Ren-Wei Xiao

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Shetou Township, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming semiconductor structures including metal insulato...
- Patent number 10,050,103
- Issue date Aug 14, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming metal pad structures over TSVS to reduce shortin...
- Patent number 9,984,971
- Issue date May 29, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Chuan Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures including metal insulator metal capacitor
- Patent number 9,666,660
- Issue date May 30, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fang-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pad structure over TSV to reduce shorting of upper metal layer
- Patent number 9,530,690
- Issue date Dec 27, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Chuan Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pad structure over TSV to reduce shorting of upper metal layer
- Patent number 9,177,914
- Issue date Nov 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Chuan Tseng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING SEMICONDUCTOR STRUCTURES
- Publication number 20170263694
- Publication date Sep 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fang-Ting KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Metal Pad Structures Over TSVS to Reduce Shortin...
- Publication number 20170179030
- Publication date Jun 22, 2017
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.,
- Chung-Chuan Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Pad Structure Over TSV to Reduce Shorting of Upper Metal Layer
- Publication number 20160056078
- Publication date Feb 25, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Chuan Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20150048483
- Publication date Feb 19, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fang-Ting KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PAD STRUCTURE OVER TSV TO REDUCE SHORTING OF UPPER METAL LAYER
- Publication number 20140131841
- Publication date May 15, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Chuan Tseng
- H01 - BASIC ELECTRIC ELEMENTS