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last 30 patents
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Patent Grant
High-strength copper based alloy free from smutting during pretreat...
Patent number
5,997,810
Issue date
Dec 7, 1999
Mitsubishi Shindoh Co., Ltd.
Rensei Futatsuka
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Grant
Corrosion-resistant high-strength copper based alloy having excelle...
Patent number
5,885,376
Issue date
Mar 23, 1999
Mitsubishi Shindoh Co., Ltd.
Takeshi Suzuki
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Grant
Copper alloy sheet for connectors and connectors formed of same
Patent number
5,667,752
Issue date
Sep 16, 1997
Mitsubishi Shindoh Co., Ltd.
Takeshi Suzuki
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Grant
Lead frame material and lead frame for semiconductor device
Patent number
5,510,197
Issue date
Apr 23, 1996
Mitsubishi Shindoh Co., Ltd.
Shunji Takahashi
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Lead frame material formed of copper alloy for resin sealed type se...
Patent number
5,463,247
Issue date
Oct 31, 1995
Mitsubishi Shindoh Co., Ltd.
Rensei Futatsuka
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Grant
Copper alloy lead frame material for semiconductor devices
Patent number
4,877,577
Issue date
Oct 31, 1989
Mitsubishi Shindoh Co., Ltd.
Rensei Futatsuka
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Grant
Copper base lead material for leads of semiconductor devices
Patent number
4,750,029
Issue date
Jun 7, 1988
Mitsubishi Shindoh Co., Ltd.
Rensei Futatsuka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Copper alloy lead material for leads of a semiconductor device
Patent number
4,668,471
Issue date
May 26, 1987
Mitsubishi Shindoh Co., Ltd.
Rensei Futatsuka
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Grant
Copper base alloy for leads of integrated circuit
Patent number
4,249,941
Issue date
Feb 10, 1981
Tamagawa Kikai Kinzoku Kabushiki Kaisha
Rensei Futatsuka
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...