Richard F. Shortt

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LaGrangeville, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for removing a bonded lid from a substrate
- Patent number 6,444,082
- Issue date Sep 3, 2002
- International Business Machines Corporation
- Barrie C. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for repairing semiconductor substrates
- Patent number 5,493,076
- Issue date Feb 20, 1996
- International Business Machines Corporation
- James M. Levite
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for repairing semiconductor substrates
- Patent number 5,446,961
- Issue date Sep 5, 1995
- International Business Machines Corporation
- James M. Levite
- H01 - BASIC ELECTRIC ELEMENTS