Richard Gruenwald

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Potsdam, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming packaged semiconductor die with micro-cavity
- Patent number 11,538,726
- Issue date Dec 27, 2022
- Microchip Technology Inc.
- Matthias Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor die with micro-cavity
- Patent number 11,244,876
- Issue date Feb 8, 2022
- Microchip Technology Inc.
- Matthias Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization for a cavity housing and a nonmagnetic sealed cavity...
- Patent number 9,023,442
- Issue date May 5, 2015
- Vectron International GmbH
- Richard Gruenwald
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
Method for Forming Packaged Semiconductor Die with Micro-Cavity
- Publication number 20220115282
- Publication date Apr 14, 2022
- Microchip Technology Inc.
- Matthias Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Die with Micro-Cavity and Method for Forming...
- Publication number 20210111082
- Publication date Apr 15, 2021
- Microchip Technology Inc.
- Matthias Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallization for a cavity housing and a nonmagnetic sealed cavity...
- Publication number 20120177853
- Publication date Jul 12, 2012
- VECTRON INTERNATIONAL GMBH & CO. KG
- Richard Gruenwald
- H03 - BASIC ELECTRONIC CIRCUITRY