Reza Sharifi

Person

Irvine, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Cantilevered power planes to provide a return current path for high...
- Patent number 12,191,243
- Issue date Jan 7, 2025
- Avago Technologies International Sales Pte. Limited
- Arun Ramakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with serpentine conductor and method of...
- Patent number 12,068,232
- Issue date Aug 20, 2024
- Avago Technologies International Sales Pte. Limited
- Michael Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonics integration in semiconductor packages
- Patent number 11,906,802
- Issue date Feb 20, 2024
- Avago Technologies International Sales Pte. Limited
- Mayank Mayukh
- G02 - OPTICS
Information Patent Grant
Hexagonally arranged connection patterns for high-density device pa...
- Patent number 10,971,450
- Issue date Apr 6, 2021
- Avago Technologies International Sales Pte. Limited
- Arun Ramakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional coiling via structure for impedance tuning of imp...
- Patent number 8,723,048
- Issue date May 13, 2014
- Broadcom Corporation
- Zhonghua (Ken) Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH SERPENTINE CONDUCTOR AND METHOD OF...
- Publication number 20240395689
- Publication date Nov 28, 2024
- Avago Technologies International Sales Pte. Limited
- Michael Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SYSTEMS AND METHODS FOR SEMICONDUCTOR DEVICES
- Publication number 20240363473
- Publication date Oct 31, 2024
- Avago Technologies International Sales Pte. Limited
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonics Integration in Semiconductor Packages
- Publication number 20240151921
- Publication date May 9, 2024
- Avago Technologies International Sales Pte. Limited
- Mayank Mayukh
- G02 - OPTICS
Information Patent Application
Substrate with Differing Dielectric Constants
- Publication number 20240145392
- Publication date May 2, 2024
- Avago Technologies International Sales Pte. Limited
- Dharmendra Saraswat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microfluidic Channels for Cooling Hybrid Bonded Interfaces
- Publication number 20240128156
- Publication date Apr 18, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge Seal for Bonded Stacks of Different Size Semiconductor Devices
- Publication number 20240038613
- Publication date Feb 1, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elastomer Interconnection Substrate Layer
- Publication number 20240038641
- Publication date Feb 1, 2024
- Avago Technologies International Sales Pte. Limited
- Dharmendra Saraswat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Interconnection Structure
- Publication number 20240038645
- Publication date Feb 1, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Antennas on Side Wall of 3D Stacked Die
- Publication number 20240039141
- Publication date Feb 1, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Side Wall Interconnection
- Publication number 20240038724
- Publication date Feb 1, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mixed Dielectric Materials for Improving Signal Integrity of Integr...
- Publication number 20230395444
- Publication date Dec 7, 2023
- Avago Technologies International Sales Pte. Limited
- Mayank Mayukh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Packaging Heterogeneous Area Array Interconnections
- Publication number 20230369267
- Publication date Nov 16, 2023
- Avago Technologies International Sales Pte. Limited
- Sam Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonics Integration in Semiconductor Packages
- Publication number 20230367087
- Publication date Nov 16, 2023
- Avago Technologies International Sales Pte. Limited
- Mayank Mayukh
- G02 - OPTICS
Information Patent Application
Cantilevered Power Planes to Provide a Return Current Path for High...
- Publication number 20230369191
- Publication date Nov 16, 2023
- Avago Technologies International Sales Pte. Limited
- Arun Ramakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Cores, Variable Width Vias, and Offset Vias
- Publication number 20230352383
- Publication date Nov 2, 2023
- Avago Technologies International Sales Pte. Limited
- Dharmendra Saraswat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH SERPENTINE CONDUCTOR AND METHOD OF...
- Publication number 20230138918
- Publication date May 4, 2023
- Avago Technologies International Sales Pte. Limited
- Michael Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEXAGONALLY ARRANGED CONNECTION PATTERNS FOR HIGH-DENSITY DEVICE PA...
- Publication number 20200235052
- Publication date Jul 23, 2020
- Avago Technologies International Sales Pte. Limited
- Arun RAMAKRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package Security Fence
- Publication number 20120256305
- Publication date Oct 11, 2012
- BROADCOM CORPORATION
- Matthew Kaufmann
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THREE-DIMENSIONAL COILING VIA STRUCTURE FOR IMPEDANCE TUNING OF IMP...
- Publication number 20120112868
- Publication date May 10, 2012
- BROADCOM CORPORATION
- Zhonghua (Ken) Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Reza Sharifi

Person

Patents Grantslast 30 patents

Cantilevered power planes to provide a return current path for high...

Integrated circuit package with serpentine conductor and method of...

Photonics integration in semiconductor packages

Hexagonally arranged connection patterns for high-density device pa...

Three-dimensional coiling via structure for impedance tuning of imp...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE WITH SERPENTINE CONDUCTOR AND METHOD OF...

THERMAL MANAGEMENT SYSTEMS AND METHODS FOR SEMICONDUCTOR DEVICES

Photonics Integration in Semiconductor Packages

Substrate with Differing Dielectric Constants

Microfluidic Channels for Cooling Hybrid Bonded Interfaces

Edge Seal for Bonded Stacks of Different Size Semiconductor Devices

Elastomer Interconnection Substrate Layer

Semiconductor Package Interconnection Structure

Integrated Antennas on Side Wall of 3D Stacked Die

Semiconductor Package with Side Wall Interconnection

Mixed Dielectric Materials for Improving Signal Integrity of Integr...

3D Packaging Heterogeneous Area Array Interconnections

Photonics Integration in Semiconductor Packages

Cantilevered Power Planes to Provide a Return Current Path for High...

Multilayer Cores, Variable Width Vias, and Offset Vias

INTEGRATED CIRCUIT PACKAGE WITH SERPENTINE CONDUCTOR AND METHOD OF...

HEXAGONALLY ARRANGED CONNECTION PATTERNS FOR HIGH-DENSITY DEVICE PA...

Integrated Circuit Package Security Fence

THREE-DIMENSIONAL COILING VIA STRUCTURE FOR IMPEDANCE TUNING OF IMP...