Rena Kojima

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Patents Grantslast 30 patents

Information Patent Grant
Thermosetting sheet, dicing die bonding film, and semiconductor app...
- Patent number 11,791,302
- Issue date Oct 17, 2023
- Nitto Denko Corporation
- Rena Kojima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
THERMOSETTING SHEET AND DICING DIE BONDING FILM
- Publication number 20220325091
- Publication date Oct 13, 2022
- Nitto Denko Corporation
- Rena Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSETTING SHEET, DICING DIE BONDING FILM, AND SEMICONDUCTOR APP...
- Publication number 20220130790
- Publication date Apr 28, 2022
- Nitto Denko Corporation
- Rena Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSETTING SHEET AND DICING DIE BONDING FILM
- Publication number 20210403784
- Publication date Dec 30, 2021
- Nitto Denko Corporation
- Rena Kojima
- H01 - BASIC ELECTRIC ELEMENTS