Rich Gauldin

Person

St. Petersburg, FL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 10,707,060
- Issue date Jul 7, 2020
- Plasma-Therm LLC
- Chris Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for dicing a substrate with back metal
- Patent number 10,497,621
- Issue date Dec 3, 2019
- Plasma-Therm LLC
- Peter Falvo
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number RE46339
- Issue date Mar 14, 2017
- Plasma-Therm LLC
- Rich Gauldin
Information Patent Grant
Method for dicing a substrate with back metal
- Patent number 9,368,404
- Issue date Jun 14, 2016
- Plasma-Therm LLC
- Peter Falvo
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 9,202,737
- Issue date Dec 1, 2015
- Plasma-Therm LLC
- Rich Gauldin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 9,082,839
- Issue date Jul 14, 2015
- Plasma-Therm LLC
- Rich Gauldin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 8,946,058
- Issue date Feb 3, 2015
- Plasma-Therm LLC
- Rich Gauldin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 8,785,332
- Issue date Jul 22, 2014
- Plasma-Therm LLC
- Chris Johnson
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
- Publication number 20190013243
- Publication date Jan 10, 2019
- Plasma-Therm LLC
- Chris Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Dicing a Substrate with Back Metal
- Publication number 20180254215
- Publication date Sep 6, 2018
- PLASMA-THERM, LLC
- Peter Falvo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Dicing a Substrate with Back Metal
- Publication number 20160254189
- Publication date Sep 1, 2016
- PLASMA-THERM, LLC
- Peter Falvo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20150270154
- Publication date Sep 24, 2015
- Plasma-Therm LLC
- Rich Gauldin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
- Publication number 20140242780
- Publication date Aug 28, 2014
- Plasma-Therm LLC
- Rich Gauldin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Dicing a Substrate with Back Metal
- Publication number 20140094018
- Publication date Apr 3, 2014
- PLASMA-THERM, LLC
- Peter Falvo
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20130230968
- Publication date Sep 5, 2013
- Plasma-Therm LLC
- Chris Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20130230973
- Publication date Sep 5, 2013
- Plasma-Therm LLC
- Rich Gauldin
- H01 - BASIC ELECTRIC ELEMENTS

Rich Gauldin

Person

Patents Grantslast 30 patents

Method and apparatus for plasma dicing a semi-conductor wafer

Method for dicing a substrate with back metal

Method and apparatus for plasma dicing a semi-conductor wafer

Method for dicing a substrate with back metal

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

Method for Dicing a Substrate with Back Metal

Method for Dicing a Substrate with Back Metal

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer

Method for Dicing a Substrate with Back Metal

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer