Remy J. Chelini

Person

Crystal Lake, IL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Channel method for forming a capacitor
- Patent number 7,833,292
- Issue date Nov 16, 2010
- Kemet Electronics Corporation
- Keith R. Brenneman
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Thin solid electrolytic capacitor embeddable in a substrate
- Patent number 7,745,281
- Issue date Jun 29, 2010
- Kemet Electronics Corporation
- John D. Prymak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming multi-layer embedded capacitors on a printed cir...
- Patent number 7,444,727
- Issue date Nov 4, 2008
- Motorola, Inc.
- Jovica Savic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded capacitors and methods for their fabrication and connection
- Patent number 7,361,568
- Issue date Apr 22, 2008
- Motorola, Inc.
- Gregory J. Dunn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Peelable circuit board foil
- Patent number 7,241,510
- Issue date Jul 10, 2007
- Motorola, Inc.
- Gregory J. Dunn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Corrosion-resistant copper bond pad and integrated device
- Patent number 7,078,796
- Issue date Jul 18, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Gregory J. Dunn
- G01 - MEASURING TESTING
Information Patent Grant
Polymer thick film resistor, layout cell, and method
- Patent number 7,038,571
- Issue date May 2, 2006
- Motorola, Inc.
- Gregory J. Dunn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Peelable circuit board foil
- Patent number 6,872,468
- Issue date Mar 29, 2005
- Motorola, Inc.
- Timothy B. Dean
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CHANNEL METHOD FOR FORMING A CAPACITOR
- Publication number 20100177460
- Publication date Jul 15, 2010
- Keith R. Brenneman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN SOLID ELECTROLYTIC CAPACITOR EMBEDDABLE IN A SUBSTRATE
- Publication number 20080216296
- Publication date Sep 11, 2008
- John D. Prymak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Textiles Having a High Impedance Surface
- Publication number 20080160851
- Publication date Jul 3, 2008
- MOTOROLA, INC.
- Gregory J. Dunn
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR FORMING EMBEDDED CAPACITORS ON A PRINTED CURCUIT BOARD A...
- Publication number 20070209178
- Publication date Sep 13, 2007
- MOTOROLA, INC.
- Jovica Savic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Embedded capacitors and methods for their fabrication and connection
- Publication number 20070139864
- Publication date Jun 21, 2007
- Gregory J. Dunn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Peelable circuit board foil
- Publication number 20060269728
- Publication date Nov 30, 2006
- Gregory J. Dunn
- B32 - LAYERED PRODUCTS
Information Patent Application
Printed circuit dielectric foil and embedded capacitors
- Publication number 20050135074
- Publication date Jun 23, 2005
- Gregory J. Dunn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Corrosion-resistant bond pad and integrated device
- Publication number 20050104207
- Publication date May 19, 2005
- Timothy B. Dean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PEELABLE CIRCUIT BOARD FOIL
- Publication number 20050079375
- Publication date Apr 14, 2005
- Timothy B. Dean
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Corrosion-resistant bond pad and integrated device
- Publication number 20050001316
- Publication date Jan 6, 2005
- MOTOROLA, INC.
- Timothy B. Dean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Corrosion-resistant copper bond pad and integrated device
- Publication number 20050001324
- Publication date Jan 6, 2005
- MOTOROLA, INC.
- Gregory J. Dunn
- G01 - MEASURING TESTING
Information Patent Application
Polymer thick film resistor, layout cell, and method
- Publication number 20040239474
- Publication date Dec 2, 2004
- Gregory J. Dunn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Remy J. Chelini

Person

Patents Grantslast 30 patents

Channel method for forming a capacitor

Thin solid electrolytic capacitor embeddable in a substrate

Method for forming multi-layer embedded capacitors on a printed cir...

Embedded capacitors and methods for their fabrication and connection

Peelable circuit board foil

Corrosion-resistant copper bond pad and integrated device

Polymer thick film resistor, layout cell, and method

Peelable circuit board foil

Patents Applicationslast 30 patents

CHANNEL METHOD FOR FORMING A CAPACITOR

THIN SOLID ELECTROLYTIC CAPACITOR EMBEDDABLE IN A SUBSTRATE

Textiles Having a High Impedance Surface

METHOD FOR FORMING EMBEDDED CAPACITORS ON A PRINTED CURCUIT BOARD A...

Embedded capacitors and methods for their fabrication and connection

Peelable circuit board foil

Printed circuit dielectric foil and embedded capacitors

Corrosion-resistant bond pad and integrated device

PEELABLE CIRCUIT BOARD FOIL

Corrosion-resistant bond pad and integrated device

Corrosion-resistant copper bond pad and integrated device

Polymer thick film resistor, layout cell, and method