Renuka Shastri Divakaruni

Person

Ridgefield, CT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Copper-based paste containing copper aluminate for microstructural...
- Patent number 6,358,439
- Issue date Mar 19, 2002
- International Business Machines Corporation
- Farid Youssif Aoude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-based paste containing copper aluminate for microstructural...
- Patent number 6,124,041
- Issue date Sep 26, 2000
- International Business Machines Corporation
- Farid Youssif Aoude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-based paste containing copper aluminate for microstructural...
- Patent number 5,925,443
- Issue date Jul 20, 1999
- International Business Machines Corporation
- Farid Youssif Aoude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic via composition, multilayer ceramic circuit containing same...
- Patent number 5,468,445
- Issue date Nov 21, 1995
- International Business Machines Corporation
- Jon A. Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic via composition, multilayer ceramic circuit containing same...
- Patent number 5,336,444
- Issue date Aug 9, 1994
- International Business Machines Corporation
- Jon A. Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating a low dielectric composite substrate
- Patent number 5,277,725
- Issue date Jan 11, 1994
- International Business Machines Corporation
- John Acocella
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Phenyl-endcapped depolymerizable polymer
- Patent number 5,147,741
- Issue date Sep 15, 1992
- International Business Machines Corporation
- Constance J. Araps
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Low dielectric composite substrate
- Patent number 5,139,851
- Issue date Aug 18, 1992
- International Business Machines Corporation
- John Acocella
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Process for fabricating a low dielectric composite substrate
- Patent number 5,135,595
- Issue date Aug 4, 1992
- International Business Machines Corporation
- John Acocella
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Phenyl-endcapped depolymerizable polymer
- Patent number 4,987,211
- Issue date Jan 22, 1991
- International Business Machines Corporation
- Constance J. Araps
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method of making multilayered ceramic structures having an internal...
- Patent number 4,885,038
- Issue date Dec 5, 1989
- International Business Machines Corporation
- Herbert R. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding inorganic particulate material
- Patent number 4,772,346
- Issue date Sep 20, 1988
- International Business Machines Corporation
- Herbert R. Anderson
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Renuka Shastri Divakaruni

Person

Patents Grantslast 30 patents

Copper-based paste containing copper aluminate for microstructural...

Copper-based paste containing copper aluminate for microstructural...

Copper-based paste containing copper aluminate for microstructural...

Ceramic via composition, multilayer ceramic circuit containing same...

Ceramic via composition, multilayer ceramic circuit containing same...

Process for fabricating a low dielectric composite substrate

Phenyl-endcapped depolymerizable polymer

Low dielectric composite substrate

Process for fabricating a low dielectric composite substrate

Phenyl-endcapped depolymerizable polymer

Method of making multilayered ceramic structures having an internal...

Method of bonding inorganic particulate material