S.A.
- Juan Exposito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor housing and method for making same
- Patent number 6,713,876
- Issue date Mar 30, 2004
- STMicroelectronics S.A.
- Julien Vittu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold for flashless injection molding to encapsulate an integrated c...
- Patent number 6,696,006
- Issue date Feb 24, 2004
- STMicroelectronics S.A.
- Jonathan Abela
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Process for packaging a chip with sensors and semiconductor package...
- Patent number 6,597,020
- Issue date Jul 22, 2003
- STMicroelectronics S.A.
- Remi Brechignac
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Smart card and process for manufacturing the same
- Patent number 6,374,486
- Issue date Apr 23, 2002
- STMicroelectronics S.A.
- Rémi Brechignac
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 6,312,975
- Issue date Nov 6, 2001
- STMicroelectronics S.A.
- Rémi Brechignac
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PERFORATED ELECTRONIC PACKAGE AND METHOD OF FABRICATION
- Publication number 20150262941
- Publication date Sep 17, 2015
- STMicroelectronics (Grenoble 2) SAS
- Francis Steffen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM COMPRISING STACKED ELECTRONIC DEVICES COMPRISING...
- Publication number 20150102500
- Publication date Apr 16, 2015
- STMicroelectronics (Grenoble 2) SAS
- Romain Coffy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDE PACKAGE ON PACKAGE
- Publication number 20130214425
- Publication date Aug 22, 2013
- STMicroelectronics (Grenoble 2) SAS
- Dominique Marais
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL ELECTRONIC PACKAGE
- Publication number 20130012276
- Publication date Jan 10, 2013
- STMicroelectronics (Grenoble 2) SAS
- Romain Coffy
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE HAVING STACKED COMPONENTS
- Publication number 20110248397
- Publication date Oct 13, 2011
- STMICROELECTRONICS S.R.L.
- Romain Coffy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor packaging unit with sliding cage
- Publication number 20070228558
- Publication date Oct 4, 2007
- STMicroelectronics S.A.
- Remi Brechignac
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device for mounting a semiconductor package on a support plate via...
- Publication number 20060012002
- Publication date Jan 19, 2006
- Remi Brechignac
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor component, wafer and package having an optical sensor
- Publication number 20050103987
- Publication date May 19, 2005
- STMicroelectronics S.A.
- Remi Brechignac
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fixing a lens of an optic group with respect to an optic...
- Publication number 20050046973
- Publication date Mar 3, 2005
- STMicroelectronics S.A.
- Pierangelo Magni
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Optical semiconductor package with incorporated lens and shielding
- Publication number 20040217454
- Publication date Nov 4, 2004
- Remi Brechignac
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Shielded housing for optical semiconductor component
- Publication number 20040212055
- Publication date Oct 28, 2004
- Juan Exposito
- G02 - OPTICS
Information Patent Application
Device for mounting a semiconductor package on a support plate via...
- Publication number 20030214028
- Publication date Nov 20, 2003
- Remi Brechignac
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mold for flashless injection molding to encapsulate an integrated c...
- Publication number 20020051832
- Publication date May 2, 2002
- Jonathan Abela
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Remi Brechignac

Person

Patents Grantslast 30 patents

Perforated electronic package and method of fabrication

Optical electronic package having a blind cavity for covering an op...

Electronic system comprising stacked electronic devices comprising...

Dual side package on package

Semiconductor device having stacked components

Semiconductor packaging unit with sliding cage

Optical semiconductor package with incorporated lens and shielding

Method for fixing a lens of an optic group with respect to an optic...

Device for mounting a semiconductor package on a support plate via...

Optical semiconductor housing and method for making same

Optical semiconductor package and process for fabricating the same

Shielded housing for optical semiconductor component

Optical semiconductor housing and method for making same

Mold for flashless injection molding to encapsulate an integrated c...

Process for packaging a chip with sensors and semiconductor package...

Smart card and process for manufacturing the same

Semiconductor package and method of manufacturing the same

Patents Applicationslast 30 patents

PERFORATED ELECTRONIC PACKAGE AND METHOD OF FABRICATION

ELECTRONIC SYSTEM COMPRISING STACKED ELECTRONIC DEVICES COMPRISING...

DUAL SIDE PACKAGE ON PACKAGE

OPTICAL ELECTRONIC PACKAGE

SEMICONDUCTOR DEVICE HAVING STACKED COMPONENTS

Semiconductor packaging unit with sliding cage

Device for mounting a semiconductor package on a support plate via...

Semiconductor component, wafer and package having an optical sensor

Method for fixing a lens of an optic group with respect to an optic...

Optical semiconductor package with incorporated lens and shielding

Shielded housing for optical semiconductor component

Device for mounting a semiconductor package on a support plate via...

Mold for flashless injection molding to encapsulate an integrated c...