Renato Poinelli

Person

Casatenovo (Lecco), IT

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor device packages
- Patent number 7,084,003
- Issue date Aug 1, 2006
- STMicroelectronics S.r.l.
- Mauro Mazzola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset edges mold for plastic packaging of integrated semiconductor...
- Patent number 6,592,352
- Issue date Jul 15, 2003
- STMicroelectronics S.r.l.
- Renato Poinelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and mold for manufacturing a plastic package for an electron...
- Patent number 5,953,593
- Issue date Sep 14, 1999
- STMicroelectronics S.r.l.
- Stefano Ferri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic body surface-mounting semiconductor power device having dim...
- Patent number 5,852,324
- Issue date Dec 22, 1998
- SGS Thomson Microelectronics S.r.l.
- Renato Poinelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-dissipating and supporting structure for a plastic package wit...
- Patent number 5,793,613
- Issue date Aug 11, 1998
- SGS-Thomson Microelectronics S.r.1.
- Renato Poinelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe for supporting integrated semiconductor devices
- Patent number 5,617,295
- Issue date Apr 1, 1997
- SGS-Thomson Microelectronics, S.R.L.
- Renato Poinelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automatic handling of different magazines by standardized pick-ups...
- Patent number 5,163,802
- Issue date Nov 17, 1992
- SGS-Thomson Micoelectronics s.r.l.
- Renato Poinelli
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for manufacturing semiconductor device packages
- Publication number 20030134452
- Publication date Jul 17, 2003
- STMicroelectronics S.r.l.
- Mauro Mazzola
- H01 - BASIC ELECTRIC ELEMENTS

Renato Poinelli

Person

Patents Grantslast 30 patents

Method for manufacturing semiconductor device packages

Offset edges mold for plastic packaging of integrated semiconductor...

Method and mold for manufacturing a plastic package for an electron...

Plastic body surface-mounting semiconductor power device having dim...

Heat-dissipating and supporting structure for a plastic package wit...

Leadframe for supporting integrated semiconductor devices

Automatic handling of different magazines by standardized pick-ups...

Patents Applicationslast 30 patents

Method for manufacturing semiconductor device packages