Rey Torcuato

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Test structure
- Patent number 6,861,748
- Issue date Mar 1, 2005
- LSI Logic Corporation
- Qwai H. Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple row wire bonding with ball bonds of outer bond pads bonded...
- Patent number 6,329,278
- Issue date Dec 11, 2001
- LSI Logic Corporation
- Qwai H. Low
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
UTILIZING A JUMPER CHIP IN PACKAGES WITH LONG BONDING WIRES
- Publication number 20120286409
- Publication date Nov 15, 2012
- Jitesh Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Test structure
- Publication number 20040096995
- Publication date May 20, 2004
- Qwai H. Low
- H01 - BASIC ELECTRIC ELEMENTS