Richard J. Hill

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic devices including pillars with partially-circular u...
- Patent number 12,324,154
- Issue date Jun 3, 2025
- Lodestar Licensing Group LLC
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices comprising multilevel bitlines, and related meth...
- Patent number 12,237,259
- Issue date Feb 25, 2025
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including staircase structures, and related...
- Patent number 12,191,249
- Issue date Jan 7, 2025
- Micron Technology, Inc.
- David H. Wells
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with active source/drain contacts in trench...
- Patent number 12,166,094
- Issue date Dec 10, 2024
- Micron Technology, Inc.
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having charge-trapping material arranged in v...
- Patent number 12,150,303
- Issue date Nov 19, 2024
- Byeung Chul Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory arrays comprising strings of memory cells and methods used i...
- Patent number 12,068,255
- Issue date Aug 20, 2024
- Micron Technology, Inc.
- M. Jared Barclay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices comprising a dielectric material, and related sy...
- Patent number 11,948,992
- Issue date Apr 2, 2024
- Micron Technology, Inc.
- Michael A. Lindemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including tiered stacks including conductiv...
- Patent number 11,903,196
- Issue date Feb 13, 2024
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,889,680
- Issue date Jan 30, 2024
- Micron Technology, Inc.
- David K. Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having vertically-spaced channel material seg...
- Patent number 11,871,572
- Issue date Jan 9, 2024
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays
- Patent number 11,864,386
- Issue date Jan 2, 2024
- Micron Technology, Inc.
- Sanh D. Tang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microelectronic devices including isolation structures protruding i...
- Patent number 11,800,717
- Issue date Oct 24, 2023
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,777,036
- Issue date Oct 3, 2023
- Micron Technology, Inc.
- David K. Hwang
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,735,672
- Issue date Aug 22, 2023
- Micron Technology, Inc.
- Aaron Michael Lowe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,729,982
- Issue date Aug 15, 2023
- Micron Technology, Inc.
- Shyam Surthi
Information Patent Grant
Integrated assemblies having conductive-shield-structures between l...
- Patent number 11,728,263
- Issue date Aug 15, 2023
- Micron Technology, Inc.
- Naveen Kaushik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional dynamic random-access memory array
- Patent number 11,690,210
- Issue date Jun 27, 2023
- Micron Technology, Inc.
- Vladimir Machkaoutsan
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,670,707
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- David K. Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices comprising adjoining oxide materials and related...
- Patent number 11,672,118
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having charge-trapping material arranged in v...
- Patent number 11,672,120
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- Byeung Chui Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory arrays and methods used in forming a memory array
- Patent number 11,640,837
- Issue date May 2, 2023
- Micron Technology, Inc.
- Armin Saeedi Vahdat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having vertically-extending channel material...
- Patent number 11,631,697
- Issue date Apr 18, 2023
- Micron Technology, Inc.
- Shyam Surthi
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated assemblies having vertically-spaced channel material seg...
- Patent number 11,587,948
- Issue date Feb 21, 2023
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having shield lines between digit lines, and...
- Patent number 11,581,317
- Issue date Feb 14, 2023
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having vertically-spaced channel material seg...
- Patent number 11,563,031
- Issue date Jan 24, 2023
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having vertically-spaced channel material seg...
- Patent number 11,557,608
- Issue date Jan 17, 2023
- Micron Technology, Inc.
- Byeung Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory array and a method used in forming a memory array
- Patent number 11,527,550
- Issue date Dec 13, 2022
- Micron Technology, Inc.
- Changhan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having polycrystalline first semiconductor ma...
- Patent number 11,527,620
- Issue date Dec 13, 2022
- Micron Technology, Inc.
- Kamal M. Karda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies, and methods of forming integrated assemblies
- Patent number 11,514,953
- Issue date Nov 29, 2022
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming apparatuses including air gaps between conductiv...
- Patent number 11,456,208
- Issue date Sep 27, 2022
- Micron Technology, Inc.
- Sidhartha Gupta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICES COMPRISING MULTILEVEL BITLINES, AND RELATED METH...
- Publication number 20250210511
- Publication date Jun 26, 2025
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES INCLUDING STAIRCASE STRUCTURES
- Publication number 20250132248
- Publication date Apr 24, 2025
- Micron Technology, Inc.
- David H. Wells
- G11 - INFORMATION STORAGE
Information Patent Application
MICROELECTRONIC DEVICES WITH ACTIVE SOURCE/DRAIN CONTACTS IN TRENCH...
- Publication number 20250107204
- Publication date Mar 27, 2025
- Micron Technology, Inc.
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE ENHANCED ASPECT RATIO CONNECTOR FOR SEMICONDUCTOR DE...
- Publication number 20250046711
- Publication date Feb 6, 2025
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY ARRAY STRUCTURES AND METHODS OF THEIR FABRICATION
- Publication number 20240395326
- Publication date Nov 28, 2024
- Micron Technology, Inc.
- Paolo Tessariol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRING DRIVER CONNECTIONS FOR WAFER ON WAFER PACKAGING
- Publication number 20240274533
- Publication date Aug 15, 2024
- Micron Technology, Inc.
- Michael A. Smith
- G11 - INFORMATION STORAGE
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING STADIUM STRUCTURES, AND RELATED M...
- Publication number 20240196606
- Publication date Jun 13, 2024
- Micron Technology, Inc.
- Lifang Xu
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC DEVICES COMPRISING A STACK STRUCTURE, A SOURCE CONTACT,...
- Publication number 20240162325
- Publication date May 16, 2024
- Micron Technology, Inc.
- Michael A. Lindemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES COMPRISING ADJOINING OXIDE MATERIALS AND RELATED...
- Publication number 20240130124
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Shyam Surthi
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20240121943
- Publication date Apr 11, 2024
- Micron Technology, Inc.
- David K. Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES AND RELATED ELECTRONIC SYSTEMS
- Publication number 20240099007
- Publication date Mar 21, 2024
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING STADIUM STRUCTURES, AND RELATED M...
- Publication number 20240071918
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING PILLARS WITH PARTIALLY-CIRCULAR U...
- Publication number 20240057337
- Publication date Feb 15, 2024
- Lodestar Licensing Group LLC
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MERGED CAVITIES AND BURIED ETCH STOPS FOR THREE-DIMENSIONAL MEMORY...
- Publication number 20230397422
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20230395723
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- David K. Hwang
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY APPARATUS AND METHODS INCLUDING MERGED PROCESS FOR MEMORY CE...
- Publication number 20230345722
- Publication date Oct 26, 2023
- Micron Technology, Inc.
- Byeung Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20230320085
- Publication date Oct 5, 2023
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...
- Publication number 20230307350
- Publication date Sep 28, 2023
- Micron Technology, Inc.
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Charge-Trapping Material Arranged in V...
- Publication number 20230262981
- Publication date Aug 17, 2023
- Micron Technology, Inc.
- Byeung Chul Kim
- G11 - INFORMATION STORAGE
Information Patent Application
Memory Circuitry Comprising Strings Of Memory Cells And Method Used...
- Publication number 20230255023
- Publication date Aug 10, 2023
- Micron Technology, Inc.
- Lifang Xu
- G11 - INFORMATION STORAGE
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...
- Publication number 20230073372
- Publication date Mar 9, 2023
- Micron Technology, Inc.
- David H. Wells
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated Assemblies, and Methods of Forming Integrated Assemblies
- Publication number 20230065142
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20230052468
- Publication date Feb 16, 2023
- Micron Technology, Inc.
- M. Jared Barclay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES COMPRISING MULTILEVEL BITLINES, AND RELATED METH...
- Publication number 20230033803
- Publication date Feb 2, 2023
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES COMPRISING MULTILEVEL BITLINES, AND RELATED METH...
- Publication number 20230032177
- Publication date Feb 2, 2023
- Micron Technology, Inc.
- Harsh Narendrakumar Jain
- G11 - INFORMATION STORAGE
Information Patent Application
MICROELECTRONIC DEVICES WITH ACTIVE SOURCE/DRAIN CONTACTS IN TRENCH...
- Publication number 20230010799
- Publication date Jan 12, 2023
- Micron Technology, Inc.
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND MEMORY DEVICES INCLUDING AIR GAPS BETWEEN CONDUCTIV...
- Publication number 20220384242
- Publication date Dec 1, 2022
- Micron Technology, Inc.
- Sidhartha Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays
- Publication number 20220320136
- Publication date Oct 6, 2022
- Micron Technology, Inc.
- Sanh D. Tang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20220310831
- Publication date Sep 29, 2022
- Micron Technology, Inc.
- David K. Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20220310637
- Publication date Sep 29, 2022
- Micron Technology, Inc.
- Aaron Michael Lowe
- H01 - BASIC ELECTRIC ELEMENTS

Richard J. Hill

Person

Patents Grantslast 30 patents

Microelectronic devices including pillars with partially-circular u...

Electronic devices comprising multilevel bitlines, and related meth...

Microelectronic devices including staircase structures, and related...

Microelectronic devices with active source/drain contacts in trench...

Integrated assemblies having charge-trapping material arranged in v...

Memory arrays comprising strings of memory cells and methods used i...

Electronic devices comprising a dielectric material, and related sy...

Microelectronic devices including tiered stacks including conductiv...

Integrated assemblies and methods of forming integrated assemblies

Integrated assemblies having vertically-spaced channel material seg...

Memory arrays

Microelectronic devices including isolation structures protruding i...

Integrated assemblies and methods of forming integrated assemblies

Integrated assemblies and methods of forming integrated assemblies

Integrated assemblies and methods of forming integrated assemblies

Integrated assemblies having conductive-shield-structures between l...

Three-dimensional dynamic random-access memory array

Integrated assemblies and methods of forming integrated assemblies

Electronic devices comprising adjoining oxide materials and related...

Integrated assemblies having charge-trapping material arranged in v...

Memory arrays and methods used in forming a memory array

Integrated assemblies having vertically-extending channel material...

Integrated assemblies having vertically-spaced channel material seg...

Integrated assemblies having shield lines between digit lines, and...

Integrated assemblies having vertically-spaced channel material seg...

Integrated assemblies having vertically-spaced channel material seg...

Memory array and a method used in forming a memory array

Integrated assemblies having polycrystalline first semiconductor ma...

Integrated assemblies, and methods of forming integrated assemblies

Methods of forming apparatuses including air gaps between conductiv...

Patents Applicationslast 30 patents

ELECTRONIC DEVICES COMPRISING MULTILEVEL BITLINES, AND RELATED METH...

MEMORY DEVICES INCLUDING STAIRCASE STRUCTURES

MICROELECTRONIC DEVICES WITH ACTIVE SOURCE/DRAIN CONTACTS IN TRENCH...

LOW RESISTANCE ENHANCED ASPECT RATIO CONNECTOR FOR SEMICONDUCTOR DE...

MEMORY ARRAY STRUCTURES AND METHODS OF THEIR FABRICATION

STRING DRIVER CONNECTIONS FOR WAFER ON WAFER PACKAGING

MICROELECTRONIC DEVICES INCLUDING STADIUM STRUCTURES, AND RELATED M...

ELECTRONIC DEVICES COMPRISING A STACK STRUCTURE, A SOURCE CONTACT,...

ELECTRONIC DEVICES COMPRISING ADJOINING OXIDE MATERIALS AND RELATED...

Integrated Assemblies and Methods of Forming Integrated Assemblies

MEMORY DEVICES AND RELATED ELECTRONIC SYSTEMS

MICROELECTRONIC DEVICES INCLUDING STADIUM STRUCTURES, AND RELATED M...

MICROELECTRONIC DEVICES INCLUDING PILLARS WITH PARTIALLY-CIRCULAR U...

MERGED CAVITIES AND BURIED ETCH STOPS FOR THREE-DIMENSIONAL MEMORY...

Integrated Assemblies and Methods of Forming Integrated Assemblies

MEMORY APPARATUS AND METHODS INCLUDING MERGED PROCESS FOR MEMORY CE...

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...

Integrated Assemblies Having Charge-Trapping Material Arranged in V...

Memory Circuitry Comprising Strings Of Memory Cells And Method Used...

MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...

Integrated Assemblies, and Methods of Forming Integrated Assemblies

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

ELECTRONIC DEVICES COMPRISING MULTILEVEL BITLINES, AND RELATED METH...

ELECTRONIC DEVICES COMPRISING MULTILEVEL BITLINES, AND RELATED METH...

MICROELECTRONIC DEVICES WITH ACTIVE SOURCE/DRAIN CONTACTS IN TRENCH...

APPARATUSES AND MEMORY DEVICES INCLUDING AIR GAPS BETWEEN CONDUCTIV...

Memory Arrays

Integrated Assemblies and Methods of Forming Integrated Assemblies

Integrated Assemblies and Methods of Forming Integrated Assemblies