Richard A. Larder

Person

Livermore, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Spring interconnect structures
- Patent number 7,841,863
- Issue date Nov 30, 2010
- FormFactor, Inc.
- Gaetan L. Mathieu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Probe card configuration for low mechanical flexural strength elect...
- Patent number 7,825,674
- Issue date Nov 2, 2010
- FormFactor, Inc.
- Makarand S. Shinde
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for compensating thermally induced motion of prob...
- Patent number 7,642,794
- Issue date Jan 5, 2010
- FormFactor, Inc.
- Benjamin N. Eldridge
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for compensating thermally induced motion of prob...
- Patent number 7,560,941
- Issue date Jul 14, 2009
- FormFactor, Inc.
- Rod Martens
- G01 - MEASURING TESTING
Information Patent Grant
Spring interconnect structures
- Patent number 7,553,165
- Issue date Jun 30, 2009
- FormFactor, Inc.
- Gaetan L. Mathieu
- G01 - MEASURING TESTING
Information Patent Grant
Spring interconnect structures
- Patent number 7,371,072
- Issue date May 13, 2008
- FormFactor, Inc.
- Gaetan L. Mathieu
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for compensating thermally induced motion of prob...
- Patent number 7,312,618
- Issue date Dec 25, 2007
- FormFactor, Inc.
- Benjamin N. Eldridge
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for compensating thermally induced motion of prob...
- Patent number 7,119,564
- Issue date Oct 10, 2006
- FormFactor, Inc.
- Rod Martens
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for compensating for thermally induced motion of...
- Patent number 7,071,714
- Issue date Jul 4, 2006
- FormFactor, Inc.
- Benjamin N. Eldridge
- G01 - MEASURING TESTING
Information Patent Grant
Probe card configuration for low mechanical flexural strength elect...
- Patent number 7,071,715
- Issue date Jul 4, 2006
- FormFactor, Inc.
- Makarand S. Shinde
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for compensating thermally induced motion of prob...
- Patent number 6,972,578
- Issue date Dec 6, 2005
- FormFactor, Inc.
- Rod Martens
- G01 - MEASURING TESTING
Information Patent Grant
Spring interconnect structures
- Patent number 6,672,875
- Issue date Jan 6, 2004
- FormFactor, Inc.
- Gaetan L. Mathieu
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SPRING INTERCONNECT STRUCTURES
- Publication number 20090263986
- Publication date Oct 22, 2009
- FormFactor, Inc.
- Gaetan L. Mathieu
- G01 - MEASURING TESTING
Information Patent Application
SPRING INTERCONNECT STRUCTURES
- Publication number 20080254651
- Publication date Oct 16, 2008
- FormFactor, Inc.
- Gaetan L. Mathieu
- G01 - MEASURING TESTING
Information Patent Application
Method and System for Compensating Thermally Induced Motion of Prob...
- Publication number 20080094088
- Publication date Apr 24, 2008
- FormFactor, Inc.
- Benjamin N. Eldridge
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND SYSTEM FOR COMPENSATING THERMALLY INDUCED MOTION OF PROB...
- Publication number 20070139060
- Publication date Jun 21, 2007
- FormFactor, Inc.
- Rod Martens
- G01 - MEASURING TESTING
Information Patent Application
Probe card configuration for low mechanical flexural strength elect...
- Publication number 20060244470
- Publication date Nov 2, 2006
- FormFactor, Inc.
- Makarand S. Shinde
- G01 - MEASURING TESTING
Information Patent Application
Method And System For Compensating Thermally Induced Motion Of Prob...
- Publication number 20060238211
- Publication date Oct 26, 2006
- FormFactor, Inc.
- Benjamin N. Eldridge
- G01 - MEASURING TESTING
Information Patent Application
Method and system for compensating thermally induced motion of prob...
- Publication number 20060001440
- Publication date Jan 5, 2006
- FormFactor, Inc.
- Rod Martens
- G01 - MEASURING TESTING
Information Patent Application
Probe card configuration for low mechanical flexural strength elect...
- Publication number 20050156611
- Publication date Jul 21, 2005
- FormFactor, Inc.
- Makarand S. Shinde
- G01 - MEASURING TESTING
Information Patent Application
Spring interconnect structures
- Publication number 20040142583
- Publication date Jul 22, 2004
- FormFactor, Inc.
- Gaetan L. Mathieu
- G01 - MEASURING TESTING
Information Patent Application
Method and system for compensating thermally induced motion of prob...
- Publication number 20030085721
- Publication date May 8, 2003
- Benjamin N. Eldridge
- G01 - MEASURING TESTING
Information Patent Application
Method and system for compensating thermally induced motion of prob...
- Publication number 20030085723
- Publication date May 8, 2003
- Rod Martens
- G01 - MEASURING TESTING

Richard A. Larder

Person

Patents Grantslast 30 patents

Spring interconnect structures

Probe card configuration for low mechanical flexural strength elect...

Method and system for compensating thermally induced motion of prob...

Method and system for compensating thermally induced motion of prob...

Spring interconnect structures

Spring interconnect structures

Method and system for compensating thermally induced motion of prob...

Method and system for compensating thermally induced motion of prob...

Method and system for compensating for thermally induced motion of...

Probe card configuration for low mechanical flexural strength elect...

Method and system for compensating thermally induced motion of prob...

Spring interconnect structures

Patents Applicationslast 30 patents

SPRING INTERCONNECT STRUCTURES

SPRING INTERCONNECT STRUCTURES

Method and System for Compensating Thermally Induced Motion of Prob...

METHOD AND SYSTEM FOR COMPENSATING THERMALLY INDUCED MOTION OF PROB...

Probe card configuration for low mechanical flexural strength elect...

Method And System For Compensating Thermally Induced Motion Of Prob...

Method and system for compensating thermally induced motion of prob...

Probe card configuration for low mechanical flexural strength elect...

Spring interconnect structures

Method and system for compensating thermally induced motion of prob...

Method and system for compensating thermally induced motion of prob...