Ricardo Uscola

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Leadless power amplifier packages including topside termination int...
- Patent number 11,984,429
- Issue date May 14, 2024
- NXP USA, INC.
- Yun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier packages containing multi-path integrated passive d...
- Patent number 11,349,438
- Issue date May 31, 2022
- NXP USA, INC.
- Yun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doherty power amplifier devices having intergrated output combining...
- Patent number 11,190,146
- Issue date Nov 30, 2021
- NXP USA, INC.
- Ramanujam Srinidhi Embar
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Bond wire array for packaged semiconductor device
- Patent number 11,049,837
- Issue date Jun 29, 2021
- NXP USA, INC.
- Jitesh Vaswani
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Amplifier devices with input transient termination
- Patent number 11,012,035
- Issue date May 18, 2021
- NXP USA, INC.
- Arturo Roiz
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Linearity enhancement of high power amplifiers
- Patent number 10,826,439
- Issue date Nov 3, 2020
- NXP USA, INC.
- Ramanujam Srinidhi Embar
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Impedance matching circuit for RF devices and method therefor
- Patent number 10,707,180
- Issue date Jul 7, 2020
- NXP USA, INC.
- Ricardo Uscola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple-stage power amplifiers implemented with multiple semicondu...
- Patent number 10,250,197
- Issue date Apr 2, 2019
- NXP USA, INC.
- Joseph Schultz
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power amplifier output circuit arrangements with mutual coupling be...
- Patent number 9,991,854
- Issue date Jun 5, 2018
- NXP USA, INC.
- Ning Zhu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Input circuits for RF amplifier devices, and methods of manufacture...
- Patent number 9,979,361
- Issue date May 22, 2018
- NXP USA, INC.
- Sai Sunil Mangaonkar
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
LEADLESS POWER AMPLIFIER PACKAGES INCLUDING TOPSIDE TERMINATION INT...
- Publication number 20230115340
- Publication date Apr 13, 2023
- NXP USA, Inc.
- Yun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER PACKAGES CONTAINING MULTI-PATH INTEGRATED PASSIVE D...
- Publication number 20210203278
- Publication date Jul 1, 2021
- NXP USA, Inc.
- Yun Wei
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
DOHERTY POWER AMPLIFIER DEVICES HAVING INTERGRATED OUTPUT COMBINING...
- Publication number 20210152130
- Publication date May 20, 2021
- NXP USA, Inc.
- Ramanujam Srinidhi Embar
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
BOND WIRE ARRAY FOR PACKAGED SEMICONDUCTOR DEVICE
- Publication number 20210035942
- Publication date Feb 4, 2021
- NXP USA, Inc.
- Jitesh VASWANI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
AMPLIFIER DEVICES WITH INPUT TRANSIENT TERMINATION
- Publication number 20200366244
- Publication date Nov 19, 2020
- NXP USA, Inc.
- ARTURO ROIZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINEARITY ENHANCEMENT OF HIGH POWER AMPLIFIERS
- Publication number 20200195201
- Publication date Jun 18, 2020
- NXP USA, Inc.
- Ramanujam Srinidhi Embar
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
IMPEDANCE MATCHING CIRCUIT FOR RF DEVICES AND METHOD THEREFOR
- Publication number 20190326233
- Publication date Oct 24, 2019
- NXP USA, Inc.
- Ricardo Uscola
- H01 - BASIC ELECTRIC ELEMENTS

Ricardo Uscola

Person

Patents Grantslast 30 patents

Leadless power amplifier packages including topside termination int...

Power amplifier packages containing multi-path integrated passive d...

Doherty power amplifier devices having intergrated output combining...

Bond wire array for packaged semiconductor device

Amplifier devices with input transient termination

Linearity enhancement of high power amplifiers

Impedance matching circuit for RF devices and method therefor

Multiple-stage power amplifiers implemented with multiple semicondu...

Power amplifier output circuit arrangements with mutual coupling be...

Input circuits for RF amplifier devices, and methods of manufacture...

Patents Applicationslast 30 patents

LEADLESS POWER AMPLIFIER PACKAGES INCLUDING TOPSIDE TERMINATION INT...

POWER AMPLIFIER PACKAGES CONTAINING MULTI-PATH INTEGRATED PASSIVE D...

DOHERTY POWER AMPLIFIER DEVICES HAVING INTERGRATED OUTPUT COMBINING...

BOND WIRE ARRAY FOR PACKAGED SEMICONDUCTOR DEVICE

AMPLIFIER DEVICES WITH INPUT TRANSIENT TERMINATION

LINEARITY ENHANCEMENT OF HIGH POWER AMPLIFIERS

IMPEDANCE MATCHING CIRCUIT FOR RF DEVICES AND METHOD THEREFOR