Richard Chen

Person

  • Phoenix, AZ, US

Patents Grantslast 30 patents

  • Information Patent Grant

    Shielded electronic component package

    • Patent number 12,040,305
    • Issue date Jul 16, 2024
    • Amkor Technology Singapore Holding Pte Ltd.
    • Jong Ok Chun
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Shielded electronic component package

    • Patent number 11,646,290
    • Issue date May 9, 2023
    • Amkor Technology Singapore Holding Pte Ltd.
    • Jong Ok Chun
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Shielded electronic component package

    • Patent number 11,031,366
    • Issue date Jun 8, 2021
    • Amkor Technology Singapore Pte. Ltd.
    • Jong Ok Chun
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Shielded electronic component package

    • Patent number 10,424,556
    • Issue date Sep 24, 2019
    • Amkor Technology, Inc.
    • Jong Ok Chun
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Shield lid interconnect package and method

    • Patent number 9,433,117
    • Issue date Aug 30, 2016
    • Amkor Technology, Inc.
    • Jong Ok Chun
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Top feature package and method

    • Patent number 8,199,518
    • Issue date Jun 12, 2012
    • Amkor Technology, Inc.
    • Jong Ok Chun
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    SHIELDED ELECTRONIC COMPONENT PACKAGE

    • Publication number 20230275061
    • Publication date Aug 31, 2023
    • Amkor Technology Singapore Holding Pte. Ltd.
    • Jong Ok Chun
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SHIELDED ELECTRONIC COMPONENT PACKAGE

    • Publication number 20220052016
    • Publication date Feb 17, 2022
    • Amkor Technology Singapore Holding Pte. Ltd
    • Jong Ok Chun
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SHIELDED ELECTRONIC COMPONENT PACKAGE

    • Publication number 20190371760
    • Publication date Dec 5, 2019
    • Amkor Technology, Inc.
    • Jong Ok Chun
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SHIELDED ELECTRONIC COMPONENT PACKAGE

    • Publication number 20160351525
    • Publication date Dec 1, 2016
    • Amkor Technology, Inc.
    • Jong Ok Chun
    • H01 - BASIC ELECTRIC ELEMENTS