Richard F. Hill

Person

Cleveland, OH, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for establishing thermal joints between heat spreaders or l...
- Patent number 11,776,868
- Issue date Oct 3, 2023
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for establishing thermal joints between heat spreaders or l...
- Patent number 11,610,831
- Issue date Mar 21, 2023
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compressible foamed thermal interface materials and methods of maki...
- Patent number 11,276,662
- Issue date Mar 15, 2022
- Vijayaraghavan Rajagopal
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Methods for establishing thermal joints between heat spreaders or l...
- Patent number 10,964,617
- Issue date Mar 30, 2021
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for establishing thermal joints between heat spreaders or l...
- Patent number 10,600,714
- Issue date Mar 24, 2020
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for establishing thermal joints between heat spreaders or l...
- Patent number 10,373,891
- Issue date Aug 6, 2019
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interface materials
- Patent number 9,515,004
- Issue date Dec 6, 2016
- Laird Technologies, Inc.
- Jason L. Strader
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal interface material assemblies and related methods
- Patent number 9,330,998
- Issue date May 3, 2016
- Laird Technologies, Inc.
- Jason L. Strader
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit assemblies including thermoelectric modules
- Patent number 9,322,580
- Issue date Apr 26, 2016
- Laird Technologies, Inc.
- Jeffrey Gerard Hershberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assemblies and methods for dissipating heat from handheld electroni...
- Patent number 9,258,928
- Issue date Feb 9, 2016
- Laird Technologies, Inc.
- Richard F. Hill
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Compliant multilayered thermally-conductive interface assemblies
- Patent number 9,222,735
- Issue date Dec 29, 2015
- Laird Technologies, Inc.
- Richard F. Hill
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Memory modules including compliant multilayered thermally-conductiv...
- Patent number 8,837,151
- Issue date Sep 16, 2014
- Laird Technologies, Inc.
- Richard F. Hill
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit assemblies including thermoelectric modules
- Patent number 8,649,179
- Issue date Feb 11, 2014
- Laird Technologies, Inc.
- Jeffrey Gerard Hershberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interface material assemblies, and related methods
- Patent number 8,647,752
- Issue date Feb 11, 2014
- Laird Technologies, Inc.
- Jason L Strader
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Assemblies and methods for dissipating heat from handheld electroni...
- Patent number 8,477,499
- Issue date Jul 2, 2013
- Laird Technologies, Inc.
- Richard F. Hill
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Memory modules including compliant multilayered thermally-conductiv...
- Patent number 8,081,468
- Issue date Dec 20, 2011
- Laird Technologies, Inc.
- Richard F. Hill
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Assemblies and methods for dissipating heat from handheld electroni...
- Patent number 7,965,514
- Issue date Jun 21, 2011
- Laird Technologies, Inc.
- Richard F. Hill
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Flexible assemblies with integrated thermoelectric modules suitable...
- Patent number 7,765,811
- Issue date Aug 3, 2010
- Laird Technologies, Inc.
- Jeffrey Gerard Hershberger
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Thermal interface assembly and method for forming a thermal interfa...
- Patent number 7,369,411
- Issue date May 6, 2008
- Thermagon, Inc.
- Richard Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreading thermal interface structure
- Patent number 7,078,109
- Issue date Jul 18, 2006
- Thermagon Inc.
- Richard Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface structure for placement between a microelectronic...
- Patent number 6,940,721
- Issue date Sep 6, 2005
- Richard F. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink and heat spreader assembly
- Patent number 6,849,941
- Issue date Feb 1, 2005
- Thermagon, Inc.
- Richard Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer structure and method for forming a thermal interface wi...
- Patent number 6,761,928
- Issue date Jul 13, 2004
- Thermagon, Inc.
- Richard F. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer structure having a thermal interface with low contact r...
- Patent number 6,617,517
- Issue date Sep 9, 2003
- Thermagon, Inc.
- Richard F. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer structure and method for forming a thermal interface wi...
- Patent number 6,372,997
- Issue date Apr 16, 2002
- Thermagon, Inc.
- Richard F. Hill
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKI...
- Publication number 20240105663
- Publication date Mar 28, 2024
- Laird Technologies, Inc.
- Vijayaraghavan RAJAGOPAL
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
METHODS FOR ESTABLISHING THERMAL JOINTS BETWEEN HEAT SPREADERS OR L...
- Publication number 20230223315
- Publication date Jul 13, 2023
- Laird Technologies, Inc.
- Jason L. STRADER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKI...
- Publication number 20220246572
- Publication date Aug 4, 2022
- Laird Technologies, Inc.
- Vijayaraghavan RAJAGOPAL
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
METHODS FOR ESTABLISHING THERMAL JOINTS BETWEEN HEAT SPREADERS OR L...
- Publication number 20210202343
- Publication date Jul 1, 2021
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods For Establishing Thermal Joints Between Heat Spreaders Or L...
- Publication number 20200219785
- Publication date Jul 9, 2020
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for Establishing Thermal Joints Between Heat Spreaders or L...
- Publication number 20190371697
- Publication date Dec 5, 2019
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Compressible Foamed Thermal Interface Materials and Methods of Maki...
- Publication number 20190348388
- Publication date Nov 14, 2019
- Laird Technologies, Inc.
- Vijayaraghavan RAJAGOPAL
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
REUSABLE THERMOPLASTIC THERMAL INTERFACE MATERIALS AND METHODS FOR...
- Publication number 20160315030
- Publication date Oct 27, 2016
- Laird Technologies, Inc.
- Jason L. Strader
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMAL INTERFACE MATERIALS WITH THIN FILM SEALANTS
- Publication number 20150334871
- Publication date Nov 19, 2015
- Laird Technologies, Inc.
- Richard F. Hill
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermal Solutions and Methods for Dissipating Heat from Electronic...
- Publication number 20150301568
- Publication date Oct 22, 2015
- Laird Technologies, Inc.
- Richard F. Hill
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMAL INTERFACE MATERIAL ASSEMBLIES AND RELATED METHODS
- Publication number 20150305189
- Publication date Oct 22, 2015
- Laird Technologies, Inc.
- Jason L. Strader
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT MULTILAYERED THERMALLY-CONDUCTIVE INTERFACE ASSEMBLIES
- Publication number 20140374080
- Publication date Dec 25, 2014
- Richard F. Hill
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Methods For Establishing Thermal Joints Between Heat Spreaders and...
- Publication number 20140368992
- Publication date Dec 18, 2014
- Jason L. Strader
- B32 - LAYERED PRODUCTS
Information Patent Application
METHODS FOR ESTABLISHING THERMAL JOINTS BETWEEN HEAT SPREADERS OR L...
- Publication number 20140367847
- Publication date Dec 18, 2014
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL INTERFACE MATERIALS
- Publication number 20140262191
- Publication date Sep 18, 2014
- Laird Technologies, Inc.
- Jason L. Strader
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CIRCUIT ASSEMBLIES INCLUDING THERMOELECTRIC MODULES
- Publication number 20140150839
- Publication date Jun 5, 2014
- Laird Technologies, Inc.
- Jeffrey Gerard Hershberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLIES AND METHODS FOR DISSIPATING HEAT FROM HANDHELD ELECTRONI...
- Publication number 20130265722
- Publication date Oct 10, 2013
- Richard F. Hill
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMAL INTERFACE MATERIALS AND METHODS FOR PROCESSING THE SAME
- Publication number 20120292005
- Publication date Nov 22, 2012
- Laird Technologies, Inc.
- Karen Bruzda
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CIRCUIT ASSEMBLIES INCLUDING THERMOELECTRIC MODULES
- Publication number 20120201008
- Publication date Aug 9, 2012
- Laird Technologies, Inc.
- Jeffrey Gerard Hershberger
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
Thermoelectric Modules, Thermoelectric Assemblies, and Related Methods
- Publication number 20120174956
- Publication date Jul 12, 2012
- Laird Technologies, Inc.
- Robert Michael Smythe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Modules Including Compliant Multilayered Thermally-Conductiv...
- Publication number 20120087094
- Publication date Apr 12, 2012
- LAIRD TECHNOLOGIES, INC.
- Richard F. Hill
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
POTATO SHAPED GRAPHITE FILLER, THERMAL INTERFACE MATERIALS AND EMI...
- Publication number 20120080639
- Publication date Apr 5, 2012
- Laird Technologies, Inc.
- Karen Bruzda
- C01 - INORGANIC CHEMISTRY
Information Patent Application
COMPLIANT MULTILAYERED THERMALLY-CONDUCTIVE INTERFACE ASSEMBLIES HA...
- Publication number 20120061135
- Publication date Mar 15, 2012
- Laird Technologies, Inc.
- Richard F. Hill
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive Films for EMI Shielding Applications
- Publication number 20120012382
- Publication date Jan 19, 2012
- Laird Technologies, Inc.
- Douglas McBain
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMAL INTERFACE MATERIAL ASSEMBLIES, AND RELATED METHODS
- Publication number 20110310562
- Publication date Dec 22, 2011
- Laird Technologies, Inc.
- Jason L. Strader
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ASSEMBLIES AND METHODS FOR DISSIPATING HEAT FROM HANDHELD ELECTRONI...
- Publication number 20110242764
- Publication date Oct 6, 2011
- Laird Technologies, Inc.
- Richard F. Hill
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMOELECTRIC MODULES AND RELATED METHODS
- Publication number 20110030754
- Publication date Feb 10, 2011
- Laird Technologies, Inc.
- Robert Michael Smythe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE ASSEMBLIES WITH INTEGRATED THERMOELECTRIC MODULES SUITABLE...
- Publication number 20110000516
- Publication date Jan 6, 2011
- Laird Technologies, Inc.
- Jeffrey Gerard Hershberger
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
MEMORY MODULES INCLUDING COMPLIANT MULTILAYERED THERMALLY-CONDUCTIV...
- Publication number 20100321895
- Publication date Dec 23, 2010
- Laird Technologies, Inc.
- Richard F. Hill
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COMPLIANT MULTILAYERED THERMALLY-CONDUCTIVE INTERFACE ASSEMBLIES
- Publication number 20100321897
- Publication date Dec 23, 2010
- Laird Technologies, Inc.
- Richard F. Hill
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Richard F. Hill

Person

Patents Grantslast 30 patents

Methods for establishing thermal joints between heat spreaders or l...

Methods for establishing thermal joints between heat spreaders or l...

Compressible foamed thermal interface materials and methods of maki...

Methods for establishing thermal joints between heat spreaders or l...

Methods for establishing thermal joints between heat spreaders or l...

Methods for establishing thermal joints between heat spreaders or l...

Thermal interface materials

Thermal interface material assemblies and related methods

Circuit assemblies including thermoelectric modules

Assemblies and methods for dissipating heat from handheld electroni...

Compliant multilayered thermally-conductive interface assemblies

Memory modules including compliant multilayered thermally-conductiv...

Circuit assemblies including thermoelectric modules

Thermal interface material assemblies, and related methods

Assemblies and methods for dissipating heat from handheld electroni...

Memory modules including compliant multilayered thermally-conductiv...

Assemblies and methods for dissipating heat from handheld electroni...

Flexible assemblies with integrated thermoelectric modules suitable...

Thermal interface assembly and method for forming a thermal interfa...

Heat spreading thermal interface structure

Thermal interface structure for placement between a microelectronic...

Heat sink and heat spreader assembly

Multi-layer structure and method for forming a thermal interface wi...

Multi-layer structure having a thermal interface with low contact r...

Multi-layer structure and method for forming a thermal interface wi...

Patents Applicationslast 30 patents

COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKI...

METHODS FOR ESTABLISHING THERMAL JOINTS BETWEEN HEAT SPREADERS OR L...

COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKI...

METHODS FOR ESTABLISHING THERMAL JOINTS BETWEEN HEAT SPREADERS OR L...

Methods For Establishing Thermal Joints Between Heat Spreaders Or L...

Methods for Establishing Thermal Joints Between Heat Spreaders or L...

Compressible Foamed Thermal Interface Materials and Methods of Maki...

REUSABLE THERMOPLASTIC THERMAL INTERFACE MATERIALS AND METHODS FOR...

THERMAL INTERFACE MATERIALS WITH THIN FILM SEALANTS

Thermal Solutions and Methods for Dissipating Heat from Electronic...

THERMAL INTERFACE MATERIAL ASSEMBLIES AND RELATED METHODS

COMPLIANT MULTILAYERED THERMALLY-CONDUCTIVE INTERFACE ASSEMBLIES

Methods For Establishing Thermal Joints Between Heat Spreaders and...

METHODS FOR ESTABLISHING THERMAL JOINTS BETWEEN HEAT SPREADERS OR L...

THERMAL INTERFACE MATERIALS

CIRCUIT ASSEMBLIES INCLUDING THERMOELECTRIC MODULES

ASSEMBLIES AND METHODS FOR DISSIPATING HEAT FROM HANDHELD ELECTRONI...

THERMAL INTERFACE MATERIALS AND METHODS FOR PROCESSING THE SAME

CIRCUIT ASSEMBLIES INCLUDING THERMOELECTRIC MODULES

Thermoelectric Modules, Thermoelectric Assemblies, and Related Methods

Memory Modules Including Compliant Multilayered Thermally-Conductiv...

POTATO SHAPED GRAPHITE FILLER, THERMAL INTERFACE MATERIALS AND EMI...

COMPLIANT MULTILAYERED THERMALLY-CONDUCTIVE INTERFACE ASSEMBLIES HA...

Conductive Films for EMI Shielding Applications

THERMAL INTERFACE MATERIAL ASSEMBLIES, AND RELATED METHODS

ASSEMBLIES AND METHODS FOR DISSIPATING HEAT FROM HANDHELD ELECTRONI...

THERMOELECTRIC MODULES AND RELATED METHODS

FLEXIBLE ASSEMBLIES WITH INTEGRATED THERMOELECTRIC MODULES SUITABLE...

MEMORY MODULES INCLUDING COMPLIANT MULTILAYERED THERMALLY-CONDUCTIV...

COMPLIANT MULTILAYERED THERMALLY-CONDUCTIVE INTERFACE ASSEMBLIES