Renee L. Weisman

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Additives for grain fragmentation in Pb-free Sn-based solder
- Patent number 8,910,853
- Issue date Dec 16, 2014
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Additives for grain fragmentation in Pb-free Sn-based solder
- Patent number 8,493,746
- Issue date Jul 23, 2013
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optimization of metallurgical properties of a solder joint
- Patent number 8,197,612
- Issue date Jun 12, 2012
- International Business Machines Corporation
- James A Busby
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for providing uniaxial load distribution for laminate lay...
- Patent number 8,156,990
- Issue date Apr 17, 2012
- International Business Machines Corporation
- Jay A. Bunt
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for providing uniaxial load distribution for laminate layers...
- Patent number 7,947,143
- Issue date May 24, 2011
- International Business Machines Corporation
- Jay A. Bunt
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus for providing uniaxial load distribution for laminate lay...
- Patent number 7,836,935
- Issue date Nov 23, 2010
- International Business Machines Corporation
- Jay A. Bunt
- B32 - LAYERED PRODUCTS
Information Patent Grant
Fast firing flattening apparatus for sintered multilayer ceramic el...
- Patent number 7,258,537
- Issue date Aug 21, 2007
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fast firing flattening method and apparatus for sintered multilayer...
- Patent number 6,900,073
- Issue date May 31, 2005
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding for semiconductor chip carriers
- Patent number 6,740,959
- Issue date May 25, 2004
- International Business Machines Corporation
- David James Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level web structure in use for thin sheet processing
- Patent number 6,562,169
- Issue date May 13, 2003
- International Business Machines Corporation
- Govindarajan Natarajan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single mask screening process
- Patent number 6,238,741
- Issue date May 29, 2001
- International Business Machines Corporation
- James M. Blazick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of reworking pin grid array chip carriers
- Patent number 6,203,690
- Issue date Mar 20, 2001
- International Business Machines Corporation
- Paul F. Findeis
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method to resize sintered ceramic substrates
- Patent number 6,086,815
- Issue date Jul 11, 2000
- International Business Machines Corporation
- James M. Garland
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Screening apparatus including a dual reservoir dispensing assembly
- Patent number 6,062,135
- Issue date May 16, 2000
- International Business Machines Corporation
- Alvin W. Buechele
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Re-work method for removing extraneous metal from cermic substrates
- Patent number 4,504,322
- Issue date Mar 12, 1985
- International Business Machines Corporation
- Avinash S. Adwalpalker
- B08 - CLEANING

Patents Applicationslast 30 patents

Information Patent Application
ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER
- Publication number 20130284495
- Publication date Oct 31, 2013
- Charles L. Arvin
- B82 - NANO-TECHNOLOGY
Information Patent Application
ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER
- Publication number 20100200271
- Publication date Aug 12, 2010
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTIMIZATION OF METALLURGICAL PROPERTIES OF A SOLDER JOINT
- Publication number 20090266447
- Publication date Oct 29, 2009
- International Business Machines Corporation
- JAMES A. BUSBY
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PROVIDING UNIAXIAL LOAD DISTRIBUTION FOR LAMINATE LAYERS...
- Publication number 20080190545
- Publication date Aug 14, 2008
- International Business Machines Corporation
- Jay A. Bunt
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUS FOR PROVIDING UNIAXIAL LOAD DISTRIBUTION FOR LAMINATE LAY...
- Publication number 20080190565
- Publication date Aug 14, 2008
- International Business Machines Corporation
- Jay A. Bunt
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUS FOR PROVIDING UNIAXIAL LOAD DISTRIBUTION FOR LAMINATE LAY...
- Publication number 20080190566
- Publication date Aug 14, 2008
- International Business Machines Corporation
- Jay A. Bunt
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD AND APPARATUS FOR PROVIDING UNIAXIAL LOAD DISTRIBUTION FOR L...
- Publication number 20070113950
- Publication date May 24, 2007
- International Business Machines Corporation
- Jay A. Bunt
- B32 - LAYERED PRODUCTS
Information Patent Application
Fast firing flattening method and apparatus for sintered multilayer...
- Publication number 20050054200
- Publication date Mar 10, 2005
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAST FIRING FLATTENING METHOD AND APPARATUS FOR SINTERED MULTILAYER...
- Publication number 20040203184
- Publication date Oct 14, 2004
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI shielding for semiconductor chip carriers
- Publication number 20030025180
- Publication date Feb 6, 2003
- International Business Machines Corporation
- David James Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-level web structure in use for thin sheet processing
- Publication number 20020092600
- Publication date Jul 18, 2002
- International Business Machines Corporation
- Govindarajan Natarajan
- B32 - LAYERED PRODUCTS

Renee L. Weisman

Person

Patents Grantslast 30 patents

Additives for grain fragmentation in Pb-free Sn-based solder

Additives for grain fragmentation in Pb-free Sn-based solder

Optimization of metallurgical properties of a solder joint

Apparatus for providing uniaxial load distribution for laminate lay...

Method for providing uniaxial load distribution for laminate layers...

Apparatus for providing uniaxial load distribution for laminate lay...

Fast firing flattening apparatus for sintered multilayer ceramic el...

Fast firing flattening method and apparatus for sintered multilayer...

EMI shielding for semiconductor chip carriers

Multi-level web structure in use for thin sheet processing

Single mask screening process

Process of reworking pin grid array chip carriers

Method to resize sintered ceramic substrates

Screening apparatus including a dual reservoir dispensing assembly

Re-work method for removing extraneous metal from cermic substrates

Patents Applicationslast 30 patents

ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER

ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER

OPTIMIZATION OF METALLURGICAL PROPERTIES OF A SOLDER JOINT

METHOD FOR PROVIDING UNIAXIAL LOAD DISTRIBUTION FOR LAMINATE LAYERS...

APPARATUS FOR PROVIDING UNIAXIAL LOAD DISTRIBUTION FOR LAMINATE LAY...

APPARATUS FOR PROVIDING UNIAXIAL LOAD DISTRIBUTION FOR LAMINATE LAY...

METHOD AND APPARATUS FOR PROVIDING UNIAXIAL LOAD DISTRIBUTION FOR L...

Fast firing flattening method and apparatus for sintered multilayer...

FAST FIRING FLATTENING METHOD AND APPARATUS FOR SINTERED MULTILAYER...

EMI shielding for semiconductor chip carriers

Multi-level web structure in use for thin sheet processing