Richard A. Davis

Person

Plano, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
High sensitivity silicon piezoresistor force sensor
- Patent number 11,573,136
- Issue date Feb 7, 2023
- Honeywell International Inc.
- Brian Speldrich
- G01 - MEASURING TESTING
Information Patent Grant
Low cost overmolded leadframe force sensor with multiple mounting p...
- Patent number 10,732,057
- Issue date Aug 4, 2020
- Honeywell International Inc.
- Josh M. Fribley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
FET based humidity sensor with barrier layer protecting gate dielec...
- Patent number 10,585,058
- Issue date Mar 10, 2020
- Honeywell International Inc.
- Cornel Cobianu
- G01 - MEASURING TESTING
Information Patent Grant
Overforce control through sense die design
- Patent number 10,571,348
- Issue date Feb 25, 2020
- Honeywell International Inc.
- Richard Wade
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor having a bossed diaphragm
- Patent number 10,370,243
- Issue date Aug 6, 2019
- Honeywell International Inc.
- Carl Stewart
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low cost overmolded leadframe force sensor with multiple mounting p...
- Patent number 10,190,925
- Issue date Jan 29, 2019
- Honeywell International Inc.
- Josh M. Fribley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical systems (MEMS) force die with buried cavity...
- Patent number 10,036,676
- Issue date Jul 31, 2018
- Alistair David Bradley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Humidity sensor
- Patent number 9,513,242
- Issue date Dec 6, 2016
- Honeywell International Inc.
- Scott E. Beck
- G01 - MEASURING TESTING
Information Patent Grant
Media isolated pressure sensor
- Patent number 9,470,593
- Issue date Oct 18, 2016
- Honeywell International Inc.
- Richard A. Davis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure sensor having a bossed diaphragm
- Patent number 9,267,857
- Issue date Feb 23, 2016
- Honeywell International Inc.
- Carl Stewart
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor with isolated diaphragm
- Patent number 9,156,676
- Issue date Oct 13, 2015
- Honeywell International Inc.
- Carl Stewart
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Magnetic-field sensing device
- Patent number 9,134,385
- Issue date Sep 15, 2015
- Honeywell International Inc.
- Jason Chilcote
- G01 - MEASURING TESTING
Information Patent Grant
Increased sensor die adhesion
- Patent number 8,375,799
- Issue date Feb 19, 2013
- Honeywell International Inc.
- Alistair David Bradley
- G01 - MEASURING TESTING
Information Patent Grant
Media isolated differential pressure sensor with cap
- Patent number 8,297,125
- Issue date Oct 30, 2012
- Honeywell International Inc.
- Carl Stewart
- G01 - MEASURING TESTING
Information Patent Grant
Sensor geometry for improved package stress isolation
- Patent number 8,082,798
- Issue date Dec 27, 2011
- Honeywell International Inc.
- Gilberto Morales
- G01 - MEASURING TESTING
Information Patent Grant
Flow sensor apparatus and method with media isolated electrical con...
- Patent number 8,033,180
- Issue date Oct 11, 2011
- Honeywell International Inc.
- Gilberto Morales
- G01 - MEASURING TESTING
Information Patent Grant
Creating novel structures using deep trenching of oriented silicon...
- Patent number 7,932,182
- Issue date Apr 26, 2011
- Honeywell International Inc.
- Yong-Fa A. Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system for adjusting characteristics of integrated relat...
- Patent number 7,924,028
- Issue date Apr 12, 2011
- Honeywell International Inc.
- Yousef Alimi
- G01 - MEASURING TESTING
Information Patent Grant
Sensor geometry for improved package stress isolation
- Patent number 7,798,010
- Issue date Sep 21, 2010
- Honeywell International Inc.
- Gilberto Morales
- G01 - MEASURING TESTING
Information Patent Grant
Approach to high temperature wafer processing
- Patent number 7,791,200
- Issue date Sep 7, 2010
- Honeywell International Inc.
- Richard A. Davis
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Flow sensor apparatus and method with media isolated electrical con...
- Patent number 7,765,872
- Issue date Aug 3, 2010
- Honeywell International Inc.
- Gilberto Morales
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for controlling the sensitivity and value of a...
- Patent number 7,710,128
- Issue date May 4, 2010
- Honeywell International Inc.
- Yousef M. Alimi
- G01 - MEASURING TESTING
Information Patent Grant
Structure for capacitive balancing of integrated relative humidity...
- Patent number 7,683,636
- Issue date Mar 23, 2010
- Honeywell International Inc.
- Yousef M. Alimi
- G01 - MEASURING TESTING
Information Patent Grant
Approach to high temperature wafer processing
- Patent number 7,531,426
- Issue date May 12, 2009
- Honeywell International Inc.
- Richard A. Davis
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Small gauge pressure sensor using wafer bonding and electrochemical...
- Patent number 7,493,822
- Issue date Feb 24, 2009
- Honeywell International Inc.
- Carl E. Stewart
- G01 - MEASURING TESTING
Information Patent Grant
Method to reduce die edge shorting on pressure sensors using conduc...
- Patent number 7,343,812
- Issue date Mar 18, 2008
- Honeywell International Inc.
- Carl E. Stewart
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thermal fluid flow sensor and method of forming same technical field
- Patent number 7,255,001
- Issue date Aug 14, 2007
- Honeywell International Inc.
- Richard A. Davis
- G01 - MEASURING TESTING
Information Patent Grant
Methods and systems for capacitive balancing of relative humidity s...
- Patent number 6,867,602
- Issue date Mar 15, 2005
- Honeywell International Inc.
- Richard A. Davis
- G01 - MEASURING TESTING
Information Patent Grant
Relative humidity sensor with integrated signal conditioning
- Patent number 6,724,612
- Issue date Apr 20, 2004
- Honeywell International Inc.
- Richard A. Davis
- G01 - MEASURING TESTING
Information Patent Grant
Freeze resistant sensor
- Patent number 6,626,044
- Issue date Sep 30, 2003
- Honeywell International Inc.
- Michael J. Haji-Sheikh
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
HIGH SENSITIVITY SILICON PIEZORESISTOR FORCE SENSOR
- Publication number 20230146578
- Publication date May 11, 2023
- Honeywell International Inc.
- Brian Speldrich
- G01 - MEASURING TESTING
Information Patent Application
LOW COST OVERMOLDED LEADFRAME FORCE SENSOR WITH MULTIPLE MOUNTING P...
- Publication number 20190101461
- Publication date Apr 4, 2019
- HONEYWELL INTERNATIONAL INC.
- Josh M. Fribley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
High Sensitivity Silicon Piezoresistor Force Sensor
- Publication number 20180180494
- Publication date Jun 28, 2018
- HONEYWELL INTERNATIONAL INC.
- Brian Speldrich
- G01 - MEASURING TESTING
Information Patent Application
BURIED CAVITY SENSE DIE DIAPHRAGM STOP FOR FORCE SENSORS
- Publication number 20180067008
- Publication date Mar 8, 2018
- HONEYWELL INTERNATIONAL INC.
- Richard Wade
- G01 - MEASURING TESTING
Information Patent Application
OVERFORCE CONTROL THROUGH SENSE DIE DESIGN
- Publication number 20180058955
- Publication date Mar 1, 2018
- HONEYWELL INTERNATIONAL INC.
- Richard Wade
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LOW COST OVERMOLDED LEADFRAME FORCE SENSOR WITH MULTIPLE MOUNTING P...
- Publication number 20180017449
- Publication date Jan 18, 2018
- HONEYWELL INTERNATIONAL INC.
- Josh M. Fribley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FET Based Humidity Sensor with Barrier Layer Protecting Gate Dielec...
- Publication number 20170328855
- Publication date Nov 16, 2017
- HONEYWELL INTERNATIONAL INC.
- Cornel Cobianu
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE SENSOR HAVING A BOSSED DIAPHRAGM
- Publication number 20160257561
- Publication date Sep 8, 2016
- HONEYWELL INTERNATIONAL INC.
- Carl Stewart
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HUMIDITY SENSOR
- Publication number 20160077028
- Publication date Mar 17, 2016
- Honeywell International Inc.
- Scott E. Beck
- G01 - MEASURING TESTING
Information Patent Application
Magnetic-Field Sensing Device
- Publication number 20160033588
- Publication date Feb 4, 2016
- Honeywell International, Inc.
- Jason Chilcote
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE SENSOR HAVING A BOSSED DIAPHRAGM
- Publication number 20150192486
- Publication date Jul 9, 2015
- Honeywell International Inc.
- Carl Stewart
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEDIA ISOLATED PRESSURE SENSOR
- Publication number 20150068315
- Publication date Mar 12, 2015
- Honeywell International Inc.
- RIchard A. Davis
- G01 - MEASURING TESTING
Information Patent Application
MAGNETIC-FIELD SENSING DEVICE
- Publication number 20140332917
- Publication date Nov 13, 2014
- Honeywell International, Inc.
- Jason Chilcote
- G01 - MEASURING TESTING
Information Patent Application
SENSOR WITH ISOLATED DIAPHRAGM
- Publication number 20140298913
- Publication date Oct 9, 2014
- Honeywell International Inc.
- Carl Stewart
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INCREASED SENSOR DIE ADHESION
- Publication number 20120144921
- Publication date Jun 14, 2012
- Honeywell International Inc.
- Alistair David Bradley
- G01 - MEASURING TESTING
Information Patent Application
ROBUST SENSOR WITH TOP CAP
- Publication number 20110252882
- Publication date Oct 20, 2011
- Honeywell International Inc.
- Scott Edward Beck
- G01 - MEASURING TESTING
Information Patent Application
SENSOR GEOMETRY FOR IMPROVED PACKAGE STRESS ISOLATION
- Publication number 20100301435
- Publication date Dec 2, 2010
- Honeywell International Inc.
- Gilberto Morales
- G01 - MEASURING TESTING
Information Patent Application
FLOW SENSOR APPARATUS AND METHOD WITH MEDIA ISOLATED ELECTRICAL CON...
- Publication number 20100212434
- Publication date Aug 26, 2010
- Honeywell International Inc.
- Gilberto Morales
- G01 - MEASURING TESTING
Information Patent Application
FLOW SENSOR APPARATUS AND METHOD WITH MEDIA ISOLATED ELECTRICAL CON...
- Publication number 20100122580
- Publication date May 20, 2010
- Honeywell International Inc.
- Gilberto Morales
- G01 - MEASURING TESTING
Information Patent Application
MEDIA ISOLATED DIFFERENTIAL PRESSURE SENSOR WITH CAP
- Publication number 20090288492
- Publication date Nov 26, 2009
- Honeywell International Inc.
- Carl Stewart
- G01 - MEASURING TESTING
Information Patent Application
NOVEL APPROACH TO HIGH TEMPERATURE WAFER PROCESSING
- Publication number 20090243107
- Publication date Oct 1, 2009
- Honeywell International Inc.
- Richard A. Davis
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR ADJUSTING CHARACTERISTICS OF INTEGRATED RELAT...
- Publication number 20090237090
- Publication date Sep 24, 2009
- Honeywell International Inc.
- Yousef Alimi
- G01 - MEASURING TESTING
Information Patent Application
Structure for capacitive balancing of integrated relative humidity...
- Publication number 20090108852
- Publication date Apr 30, 2009
- Honeywell International Inc.
- Yousef M. Alimi
- G01 - MEASURING TESTING
Information Patent Application
Sensor geometry for improved package stress isolation
- Publication number 20090096040
- Publication date Apr 16, 2009
- Honeywell International Inc.
- Gilberto Morales
- G01 - MEASURING TESTING
Information Patent Application
SMALL GAUGE PRESSURE SENSOR USING WAFER BONDING AND ELECTROCHEMICAL...
- Publication number 20090007681
- Publication date Jan 8, 2009
- Honeywell International Inc.
- Carl E. Stewart
- G01 - MEASURING TESTING
Information Patent Application
Method and apparatus for controlling the sensitivity and value of a...
- Publication number 20080061802
- Publication date Mar 13, 2008
- Honeywell International Inc.
- Yousef M. Alimi
- G01 - MEASURING TESTING
Information Patent Application
Method to reduce die edge shorting on pressure sensors using conduc...
- Publication number 20070289387
- Publication date Dec 20, 2007
- Honeywell International Inc.
- Carl E. Stewart
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Single crystal based through the wafer connections technical field
- Publication number 20070042563
- Publication date Feb 22, 2007
- Honeywell International Inc.
- Yong-Fa A. Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel approach to high temperature wafer processing
- Publication number 20070042592
- Publication date Feb 22, 2007
- Honeywell International Inc.
- Richard A. Davis
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Creating novel structures using deep trenching of oriented silicon...
- Publication number 20070042606
- Publication date Feb 22, 2007
- Honeywell International Inc.
- Yong-Fa A. Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Richard A. Davis

Person

Patents Grantslast 30 patents

High sensitivity silicon piezoresistor force sensor

Low cost overmolded leadframe force sensor with multiple mounting p...

FET based humidity sensor with barrier layer protecting gate dielec...

Overforce control through sense die design

Pressure sensor having a bossed diaphragm

Low cost overmolded leadframe force sensor with multiple mounting p...

Microelectromechanical systems (MEMS) force die with buried cavity...

Humidity sensor

Media isolated pressure sensor

Pressure sensor having a bossed diaphragm

Sensor with isolated diaphragm

Magnetic-field sensing device

Increased sensor die adhesion

Media isolated differential pressure sensor with cap

Sensor geometry for improved package stress isolation

Flow sensor apparatus and method with media isolated electrical con...

Creating novel structures using deep trenching of oriented silicon...

Method and system for adjusting characteristics of integrated relat...

Sensor geometry for improved package stress isolation

Approach to high temperature wafer processing

Flow sensor apparatus and method with media isolated electrical con...

Method and apparatus for controlling the sensitivity and value of a...

Structure for capacitive balancing of integrated relative humidity...

Approach to high temperature wafer processing

Small gauge pressure sensor using wafer bonding and electrochemical...

Method to reduce die edge shorting on pressure sensors using conduc...

Thermal fluid flow sensor and method of forming same technical field

Methods and systems for capacitive balancing of relative humidity s...

Relative humidity sensor with integrated signal conditioning

Freeze resistant sensor

Patents Applicationslast 30 patents

HIGH SENSITIVITY SILICON PIEZORESISTOR FORCE SENSOR

LOW COST OVERMOLDED LEADFRAME FORCE SENSOR WITH MULTIPLE MOUNTING P...

High Sensitivity Silicon Piezoresistor Force Sensor

BURIED CAVITY SENSE DIE DIAPHRAGM STOP FOR FORCE SENSORS

OVERFORCE CONTROL THROUGH SENSE DIE DESIGN

LOW COST OVERMOLDED LEADFRAME FORCE SENSOR WITH MULTIPLE MOUNTING P...

FET Based Humidity Sensor with Barrier Layer Protecting Gate Dielec...

PRESSURE SENSOR HAVING A BOSSED DIAPHRAGM

HUMIDITY SENSOR

Magnetic-Field Sensing Device

PRESSURE SENSOR HAVING A BOSSED DIAPHRAGM

MEDIA ISOLATED PRESSURE SENSOR

MAGNETIC-FIELD SENSING DEVICE

SENSOR WITH ISOLATED DIAPHRAGM

INCREASED SENSOR DIE ADHESION

ROBUST SENSOR WITH TOP CAP

SENSOR GEOMETRY FOR IMPROVED PACKAGE STRESS ISOLATION

FLOW SENSOR APPARATUS AND METHOD WITH MEDIA ISOLATED ELECTRICAL CON...

FLOW SENSOR APPARATUS AND METHOD WITH MEDIA ISOLATED ELECTRICAL CON...

MEDIA ISOLATED DIFFERENTIAL PRESSURE SENSOR WITH CAP

NOVEL APPROACH TO HIGH TEMPERATURE WAFER PROCESSING

METHOD AND SYSTEM FOR ADJUSTING CHARACTERISTICS OF INTEGRATED RELAT...

Structure for capacitive balancing of integrated relative humidity...

Sensor geometry for improved package stress isolation

SMALL GAUGE PRESSURE SENSOR USING WAFER BONDING AND ELECTROCHEMICAL...

Method and apparatus for controlling the sensitivity and value of a...

Method to reduce die edge shorting on pressure sensors using conduc...

Single crystal based through the wafer connections technical field

Novel approach to high temperature wafer processing

Creating novel structures using deep trenching of oriented silicon...