Richard Handly Shanaman III

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Richland, PA, US

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Patents Applicationslast 30 patents

Information Patent Application
Die bonded device and method for transistor packages
- Publication number 20060108672
- Publication date May 25, 2006
- John M. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat sink formed of multiple metal layers on backside of integrated...
- Publication number 20050287952
- Publication date Dec 29, 2005
- Vivian Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor packaging techniques for use with non-ceramic packages
- Publication number 20050191793
- Publication date Sep 1, 2005
- John McKenna Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with improved thermal characteristics
- Publication number 20050184385
- Publication date Aug 25, 2005
- John McKenna Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor deivce configured for reducing post-fabrication damage
- Publication number 20050173024
- Publication date Aug 11, 2005
- John M. Brennan
- H01 - BASIC ELECTRIC ELEMENTS