Reynante Tamunan Alvarado

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package comprising wire bonds configured as a heat spreader
- Patent number 11,545,411
- Issue date Jan 3, 2023
- QUALCOMM Incorporated
- Wen Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, apparatus, and method for embedding a 3D component with an...
- Patent number 10,163,687
- Issue date Dec 25, 2018
- QUALCOMM Incorporated
- David Fraser Rae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising mold for top side and sidewall prot...
- Patent number 10,141,202
- Issue date Nov 27, 2018
- QUALCOMM Incorporated
- Reynante Tamunan Alvarado
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System, apparatus, and method for embedding a device in a faceup wo...
- Patent number 9,985,010
- Issue date May 29, 2018
- QUALCOMM Incorporated
- David Fraser Rae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar fan-out wafer level packaging
- Patent number 9,806,048
- Issue date Oct 31, 2017
- QUALCOMM Incorporated
- Lizabeth Ann Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package interconnect
- Patent number 9,806,052
- Issue date Oct 31, 2017
- QUALCOMM Incorporated
- Lizabeth Ann Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package device with solder bump reinforcement
- Patent number 9,425,160
- Issue date Aug 23, 2016
- Maxim Integrated Products, Inc.
- Reynante Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crack stopping structure in wafer level packaging (WLP)
- Patent number 9,379,065
- Issue date Jun 28, 2016
- QUALCOMM Incorporated
- Lizabeth Ann Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising wires as vias in an encapsulation layer
- Patent number 9,209,110
- Issue date Dec 8, 2015
- QUALCOMM Incorporated
- Reynante Tamunan Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked redistribution layers on die
- Patent number 9,171,782
- Issue date Oct 27, 2015
- QUALCOMM Incorporated
- Christine Sung-An Hau-Riege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaged device having self-assembled resilient leads
- Patent number 9,159,684
- Issue date Oct 13, 2015
- Maxim Integrated Products, Inc.
- Chiung C. Lo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE COMPRISING WIRE BONDS CONFIGURED AS A HEAT SPREADER
- Publication number 20220037224
- Publication date Feb 3, 2022
- QUALCOMM Incorporated
- Wen YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER (RDL) FAN-OUT WAFER LEVEL PACKAGING (FOWLP) ST...
- Publication number 20170373032
- Publication date Dec 28, 2017
- QUALCOMM Incorporated
- Jihoon OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR FAN-OUT WAFER LEVEL PACKAGING
- Publication number 20170271289
- Publication date Sep 21, 2017
- QUALCOMM Incorporated
- Lizabeth Ann KESER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INTERCONNECT
- Publication number 20170077053
- Publication date Mar 16, 2017
- QUALCOMM Incorporated
- Lizabeth Ann KESER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO INTERCONNECT FOR WAFER LEVEL PACKAGE (WLP) AND IN...
- Publication number 20160343646
- Publication date Nov 24, 2016
- QUALCOMM Incorporated
- Reynante Tamunan Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM, APPARATUS, AND METHOD FOR EMBEDDING A 3D COMPONENT WITH AN...
- Publication number 20160343651
- Publication date Nov 24, 2016
- QUALCOMM Incorporated
- David Fraser RAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM, APPARATUS, AND METHOD FOR EMBEDDING A DEVICE IN A FACEUP WO...
- Publication number 20160343635
- Publication date Nov 24, 2016
- QUALCOMM Incorporated
- David Fraser RAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING WIRES AS VIAS IN AN ENCAPSULATION LAYER
- Publication number 20150325496
- Publication date Nov 12, 2015
- QUALCOMM Incorporated
- Reynante Tamunan Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA UNDER THE INTERCONNECT STRUCTURES FOR SEMICONDUCTOR DEVICES
- Publication number 20150228594
- Publication date Aug 13, 2015
- QUALCOMM Incorporated
- Reynante Tamunan Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRACK STOPPING STRUCTURE IN WAFER LEVEL PACKAGING (WLP)
- Publication number 20150048517
- Publication date Feb 19, 2015
- QUALCOMM Incorporated
- Lizabeth Ann Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED REDISTRIBUTION LAYERS ON DIE
- Publication number 20150041982
- Publication date Feb 12, 2015
- QUALCOMM Incorporated
- Christine Sung-An Hau-Riege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING MOLD FOR TOP SIDE AND SIDEWALL PROT...
- Publication number 20140339712
- Publication date Nov 20, 2014
- QUALCOMM Incorporated
- Reynante Tamunan Alvarado
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Reynante Tamunan Alvarado

Person

Patents Grantslast 30 patents

Package comprising wire bonds configured as a heat spreader

System, apparatus, and method for embedding a 3D component with an...

Semiconductor device comprising mold for top side and sidewall prot...

System, apparatus, and method for embedding a device in a faceup wo...

Planar fan-out wafer level packaging

Semiconductor package interconnect

Wafer-level package device with solder bump reinforcement

Crack stopping structure in wafer level packaging (WLP)

Integrated device comprising wires as vias in an encapsulation layer

Stacked redistribution layers on die

Wafer-level packaged device having self-assembled resilient leads

Patents Applicationslast 30 patents

PACKAGE COMPRISING WIRE BONDS CONFIGURED AS A HEAT SPREADER

REDISTRIBUTION LAYER (RDL) FAN-OUT WAFER LEVEL PACKAGING (FOWLP) ST...

PLANAR FAN-OUT WAFER LEVEL PACKAGING

SEMICONDUCTOR PACKAGE INTERCONNECT

HIGH ASPECT RATIO INTERCONNECT FOR WAFER LEVEL PACKAGE (WLP) AND IN...

SYSTEM, APPARATUS, AND METHOD FOR EMBEDDING A 3D COMPONENT WITH AN...

SYSTEM, APPARATUS, AND METHOD FOR EMBEDDING A DEVICE IN A FACEUP WO...

INTEGRATED DEVICE COMPRISING WIRES AS VIAS IN AN ENCAPSULATION LAYER

VIA UNDER THE INTERCONNECT STRUCTURES FOR SEMICONDUCTOR DEVICES

CRACK STOPPING STRUCTURE IN WAFER LEVEL PACKAGING (WLP)

STACKED REDISTRIBUTION LAYERS ON DIE

SEMICONDUCTOR DEVICE COMPRISING MOLD FOR TOP SIDE AND SIDEWALL PROT...