Richard H. J. Fierkens

Person

6914 Ae Herwen, NL

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus for indexing magazines holding molded leadframes and a me...
- Patent number 6,000,901
- Issue date Dec 14, 1999
- COFI International
- Richard H. J. Fierkens
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method of post mold curing plastic encapsulated semiconductor chips...
- Patent number 5,830,403
- Issue date Nov 3, 1998
- Richard H. J. Fierkens
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for forming encapsulated semicondcutor chips
- Patent number 5,690,885
- Issue date Nov 25, 1997
- Richard H. J. Fierkens
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Automatic pellet feeding apparatus for use in forming encapsulated...
- Patent number 5,647,472
- Issue date Jul 15, 1997
- Richard H. J. Fierkens
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Automatic post mold curing apparatus for use in providing encapsula...
- Patent number 5,622,731
- Issue date Apr 22, 1997
- Richard H. J. Fierkens
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Integrated circuit package and method of making the same
- Patent number 5,578,871
- Issue date Nov 26, 1996
- Richard H. J. Fierkens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromechanical press and method of operating
- Patent number 5,531,014
- Issue date Jul 2, 1996
- Richard H. J. Fierkens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromechanical press and method of operating
- Patent number 5,493,768
- Issue date Feb 27, 1996
- Richard H. J. Fierkens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automatic plunger apparatus for use in forming encapsulated semicon...
- Patent number 5,478,226
- Issue date Dec 26, 1995
- Richard H. J. Fierkens
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Modular electromechanical press and method therefor
- Patent number 5,443,101
- Issue date Aug 22, 1995
- Richard H. J. Fierkens
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package for a semiconductor device including a lead shaping assembly
- Patent number 5,396,933
- Issue date Mar 14, 1995
- Richard H. J. Fierkens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress-free semiconductor leadframe
- Patent number 5,355,018
- Issue date Oct 11, 1994
- Richard H. J. Fierkens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compression-cavity mold for plastic encapsulation of thin-package i...
- Patent number 5,326,243
- Issue date Jul 5, 1994
- Richard H. J. Fierkens
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for drilling cooling holes in turbine blades
- Patent number 5,306,401
- Issue date Apr 26, 1994
- Richard H. J. Fierkens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame cutting apparatus for integrated circuit packages
- Patent number 5,291,814
- Issue date Mar 8, 1994
- Richard H. J. Fierkens
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Plastic encapsulation apparatus for an integrated circuit lead fram...
- Patent number 5,275,546
- Issue date Jan 4, 1994
- Richard H. J. Fierkens
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Tube-shaped package for a semiconductor device and method therefor
- Patent number 5,226,226
- Issue date Jul 13, 1993
- Richard H. J. Fierkens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging a semiconductor device
- Patent number 5,155,902
- Issue date Oct 20, 1992
- Richard H. J. Fierkens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit lead frame positioner apparatus and method
- Patent number 5,155,901
- Issue date Oct 20, 1992
- Richard H. J. Fierkens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame cutting apparatus for various sized integrated circuit p...
- Patent number 5,146,662
- Issue date Sep 15, 1992
- Richard H. J. Fierkens
- H01 - BASIC ELECTRIC ELEMENTS

Richard H. J. Fierkens

Person

Patents Grantslast 30 patents

Apparatus for indexing magazines holding molded leadframes and a me...

Method of post mold curing plastic encapsulated semiconductor chips...

Method for forming encapsulated semicondcutor chips

Automatic pellet feeding apparatus for use in forming encapsulated...

Automatic post mold curing apparatus for use in providing encapsula...

Integrated circuit package and method of making the same

Electromechanical press and method of operating

Electromechanical press and method of operating

Automatic plunger apparatus for use in forming encapsulated semicon...

Modular electromechanical press and method therefor

Package for a semiconductor device including a lead shaping assembly

Stress-free semiconductor leadframe

Compression-cavity mold for plastic encapsulation of thin-package i...

Method for drilling cooling holes in turbine blades

Lead frame cutting apparatus for integrated circuit packages

Plastic encapsulation apparatus for an integrated circuit lead fram...

Tube-shaped package for a semiconductor device and method therefor

Method of packaging a semiconductor device

Integrated circuit lead frame positioner apparatus and method

Lead frame cutting apparatus for various sized integrated circuit p...