Richard F. Vreeland

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Contact over active gate structures with metal oxide-caped contacts...
- Patent number 12,087,836
- Issue date Sep 10, 2024
- Intel Corporation
- Rami Hourani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of fabrication
- Patent number 11,887,887
- Issue date Jan 30, 2024
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures with metal oxide-caped contacts...
- Patent number 11,837,644
- Issue date Dec 5, 2023
- Intel Corporation
- Rami Hourani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit components with dummy structures
- Patent number 11,784,121
- Issue date Oct 10, 2023
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for improved electrical contact between bond...
- Patent number 11,784,123
- Issue date Oct 10, 2023
- Intel Corporation
- Richard Vreeland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization barrier structures for bonded integrated circuit inte...
- Patent number 11,532,558
- Issue date Dec 20, 2022
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of fabrication
- Patent number 11,404,307
- Issue date Aug 2, 2022
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed metal interconnects to mitigate EPE-related via shorting
- Patent number 11,367,684
- Issue date Jun 21, 2022
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit components with dummy structures
- Patent number 11,328,992
- Issue date May 10, 2022
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for improved electrical contact between bond...
- Patent number 11,289,421
- Issue date Mar 29, 2022
- Intel Corporation
- Richard Vreeland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming thin film resistor structures utilizing intercon...
- Patent number 11,201,114
- Issue date Dec 14, 2021
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES WITH METAL OXIDE-CAPED CONTACTS...
- Publication number 20240047543
- Publication date Feb 8, 2024
- Intel Corporation
- Rami HOURANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS OF FABRICATION
- Publication number 20220336267
- Publication date Oct 20, 2022
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COMPONENTS WITH DUMMY STRUCTURES
- Publication number 20220216149
- Publication date Jul 7, 2022
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS & STRUCTURES FOR IMPROVED ELECTRICAL CONTACT BETWEEN BONDED...
- Publication number 20220181251
- Publication date Jun 9, 2022
- Intel Corporation
- Richard Vreeland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATION BARRIER STRUCTURES FOR BONDED INTEGRATED CIRCUIT INTE...
- Publication number 20210098387
- Publication date Apr 1, 2021
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS & STRUCTURES FOR IMPROVED ELECTRICAL CONTACT BETWEEN BONDED...
- Publication number 20210098359
- Publication date Apr 1, 2021
- Intel Corporation
- Richard Vreeland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NTERCONNECT STRUCTURES AND METHODS OF FABRICATION
- Publication number 20210098360
- Publication date Apr 1, 2021
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES WITH METAL OXIDE-CAPED CONTACTS...
- Publication number 20210091194
- Publication date Mar 25, 2021
- Intel Corporation
- Rami HOURANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COMPONENTS WITH DUMMY STRUCTURES
- Publication number 20200350246
- Publication date Nov 5, 2020
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED METAL INTERCONNECTS TO MITIGATE EPE-RELATED VIA SHORTING
- Publication number 20190355665
- Publication date Nov 21, 2019
- Intel Corporation
- Ehren MANNEBACH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING THIN FILM RESISTOR STRUCTURES UTILIZING INTERCON...
- Publication number 20190326214
- Publication date Oct 24, 2019
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS

Richard F. Vreeland

Person

Patents Grantslast 30 patents

Contact over active gate structures with metal oxide-caped contacts...

Interconnect structures and methods of fabrication

Contact over active gate structures with metal oxide-caped contacts...

Integrated circuit components with dummy structures

Methods and structures for improved electrical contact between bond...

Metallization barrier structures for bonded integrated circuit inte...

Interconnect structures and methods of fabrication

Recessed metal interconnects to mitigate EPE-related via shorting

Integrated circuit components with dummy structures

Methods and structures for improved electrical contact between bond...

Methods of forming thin film resistor structures utilizing intercon...

Patents Applicationslast 30 patents

CONTACT OVER ACTIVE GATE STRUCTURES WITH METAL OXIDE-CAPED CONTACTS...

INTERCONNECT STRUCTURES AND METHODS OF FABRICATION

INTEGRATED CIRCUIT COMPONENTS WITH DUMMY STRUCTURES

METHODS & STRUCTURES FOR IMPROVED ELECTRICAL CONTACT BETWEEN BONDED...

METALLIZATION BARRIER STRUCTURES FOR BONDED INTEGRATED CIRCUIT INTE...

METHODS & STRUCTURES FOR IMPROVED ELECTRICAL CONTACT BETWEEN BONDED...

NTERCONNECT STRUCTURES AND METHODS OF FABRICATION

CONTACT OVER ACTIVE GATE STRUCTURES WITH METAL OXIDE-CAPED CONTACTS...

INTEGRATED CIRCUIT COMPONENTS WITH DUMMY STRUCTURES

RECESSED METAL INTERCONNECTS TO MITIGATE EPE-RELATED VIA SHORTING

METHODS OF FORMING THIN FILM RESISTOR STRUCTURES UTILIZING INTERCON...