RICHARD ALFRED BEAUPRE

Person

PITTSFIELD, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Cooling device for a power module, and a related method thereof
- Patent number 8,982,558
- Issue date Mar 17, 2015
- General Electric Company
- Richard Alfred Beaupre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost manufacturing of micro-channel heatsink
- Patent number 8,929,071
- Issue date Jan 6, 2015
- General Electric Company
- Richard Alfred Beaupre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board including mask for controlling flow of solder
- Patent number 8,853,550
- Issue date Oct 7, 2014
- General Electric Company
- Arun Virupaksha Gowda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Busbar for power conversion applications
- Patent number 8,772,634
- Issue date Jul 8, 2014
- General Electric Company
- Richard Alfred Beaupre
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power converting apparatus having improved electro-thermal characte...
- Patent number 8,675,379
- Issue date Mar 18, 2014
- General Electric Company
- Joseph Lucian Smolenski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible power connector
- Patent number 8,622,754
- Issue date Jan 7, 2014
- General Electric Company
- Eladio Clemente Delgado
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of forming semiconductor device package having high breakdow...
- Patent number 8,586,421
- Issue date Nov 19, 2013
- General Electric Company
- Richard Alfred Beaupre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial power module
- Patent number 8,487,416
- Issue date Jul 16, 2013
- General Electric Company
- Eladio Clemente Delgado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and fabrication method
- Patent number 8,466,007
- Issue date Jun 18, 2013
- General Electric Company
- Eladio Clemente Delgado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double side cooled power module with power overlay
- Patent number 8,358,000
- Issue date Jan 22, 2013
- General Electric Company
- Richard Alfred Beaupre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having high breakdown voltage and low...
- Patent number 8,310,040
- Issue date Nov 13, 2012
- General Electric Company
- Richard Alfred Beaupre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Busbar electrical power connector
- Patent number 8,257,102
- Issue date Sep 4, 2012
- General Electric Company
- Eladio Clemente Delgado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated metal substrates incorporating advanced cooling
- Patent number 8,232,637
- Issue date Jul 31, 2012
- General Electric Company
- Richard Alfred Beaupre
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module assembly with reduced inductance
- Patent number 8,076,696
- Issue date Dec 13, 2011
- General Electric Company
- Richard Alfred Beaupre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and fabrication method
- Patent number 8,049,338
- Issue date Nov 1, 2011
- General Electric Company
- Eladio Clemente Delgado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and a method for controlling flow of solder
- Patent number 7,919,714
- Issue date Apr 5, 2011
- General Electric Company
- Arun Virupaksha Gowda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gate drive circuitry for non-isolated gate semiconductor devices
- Patent number 7,915,944
- Issue date Mar 29, 2011
- General Electric Company
- Antonio Caiafa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Methods for making millichannel substrate, and cooling device and a...
- Patent number 7,898,807
- Issue date Mar 1, 2011
- General Electric Company
- Richard Alfred Beaupre
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor packaging method and structure
- Patent number 7,829,386
- Issue date Nov 9, 2010
- General Electric Company
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink and cooling and packaging stack for press-packages
- Patent number 7,817,422
- Issue date Oct 19, 2010
- General Electric Company
- Satish Sivarama Gunturi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Photovoltaic integrated building component
- Patent number 7,642,449
- Issue date Jan 5, 2010
- General Electric Company
- Charles Steven Korman
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power circuit package and fabrication method
- Patent number 7,518,236
- Issue date Apr 14, 2009
- General Electric Company
- Eladio Clemente Delgado
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module, and phase leg assembly
- Patent number 7,327,024
- Issue date Feb 5, 2008
- General Electric Company
- Ljubisa Dragoljub Stevanovic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor packaging method and structure
- Patent number 7,262,444
- Issue date Aug 28, 2007
- General Electric Company
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICES, AND METHODS FOR MANUFACTURIN...
- Publication number 20150236151
- Publication date Aug 20, 2015
- GENERAL ELECTRIC COMPANY
- James Jay McMahon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL POWER MODULE
- Publication number 20130075878
- Publication date Mar 28, 2013
- GENERAL ELECTRIC COMPANY
- Eladio Clemente Delgado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER-CONVERTING APPARATUS HAVING IMPROVED ELECTRO-THERMAL CHARACTE...
- Publication number 20130039103
- Publication date Feb 14, 2013
- JOSEPH LUCIAN SMOLENSKI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
FLEXIBLE POWER CONNECTOR
- Publication number 20130029531
- Publication date Jan 31, 2013
- GENERAL ELECTRIC COMPANY
- Eladio Clemente Delgado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING DEVICE FOR A POWER MODULE, AND A RELATED METHOD THEREOF
- Publication number 20120327603
- Publication date Dec 27, 2012
- GENERAL ELECTRIC COMPANY
- Richard Alfred Beaupre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20120329207
- Publication date Dec 27, 2012
- Richard Alfred Beaupre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUSBAR FOR POWER CONVERSION APPLICATIONS
- Publication number 20120217032
- Publication date Aug 30, 2012
- GENERAL ELECTRIC COMPANY
- Richard Alfred Beaupre
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20120146234
- Publication date Jun 14, 2012
- Richard Alfred Beaupre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND FABRICATION METHOD
- Publication number 20120009733
- Publication date Jan 12, 2012
- Eladio Clemente Delgado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Busbar Electrical Power Connector
- Publication number 20110300725
- Publication date Dec 8, 2011
- Eladio Clemente Delgado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD INCLUDING MASK FOR CONTROLLING FLOW OF SOLDER
- Publication number 20110139495
- Publication date Jun 16, 2011
- GENERAL ELECTRIC COMPANY
- ARUN VIRUPAKSHA GOWDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE ASSEMBLY WITH REDUCED INDUCTANCE
- Publication number 20110101515
- Publication date May 5, 2011
- GENERAL ELECTRIC COMPANY
- Richard Alfred Beaupre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK AND METHOD OF FABRICATING SAME
- Publication number 20100302734
- Publication date Dec 2, 2010
- GENERAL ELECTRIC COMPANY
- Richard Alfred Beaupre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATED METAL SUBSTRATES INCORPORATING ADVANCED COOLING
- Publication number 20100277868
- Publication date Nov 4, 2010
- GENERAL ELECTRIC COMPANY
- Richard Alfred Beaupre
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GATE DRIVE CIRCUITRY FOR NON-ISOLATED GATE SEMICONDUCTOR DEVICES
- Publication number 20100271081
- Publication date Oct 28, 2010
- GENERAL ELECTRIC COMPANY
- Antonio Caiafa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
DOUBLE SIDE COOLED POWER MODULE WITH POWER OVERLAY
- Publication number 20100230800
- Publication date Sep 16, 2010
- Richard Alfred Beaupre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MAKING MILLICHANNEL SUBSTRATE, AND COOLING DEVICE AND A...
- Publication number 20100226093
- Publication date Sep 9, 2010
- GENERAL ELECTRIC COMPANY
- Richard Alfred Beaupre
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MILLICHANNEL HEAT SINK, AND STACK AND APPARATUS USING THE SAME
- Publication number 20100175857
- Publication date Jul 15, 2010
- GENERAL ELECTRIC COMPANY
- William Dwight Gerstler
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Low cost anufacturing of micro-channel heatsink
- Publication number 20100157526
- Publication date Jun 24, 2010
- GENERAL ELECTRIC COMPANY
- Richard Alfred Beaupre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK AND COOLING AND PACKAGING STACK FOR PRESS-PACKAGES
- Publication number 20100038058
- Publication date Feb 18, 2010
- GENERAL ELECTRIC COMPANY
- Satish Sivarama Gunturi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ADVANCED AND INTEGRATED COOLING FOR PRESS-PACKAGES
- Publication number 20100038774
- Publication date Feb 18, 2010
- GENERAL ELECTRIC COMPANY
- Richard S. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGING METHOD AND STRUCTURE
- Publication number 20080305582
- Publication date Dec 11, 2008
- General Electric
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND A METHOD FOR CONTROLLING FLOW OF SOLDER
- Publication number 20080277456
- Publication date Nov 13, 2008
- GENERAL ELECTRIC COMPANY
- ARUN VIRUPAKSHA GOWDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE WITH LAMINAR INTERCONNECT
- Publication number 20080054298
- Publication date Mar 6, 2008
- GENERAL ELECTRIC COMPANY
- Ljubisa Dragoljub Stevanovic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR CURRENT SENSING
- Publication number 20080042636
- Publication date Feb 21, 2008
- GENERAL ELECTRIC COMPANY
- GLEN PETER KOSTE
- G01 - MEASURING TESTING
Information Patent Application
POWER SEMICONDUCTOR MODULE AND FABRICATION METHOD
- Publication number 20070235810
- Publication date Oct 11, 2007
- Eladio Clemente Delgado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power circuit package and fabrication method
- Publication number 20070090464
- Publication date Apr 26, 2007
- General Electric Company
- Eladio Clemente Delgado
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power semiconductor packaging method and structure
- Publication number 20070040186
- Publication date Feb 22, 2007
- General Electric Company
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power module, phase leg, and three-phase inverter
- Publication number 20060108684
- Publication date May 25, 2006
- General Electric Company
- Ljubisa Dragoljub Stevanovic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOVOLTAIC INTEGRATED BUILDING COMPONENT
- Publication number 20060042680
- Publication date Mar 2, 2006
- GENERAL ELECTRIC COMPANY
- Charles Steven Korman
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

RICHARD ALFRED BEAUPRE

Person

Patents Grantslast 30 patents

Cooling device for a power module, and a related method thereof

Low cost manufacturing of micro-channel heatsink

Circuit board including mask for controlling flow of solder

Busbar for power conversion applications

Power converting apparatus having improved electro-thermal characte...

Flexible power connector

Method of forming semiconductor device package having high breakdow...

Coaxial power module

Power semiconductor module and fabrication method

Double side cooled power module with power overlay

Semiconductor device package having high breakdown voltage and low...

Busbar electrical power connector

Insulated metal substrates incorporating advanced cooling

Power module assembly with reduced inductance

Power semiconductor module and fabrication method

System and a method for controlling flow of solder

Gate drive circuitry for non-isolated gate semiconductor devices

Methods for making millichannel substrate, and cooling device and a...

Power semiconductor packaging method and structure

Heat sink and cooling and packaging stack for press-packages

Photovoltaic integrated building component

Power circuit package and fabrication method

Power module, and phase leg assembly

Power semiconductor packaging method and structure

Patents Applicationslast 30 patents

SILICON CARBIDE SEMICONDUCTOR DEVICES, AND METHODS FOR MANUFACTURIN...

COAXIAL POWER MODULE

POWER-CONVERTING APPARATUS HAVING IMPROVED ELECTRO-THERMAL CHARACTE...

FLEXIBLE POWER CONNECTOR

COOLING DEVICE FOR A POWER MODULE, AND A RELATED METHOD THEREOF

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THEREOF

BUSBAR FOR POWER CONVERSION APPLICATIONS

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THEREOF

POWER SEMICONDUCTOR MODULE AND FABRICATION METHOD

Busbar Electrical Power Connector

CIRCUIT BOARD INCLUDING MASK FOR CONTROLLING FLOW OF SOLDER

POWER MODULE ASSEMBLY WITH REDUCED INDUCTANCE

HEATSINK AND METHOD OF FABRICATING SAME

INSULATED METAL SUBSTRATES INCORPORATING ADVANCED COOLING

GATE DRIVE CIRCUITRY FOR NON-ISOLATED GATE SEMICONDUCTOR DEVICES

DOUBLE SIDE COOLED POWER MODULE WITH POWER OVERLAY

METHODS FOR MAKING MILLICHANNEL SUBSTRATE, AND COOLING DEVICE AND A...

MILLICHANNEL HEAT SINK, AND STACK AND APPARATUS USING THE SAME

Low cost anufacturing of micro-channel heatsink

HEAT SINK AND COOLING AND PACKAGING STACK FOR PRESS-PACKAGES

ADVANCED AND INTEGRATED COOLING FOR PRESS-PACKAGES

POWER SEMICONDUCTOR PACKAGING METHOD AND STRUCTURE

SYSTEM AND A METHOD FOR CONTROLLING FLOW OF SOLDER

POWER MODULE WITH LAMINAR INTERCONNECT

SYSTEM AND METHOD FOR CURRENT SENSING

POWER SEMICONDUCTOR MODULE AND FABRICATION METHOD

Power circuit package and fabrication method

Power semiconductor packaging method and structure

Power module, phase leg, and three-phase inverter

PHOTOVOLTAIC INTEGRATED BUILDING COMPONENT