Richard C. Retallick

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Stamford, CT, US

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Patents Grantslast 30 patents

Information Patent Grant
Process for preparing a non-conductive substrate for electroplating
- Patent number 7,214,304
- Issue date May 8, 2007
- Hyunjung Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of cleaning copper surfaces in the manufacture of printed c...
- Patent number 7,063,800
- Issue date Jun 20, 2006
- Ying Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for improving adhesion to polymide surfaces
- Patent number 5,213,840
- Issue date May 25, 1993
- MacDermid, Incorporated
- Richard C. Retallick
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrolytic method for the dissolution of copper particles formed...
- Patent number 4,938,853
- Issue date Jul 3, 1990
- MacDermid, Incorporated
- Richard C. Retallick
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Direct Metallization Process
- Publication number 20100034965
- Publication date Feb 11, 2010
- Richard C. Retallick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for preparing a non-conductive substrate for electroplating
- Publication number 20060076245
- Publication date Apr 13, 2006
- Hyunjung Lee
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Methods of cleaning copper surfaces in the manufacture of printed c...
- Publication number 20050098538
- Publication date May 12, 2005
- Ying Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...