Rennier Rodriguez

Person

Bulacan, PH

People

Patents Grantslast 30 patents

Information Patent Grant
Lead frame for improving adhesive fillets on semiconductor die corners
- Patent number 12,170,240
- Issue date Dec 17, 2024
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat no-lead package with surface mounted structure
- Patent number 12,159,820
- Issue date Dec 3, 2024
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat no-lead package with surface mounted structure
- Patent number 12,074,100
- Issue date Aug 27, 2024
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with multiple contact pads electrically coupled t...
- Patent number 11,688,715
- Issue date Jun 27, 2023
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for improving adhesive fillets on semiconductor die corners
- Patent number 11,664,239
- Issue date May 30, 2023
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified leadframe design with adhesive overflow recesses
- Patent number 11,552,007
- Issue date Jan 10, 2023
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with lead frame with improved lead design for discrete elec...
- Patent number 11,404,355
- Issue date Aug 2, 2022
- STMicroelectronics Pte Ltd
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with multiple contact pads electrically coupled t...
- Patent number 11,152,326
- Issue date Oct 19, 2021
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for improving adhesive fillets on semiconductor die corners
- Patent number 11,037,864
- Issue date Jun 15, 2021
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified leadframe design with adhesive overflow recesses
- Patent number 10,957,634
- Issue date Mar 23, 2021
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat no-lead package with surface mounted structure
- Patent number 10,892,212
- Issue date Jan 12, 2021
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe having a conductive layer protruding through a lead recess
- Patent number 10,796,984
- Issue date Oct 6, 2020
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with lead frame with improved lead design for discrete elec...
- Patent number 10,763,194
- Issue date Sep 1, 2020
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified leadframe design with adhesive overflow recesses
- Patent number 10,615,104
- Issue date Apr 7, 2020
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die with metallized sidewall and method of manufacturing
- Patent number 10,535,588
- Issue date Jan 14, 2020
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified leadframe design with adhesive overflow recesses
- Patent number 10,109,563
- Issue date Oct 23, 2018
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flow over wire die attach film and conductive molding compound to p...
- Patent number 9,953,933
- Issue date Apr 24, 2018
- STMicroelectronics, Inc.
- Aaron Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a shielded integrated circuit (IC) package with a...
- Patent number 9,761,538
- Issue date Sep 12, 2017
- STMICROELECTRONICS, INC.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEAD FRAME FOR IMPROVING ADHESIVE FILLETS ON SEMICONDUCTOR DIE CORNERS
- Publication number 20230253213
- Publication date Aug 10, 2023
- STMICROELECTRONICS, INC.
- Rennier RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH ELECTROMAGNETIC SHIELD
- Publication number 20220139845
- Publication date May 5, 2022
- STMICROELECTRONICS, INC.
- Endalicio MANALO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH MULTIPLE CONTACT PADS ELECTRICALLY COUPLED T...
- Publication number 20220005782
- Publication date Jan 6, 2022
- STMICROELECTRONICS, INC.
- Rennier RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES HAVING CAP WITH INTEGRATED ELECTRICAL...
- Publication number 20210391226
- Publication date Dec 16, 2021
- STMICROELECTRONICS, INC.
- Rennier RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME FOR IMPROVING ADHESIVE FILLETS ON SEMICONDUCTOR DIE CORNERS
- Publication number 20210265245
- Publication date Aug 26, 2021
- STMICROELECTRONICS, INC.
- Rennier RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES
- Publication number 20210183750
- Publication date Jun 17, 2021
- STMICROELECTRONICS, INC.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT NO-LEAD PACKAGE WITH SURFACE MOUNTED STRUCTURE
- Publication number 20210151368
- Publication date May 20, 2021
- STMICROELECTRONICS, INC.
- Rennier RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT NO-LEAD PACKAGE WITH SURFACE MOUNTED STRUCTURE
- Publication number 20210111109
- Publication date Apr 15, 2021
- STMICROELECTRONICS, INC.
- Rennier RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH LEAD FRAME WITH IMPROVED LEAD DESIGN FOR DISCRETE ELEC...
- Publication number 20200365492
- Publication date Nov 19, 2020
- STMicroelectronics Pte Ltd
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES
- Publication number 20200194355
- Publication date Jun 18, 2020
- STMICROELECTRONICS, INC.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH MULTIPLE CONTACT PADS ELECTRICALLY COUPLED T...
- Publication number 20200135686
- Publication date Apr 30, 2020
- STMICROELECTRONICS, INC.
- Rennier RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME FOR IMPROVING ADHESIVE FILLETS ON SEMICONDUCTOR DIE CORNERS
- Publication number 20190267310
- Publication date Aug 29, 2019
- STMICROELECTRONICS, INC.
- Rennier RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME WITH LEAD PROTRUDING FROM THE PACKAGE
- Publication number 20190148271
- Publication date May 16, 2019
- STMICROELECTRONICS, INC.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT NO-LEAD PACKAGE WITH SURFACE MOUNTED STRUCTURE
- Publication number 20190139875
- Publication date May 9, 2019
- STMICROELECTRONICS, INC.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH LEAD FRAME WITH IMPROVED LEAD DESIGN FOR DISCRETE ELEC...
- Publication number 20190096788
- Publication date Mar 28, 2019
- STMICROELECTRONICS, INC.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES
- Publication number 20190043790
- Publication date Feb 7, 2019
- STMICROELECTRONICS, INC.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE WITH METALLIZED SIDEWALL AND METHOD OF MANUFACTURING
- Publication number 20180204786
- Publication date Jul 19, 2018
- STMICROELECTRONICS, INC.
- Rennier RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME WITH LEAD PROTRUDING FROM THE PACKAGE
- Publication number 20180190575
- Publication date Jul 5, 2018
- STMICROELECTRONICS, INC.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES
- Publication number 20180190576
- Publication date Jul 5, 2018
- STMICROELECTRONICS, INC.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING A SHIELDED INTEGRATED CIRCUIT (IC) PACKAGE WITH...
- Publication number 20170263566
- Publication date Sep 14, 2017
- STMICROELECTRONICS, INC.
- Rennier RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS

Rennier Rodriguez

Person

Patents Grantslast 30 patents

Lead frame for improving adhesive fillets on semiconductor die corners

Flat no-lead package with surface mounted structure

Flat no-lead package with surface mounted structure

Semiconductor die with multiple contact pads electrically coupled t...

Lead frame for improving adhesive fillets on semiconductor die corners

Modified leadframe design with adhesive overflow recesses

Package with lead frame with improved lead design for discrete elec...

Semiconductor die with multiple contact pads electrically coupled t...

Lead frame for improving adhesive fillets on semiconductor die corners

Modified leadframe design with adhesive overflow recesses

Flat no-lead package with surface mounted structure

Leadframe having a conductive layer protruding through a lead recess

Package with lead frame with improved lead design for discrete elec...

Modified leadframe design with adhesive overflow recesses

Die with metallized sidewall and method of manufacturing

Modified leadframe design with adhesive overflow recesses

Flow over wire die attach film and conductive molding compound to p...

Method for making a shielded integrated circuit (IC) package with a...

Patents Applicationslast 30 patents

LEAD FRAME FOR IMPROVING ADHESIVE FILLETS ON SEMICONDUCTOR DIE CORNERS

SEMICONDUCTOR PACKAGE WITH ELECTROMAGNETIC SHIELD

SEMICONDUCTOR DIE WITH MULTIPLE CONTACT PADS ELECTRICALLY COUPLED T...

SEMICONDUCTOR DEVICE PACKAGES HAVING CAP WITH INTEGRATED ELECTRICAL...

LEAD FRAME FOR IMPROVING ADHESIVE FILLETS ON SEMICONDUCTOR DIE CORNERS

MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES

FLAT NO-LEAD PACKAGE WITH SURFACE MOUNTED STRUCTURE

FLAT NO-LEAD PACKAGE WITH SURFACE MOUNTED STRUCTURE

PACKAGE WITH LEAD FRAME WITH IMPROVED LEAD DESIGN FOR DISCRETE ELEC...

MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES

SEMICONDUCTOR DIE WITH MULTIPLE CONTACT PADS ELECTRICALLY COUPLED T...

LEAD FRAME FOR IMPROVING ADHESIVE FILLETS ON SEMICONDUCTOR DIE CORNERS

LEADFRAME WITH LEAD PROTRUDING FROM THE PACKAGE

FLAT NO-LEAD PACKAGE WITH SURFACE MOUNTED STRUCTURE

PACKAGE WITH LEAD FRAME WITH IMPROVED LEAD DESIGN FOR DISCRETE ELEC...

MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES

DIE WITH METALLIZED SIDEWALL AND METHOD OF MANUFACTURING

LEADFRAME WITH LEAD PROTRUDING FROM THE PACKAGE

MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES

METHOD FOR MAKING A SHIELDED INTEGRATED CIRCUIT (IC) PACKAGE WITH...