Richard Hurtubise

Person

Clinton, CT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and wet chemical compositions for diffusion barrier formation
- Patent number 12,157,944
- Issue date Dec 3, 2024
- MacDermid Enthone Inc.
- Richard W. Hurtubise
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and wet chemical compositions for diffusion barrier formation
- Patent number 11,846,018
- Issue date Dec 19, 2023
- MacDermid Enthone Inc.
- Richard W. Hurtubise
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper deposition in wafer level packaging of integrated circuits
- Patent number 11,697,884
- Issue date Jul 11, 2023
- MacDermid Enthone Inc.
- Thomas Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electrodeposition in microelectronics
- Patent number RE49202
- Issue date Sep 6, 2022
- MacDermid Enthone Inc.
- Vincent Paneccasio
Information Patent Grant
Copper deposition in wafer level packaging of integrated circuits
- Patent number 11,124,888
- Issue date Sep 21, 2021
- MacDermid Enthone Inc.
- Thomas Richardson
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Copper filling of through silicon vias
- Patent number 10,221,496
- Issue date Mar 5, 2019
- MacDermid Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and composition for electrodeposition of copper in microelec...
- Patent number 9,613,858
- Issue date Apr 4, 2017
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electrodeposition in microelectronics
- Patent number 9,493,884
- Issue date Nov 15, 2016
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Defect reduction in electrodeposited copper for semiconductor appli...
- Patent number 9,222,188
- Issue date Dec 29, 2015
- Enthone Inc.
- John Commander
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and composition for electrodeposition of copper in microelec...
- Patent number 8,771,495
- Issue date Jul 8, 2014
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electrodeposition in microelectronics
- Patent number 8,608,933
- Issue date Dec 17, 2013
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and composition for electrodeposition of copper in microelec...
- Patent number 8,388,824
- Issue date Mar 5, 2013
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electrodeposition in microelectronics
- Patent number 8,002,962
- Issue date Aug 23, 2011
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Surface preparation process for damascene copper deposition
- Patent number 7,998,859
- Issue date Aug 16, 2011
- Enthone Inc.
- Qingyun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper deposition for filling features in manufacture of microelect...
- Patent number 7,968,455
- Issue date Jun 28, 2011
- Enthone Inc.
- Xuan Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper electrodeposition in microelectronics
- Patent number 7,815,786
- Issue date Oct 19, 2010
- Enthone Inc.
- Vincent Paneccasio, Jr.
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Manufacture of electroless cobalt deposition compositions for micro...
- Patent number 7,704,306
- Issue date Apr 27, 2010
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper metallization of through silicon via
- Patent number 7,670,950
- Issue date Mar 2, 2010
- Enthone Inc.
- Thomas B. Richardson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Defectivity and process control of electroless deposition in microe...
- Patent number 7,615,491
- Issue date Nov 10, 2009
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Defectivity and process control of electroless deposition in microe...
- Patent number 7,611,987
- Issue date Nov 3, 2009
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Defectivity and process control of electroless deposition in microe...
- Patent number 7,611,988
- Issue date Nov 3, 2009
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Defectivity and process control of electroless deposition in microe...
- Patent number 7,410,899
- Issue date Aug 12, 2008
- Enthone, Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Capping of metal interconnects in integrated circuit electronic dev...
- Patent number 7,393,781
- Issue date Jul 1, 2008
- Enthone Inc.
- Eric Yakobson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cobalt and nickel electroless plating in microelectronic devices
- Patent number 7,332,193
- Issue date Feb 19, 2008
- Enthone, Inc.
- Charles Valverde
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Defect reduction in electrodeposited copper for semiconductor appli...
- Patent number 7,316,772
- Issue date Jan 8, 2008
- Enthone Inc.
- John Commander
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper electrodeposition in microelectronics
- Patent number 7,303,992
- Issue date Dec 4, 2007
- Enthone Inc.
- Vincent Paneccasio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping of metal interconnects in integrated circuit electronic dev...
- Patent number 7,268,074
- Issue date Sep 11, 2007
- Enthone, Inc.
- Eric Yakobson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroplating chemistry for the CU filling of submicron features o...
- Patent number 6,776,893
- Issue date Aug 17, 2004
- Enthone Inc.
- Elena H. Too
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper metallization of silicon wafers using insoluble anodes
- Patent number 6,024,856
- Issue date Feb 15, 2000
- Enthone-OMI, Inc.
- Juan B. Haydu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Copper Electrodeposition in Microelectronics
- Publication number 20240018678
- Publication date Jan 18, 2024
- MacDermid Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and Wet Chemical Compositions for Diffusion Barrier Formation
- Publication number 20230407467
- Publication date Dec 21, 2023
- MacDermid Enthone Inc.
- Richard W. Hurtubise
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and Wet Chemical Compositions for Diffusion Barrier Formation
- Publication number 20220259724
- Publication date Aug 18, 2022
- MacDermid Enthone Inc.
- Richard W. Hurtubise
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Copper Deposition in Wafer Level Packaging of Integrated Circuits
- Publication number 20210388519
- Publication date Dec 16, 2021
- MacDermid Enthone Inc.
- Thomas Richardson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Electrodeposition in Microelectronics
- Publication number 20190390356
- Publication date Dec 26, 2019
- MacDermid Enthone Inc.
- Vincent Paneccasio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Deposition in Wafer Level Packaging of Integrated Circuits
- Publication number 20190368064
- Publication date Dec 5, 2019
- MacDermid Enthone Inc.
- Thomas Richardson
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
COPPER FILLING OF THROUGH SILICON VIAS
- Publication number 20190003068
- Publication date Jan 3, 2019
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper Electrodeposition in Microelectronics
- Publication number 20170029972
- Publication date Feb 2, 2017
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrodeposition of Copper
- Publication number 20160281251
- Publication date Sep 29, 2016
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND COMPOSITION FOR ELECTRODEPOSITION OF COPPER IN MICROELEC...
- Publication number 20140322912
- Publication date Oct 30, 2014
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ELECTRODEPOSITION IN MICROELECTRONICS
- Publication number 20140102909
- Publication date Apr 17, 2014
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND COMPOSITION FOR ELECTRODEPOSITION OF COPPER IN MICROELEC...
- Publication number 20130241060
- Publication date Sep 19, 2013
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FILLING OF THROUGH SILICON VIAS
- Publication number 20130199935
- Publication date Aug 8, 2013
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ELECTRODEPOSITION IN MICROELECTRONICS
- Publication number 20120043218
- Publication date Feb 23, 2012
- Enthone Inc.
- Vincent Paneccasio, JR.
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER DEPOSITION FOR FILLING FEATURES IN MANUFACTURE OF MICROELECT...
- Publication number 20100285660
- Publication date Nov 11, 2010
- Enthone Inc.
- Xuan Lin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRODEPOSITION OF COPPER IN MICROELECTRONICS WITH DIPYRIDYL-BASE...
- Publication number 20100126872
- Publication date May 27, 2010
- ENTHONE, INC.
- Vincent Paneccasio, JR.
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SURFACE PREPARATION PROCESS FOR DAMASCENE COPPER DEPOSITION
- Publication number 20100075496
- Publication date Mar 25, 2010
- Enthone Inc.
- Qingyun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METROLOGY IN ELECTROLESS COBALT PLATING
- Publication number 20090155468
- Publication date Jun 18, 2009
- Enthone Inc.
- Nicolai Petrov
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COPPER METALLIZATION OF THROUGH SILICON VIA
- Publication number 20090035940
- Publication date Feb 5, 2009
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SELF-INITIATED ALKALINE METAL ION FREE ELECTROLESS DEPOSITION COMPO...
- Publication number 20080254205
- Publication date Oct 16, 2008
- Enthone Inc.
- Nicolai Petrov
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COBALT CAPPING SURFACE PREPARATION IN MICROELECTRONICS MANUFACTURE
- Publication number 20080236619
- Publication date Oct 2, 2008
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEFECT REDUCTION IN ELECTRODEPOSITED COPPER FOR SEMICONDUCTOR APPLI...
- Publication number 20080121527
- Publication date May 29, 2008
- Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MANUFACTURE OF ELECTROLESS COBALT DEPOSITION COMPOSITIONS FOR MICRO...
- Publication number 20080090414
- Publication date Apr 17, 2008
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CAPPING OF METAL INTERCONNECTS IN INTEGRATED CIRCUIT ELECTRONIC DEV...
- Publication number 20070298609
- Publication date Dec 27, 2007
- Enthone Inc.
- Eric Yakobson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER ELECTRODEPOSITION IN MICROELECTRONICS
- Publication number 20070289875
- Publication date Dec 20, 2007
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper electrodeposition in microelectronics
- Publication number 20070178697
- Publication date Aug 2, 2007
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Defectivity and process control of electroless deposition in microe...
- Publication number 20070066057
- Publication date Mar 22, 2007
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Defectivity and process control of electroless deposition in microe...
- Publication number 20070062408
- Publication date Mar 22, 2007
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Defectivity and process control of electroless deposition in microe...
- Publication number 20070066058
- Publication date Mar 22, 2007
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Cobalt electroless plating in microelectronic devices
- Publication number 20060280860
- Publication date Dec 14, 2006
- Enthone Inc.
- Vincent Paneccasio
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Richard Hurtubise

Person

Patents Grantslast 30 patents

Method and wet chemical compositions for diffusion barrier formation

Method and wet chemical compositions for diffusion barrier formation

Copper deposition in wafer level packaging of integrated circuits

Copper electrodeposition in microelectronics

Copper deposition in wafer level packaging of integrated circuits

Copper filling of through silicon vias

Method and composition for electrodeposition of copper in microelec...

Copper electrodeposition in microelectronics

Defect reduction in electrodeposited copper for semiconductor appli...

Method and composition for electrodeposition of copper in microelec...

Copper electrodeposition in microelectronics

Method and composition for electrodeposition of copper in microelec...

Copper electrodeposition in microelectronics

Surface preparation process for damascene copper deposition

Copper deposition for filling features in manufacture of microelect...

Copper electrodeposition in microelectronics

Manufacture of electroless cobalt deposition compositions for micro...

Copper metallization of through silicon via

Defectivity and process control of electroless deposition in microe...

Defectivity and process control of electroless deposition in microe...

Defectivity and process control of electroless deposition in microe...

Defectivity and process control of electroless deposition in microe...

Capping of metal interconnects in integrated circuit electronic dev...

Cobalt and nickel electroless plating in microelectronic devices

Defect reduction in electrodeposited copper for semiconductor appli...

Copper electrodeposition in microelectronics

Capping of metal interconnects in integrated circuit electronic dev...

Electroplating chemistry for the CU filling of submicron features o...

Copper metallization of silicon wafers using insoluble anodes

Patents Applicationslast 30 patents

Copper Electrodeposition in Microelectronics

Method and Wet Chemical Compositions for Diffusion Barrier Formation

Method and Wet Chemical Compositions for Diffusion Barrier Formation

Copper Deposition in Wafer Level Packaging of Integrated Circuits

Copper Electrodeposition in Microelectronics

Copper Deposition in Wafer Level Packaging of Integrated Circuits

COPPER FILLING OF THROUGH SILICON VIAS

Copper Electrodeposition in Microelectronics

Electrodeposition of Copper

METHOD AND COMPOSITION FOR ELECTRODEPOSITION OF COPPER IN MICROELEC...

COPPER ELECTRODEPOSITION IN MICROELECTRONICS

METHOD AND COMPOSITION FOR ELECTRODEPOSITION OF COPPER IN MICROELEC...

COPPER FILLING OF THROUGH SILICON VIAS

COPPER ELECTRODEPOSITION IN MICROELECTRONICS

COPPER DEPOSITION FOR FILLING FEATURES IN MANUFACTURE OF MICROELECT...

ELECTRODEPOSITION OF COPPER IN MICROELECTRONICS WITH DIPYRIDYL-BASE...

SURFACE PREPARATION PROCESS FOR DAMASCENE COPPER DEPOSITION

METROLOGY IN ELECTROLESS COBALT PLATING

COPPER METALLIZATION OF THROUGH SILICON VIA

SELF-INITIATED ALKALINE METAL ION FREE ELECTROLESS DEPOSITION COMPO...

COBALT CAPPING SURFACE PREPARATION IN MICROELECTRONICS MANUFACTURE

DEFECT REDUCTION IN ELECTRODEPOSITED COPPER FOR SEMICONDUCTOR APPLI...

MANUFACTURE OF ELECTROLESS COBALT DEPOSITION COMPOSITIONS FOR MICRO...

CAPPING OF METAL INTERCONNECTS IN INTEGRATED CIRCUIT ELECTRONIC DEV...

COPPER ELECTRODEPOSITION IN MICROELECTRONICS

Copper electrodeposition in microelectronics

Defectivity and process control of electroless deposition in microe...

Defectivity and process control of electroless deposition in microe...

Defectivity and process control of electroless deposition in microe...

Cobalt electroless plating in microelectronic devices