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Richard Chu
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Taipei City, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Hermetic wafer level packaging
Patent number
9,337,168
Issue date
May 10, 2016
Taiwan Semiconductor Manufacturing Company, Ltd.
Richard Chu
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Hermetic wafer level packaging
Patent number
8,648,468
Issue date
Feb 11, 2014
Taiwan Semiconductor Manufacturing Company, Ltd.
Richard Chu
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Wafer level packaging bond
Patent number
8,647,962
Issue date
Feb 11, 2014
Taiwan Semiconductor Manufacturing Company, Ltd.
Martin Liu
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor having a high aspect ratio via
Patent number
8,598,687
Issue date
Dec 3, 2013
Taiwan Semiconductor Manufacturing Company, Ltd.
Yuan-Chih Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor having a high aspect ratio via
Patent number
8,445,380
Issue date
May 21, 2013
Taiwan Semiconductor Manufacturing Company, Ltd.
Yuan-Chih Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor having a high aspect ratio via
Patent number
8,207,595
Issue date
Jun 26, 2012
Taiwan Semiconductor Manufacturing Company, Ltd.
Yuan-Chih Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Hermetic Wafer Level Packaging
Publication number
20140154841
Publication date
Jun 5, 2014
Taiwan Semiconductor Manufacturing Company, Ltd.
Richard Chu
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
WAFER LEVEL PACKAGING BOND
Publication number
20140138853
Publication date
May 22, 2014
Taiwan Semiconductor Manufacturing Company, Ltd.
Martin Liu
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SEMICONDUCTOR HAVING A HIGH ASPECT RATIO VIA
Publication number
20120235300
Publication date
Sep 20, 2012
Taiwan Semiconductor Manufacturing Company, Ltd.
Yuan-Chih Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR HAVING A HIGH ASPECT RATIO VIA
Publication number
20120238091
Publication date
Sep 20, 2012
Taiwan Semiconductor Manufacturing Company, Ltd.
Yuan-Chih Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR HAVING A HIGH ASPECT RATIO VIA
Publication number
20120080761
Publication date
Apr 5, 2012
Taiwan Semiconductor Manufacturing Company, Ltd.
Yuan-Chih Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Hermetic Wafer Level Packaging
Publication number
20120025389
Publication date
Feb 2, 2012
Taiwan Semiconductor Manufacturing Company, Ltd.
Richard Chu
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Wafer Level Packaging Bond
Publication number
20110233621
Publication date
Sep 29, 2011
Taiwan Semiconductor Manufacturing Company, Ltd.
Martin Liu
B81 - MICRO-STRUCTURAL TECHNOLOGY