Ren-Dou LEE

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for wafer bonding
- Patent number 12,234,145
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Wei Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-layered windows for use in chemical-mechanical planarization...
- Patent number 12,138,735
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Chung Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Methods for wafer bonding
- Patent number 11,851,325
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Wei Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chemical mechanical planarization membrane
- Patent number 11,850,702
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ping Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Shiftless wafer blades
- Patent number 11,688,620
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chih Chen
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Shiftless wafer blades
- Patent number 11,380,569
- Issue date Jul 5, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chih Chen
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Chemical mechanical planarization membrane
- Patent number 11,267,099
- Issue date Mar 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ping Chen
- B24 - GRINDING POLISHING
Information Patent Grant
MEMS package with roughend interface
- Patent number 11,192,778
- Issue date Dec 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jui Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-layer sealing film for high seal yield
- Patent number 11,034,578
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chien Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Rough anti-stiction layer for MEMS device
- Patent number 10,759,654
- Issue date Sep 1, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jui Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package with roughend interface
- Patent number 10,710,872
- Issue date Jul 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jui Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Shiftless wafer blades
- Patent number 10,699,931
- Issue date Jun 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer sealing film for high seal yield
- Patent number 10,676,343
- Issue date Jun 9, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chien Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-layer sealing film for high seal yield
- Patent number 10,322,928
- Issue date Jun 18, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chien Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Ion generator and method for using the same
- Patent number 10,319,557
- Issue date Jun 11, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-Kun Kao
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Rough anti-stiction layer for MEMS device
- Patent number 10,173,886
- Issue date Jan 8, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jui Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Rough anti-stiction layer for MEMS device
- Patent number 9,884,755
- Issue date Feb 6, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jui Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS structure, cap substrate and method of fabricating the same
- Patent number 9,481,567
- Issue date Nov 1, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd
- I-Shi Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package structure, alignment structure, and alignment...
- Patent number 9,230,918
- Issue date Jan 5, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Ying Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sputtering target with reverse erosion profile surface and sputteri...
- Patent number 9,127,356
- Issue date Sep 8, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Liang Chueh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Pin-out designation method for package-board codesign
- Patent number 8,302,067
- Issue date Oct 30, 2012
- National Chiao Tung University
- Ren-Jie Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon nitride furnace tube low temperature cycle purge for attenu...
- Patent number 6,531,415
- Issue date Mar 11, 2003
- Taiwan Semiconductor Manufacturing Company
- Wan-Cheng Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
MULTI-LAYERED WINDOWS FOR USE IN CHEMICAL-MECHANICAL PLANARIZATION...
- Publication number 20240383095
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Chung Chen
- B24 - GRINDING POLISHING
Information Patent Application
METHODS FOR WAFER BONDING
- Publication number 20240190701
- Publication date Jun 13, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Chien-Wei CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF CHEMICAL MECHANICAL POLISH OPERATION AND CHEMICAL MECHANI...
- Publication number 20230256561
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUNHUNG CHEN
- B24 - GRINDING POLISHING
Information Patent Application
SHIFTLESS WAFER BLADES
- Publication number 20220392796
- Publication date Dec 8, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Chien-Chih Chen
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
CHEMICAL MECHANICAL PLANARIZATION MEMBRANE
- Publication number 20220184773
- Publication date Jun 16, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ping Chen
- B24 - GRINDING POLISHING
Information Patent Application
SHIFTLESS WAFER BLADES
- Publication number 20200388520
- Publication date Dec 10, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chien-Chih Chen
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
MEMS PACKAGE WITH ROUGHEND INTERFACE
- Publication number 20200339413
- Publication date Oct 29, 2020
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Yu-Jui Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTI-LAYER SEALING FILM FOR HIGH SEAL YIELD
- Publication number 20200270121
- Publication date Aug 27, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Chien Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR WAFER BONDING
- Publication number 20200172393
- Publication date Jun 4, 2020
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Chien-Wei CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTI-LAYERED WINDOWS FOR USE IN CHEMICAL-MECHANICAL PLANARIZATION...
- Publication number 20200164482
- Publication date May 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Chung Chen
- B24 - GRINDING POLISHING
Information Patent Application
ROUGH ANTI-STICTION LAYER FOR MEMS DEVICE
- Publication number 20190119099
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Jui Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHEMICAL MECHANICAL PLANARIZATION MEMBRANE
- Publication number 20190091829
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Cheng-Ping Chen
- B24 - GRINDING POLISHING
Information Patent Application
MULTI-LAYER SEALING FILM FOR HIGH SEAL YIELD
- Publication number 20190092622
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Chien Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SHIFTLESS WAFER BLADES
- Publication number 20190074205
- Publication date Mar 7, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Chien-Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION GENERATOR AND METHOD FOR USING THE SAME
- Publication number 20190066967
- Publication date Feb 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-Kun KAO
- C01 - INORGANIC CHEMISTRY
Information Patent Application
ROUGH ANTI-STICTION LAYER FOR MEMS DEVICE
- Publication number 20180179047
- Publication date Jun 28, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Jui Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PACKAGE WITH ROUGHEND INTERFACE
- Publication number 20180162720
- Publication date Jun 14, 2018
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Yu-Jui Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTI-LAYER SEALING FILM FOR HIGH SEAL YIELD
- Publication number 20180148320
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Chien Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ROUGH ANTI-STICTION LAYER FOR MEMS DEVICE
- Publication number 20170210612
- Publication date Jul 27, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Jui Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE, ALIGNMENT STRUCTURE, AND ALIGNMENT...
- Publication number 20160005694
- Publication date Jan 7, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Ying CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS STRUCTURE, CAP SUBSTRATE AND METHOD OF FABRICATING THE SAME
- Publication number 20150360938
- Publication date Dec 17, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- I-Shi Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SPUTTERING TARGET WITH REVERSE EROSION PROFILE SURFACE AND SPUTTERI...
- Publication number 20130043120
- Publication date Feb 21, 2013
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Liang CHUEH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Pin-out Designation Method for Package-Board Codesign
- Publication number 20110093828
- Publication date Apr 21, 2011
- Ren-Jie Lee
- H01 - BASIC ELECTRIC ELEMENTS

Ren-Dou LEE

Person

Patents Grantslast 30 patents

Methods for wafer bonding

Multi-layered windows for use in chemical-mechanical planarization...

Methods for wafer bonding

Chemical mechanical planarization membrane

Shiftless wafer blades

Shiftless wafer blades

Chemical mechanical planarization membrane

MEMS package with roughend interface

Multi-layer sealing film for high seal yield

Rough anti-stiction layer for MEMS device

MEMS package with roughend interface

Shiftless wafer blades

Multi-layer sealing film for high seal yield

Multi-layer sealing film for high seal yield

Ion generator and method for using the same

Rough anti-stiction layer for MEMS device

Rough anti-stiction layer for MEMS device

MEMS structure, cap substrate and method of fabricating the same

Semiconductor package structure, alignment structure, and alignment...

Sputtering target with reverse erosion profile surface and sputteri...

Pin-out designation method for package-board codesign

Silicon nitride furnace tube low temperature cycle purge for attenu...

Patents Applicationslast 30 patents

MULTI-LAYERED WINDOWS FOR USE IN CHEMICAL-MECHANICAL PLANARIZATION...

METHODS FOR WAFER BONDING

METHOD OF CHEMICAL MECHANICAL POLISH OPERATION AND CHEMICAL MECHANI...

SHIFTLESS WAFER BLADES

CHEMICAL MECHANICAL PLANARIZATION MEMBRANE

SHIFTLESS WAFER BLADES

MEMS PACKAGE WITH ROUGHEND INTERFACE

MULTI-LAYER SEALING FILM FOR HIGH SEAL YIELD

METHODS FOR WAFER BONDING

MULTI-LAYERED WINDOWS FOR USE IN CHEMICAL-MECHANICAL PLANARIZATION...

ROUGH ANTI-STICTION LAYER FOR MEMS DEVICE

CHEMICAL MECHANICAL PLANARIZATION MEMBRANE

MULTI-LAYER SEALING FILM FOR HIGH SEAL YIELD

SHIFTLESS WAFER BLADES

ION GENERATOR AND METHOD FOR USING THE SAME

ROUGH ANTI-STICTION LAYER FOR MEMS DEVICE

MEMS PACKAGE WITH ROUGHEND INTERFACE

MULTI-LAYER SEALING FILM FOR HIGH SEAL YIELD

ROUGH ANTI-STICTION LAYER FOR MEMS DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE, ALIGNMENT STRUCTURE, AND ALIGNMENT...

MEMS STRUCTURE, CAP SUBSTRATE AND METHOD OF FABRICATING THE SAME

SPUTTERING TARGET WITH REVERSE EROSION PROFILE SURFACE AND SPUTTERI...

Pin-out Designation Method for Package-Board Codesign