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Richard J. Koba
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Saugus, MA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Air cavity package using high temperature silicone adhesive
Patent number
11,227,806
Issue date
Jan 18, 2022
Materion Corporation
Richard J. Koba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal-on-ceramic substrates
Patent number
11,046,051
Issue date
Jun 29, 2021
Materion Corporation
Richard J. Koba
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Sputtering target having RFID information
Patent number
10,896,812
Issue date
Jan 19, 2021
Materion Corporation
Michael V. Pasquariello
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Copper flanged air cavity packages for high frequency devices
Patent number
10,163,743
Issue date
Dec 25, 2018
Materion Corporation
Richard J. Koba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Air cavity packages having high thermal conductivity base plates an...
Patent number
9,117,793
Issue date
Aug 25, 2015
Materion Corporation
George Michael Wityak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages having metal composite base plates
Patent number
9,035,448
Issue date
May 19, 2015
Materion Corporation
George Michael Wityak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Surface mount package for a high power light emitting diode
Patent number
7,157,744
Issue date
Jan 2, 2007
M/A-COM, Inc.
William J. Palmteer
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE FOR AN EDGE EMITTING LASER DIODE
Publication number
20230238770
Publication date
Jul 27, 2023
MATERION CORPORATION
Reto KELLER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SPUTTERING TARGET HAVING RFID INFORMATION
Publication number
20180211825
Publication date
Jul 26, 2018
Materion Corporation
Michael V. Pasquariello
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
COPPER FLANGED AIR CAVITY PACKAGES FOR HIGH FREQUENCY DEVICES
Publication number
20170338161
Publication date
Nov 23, 2017
MATERION CORPORATION
Richard J. Koba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
AIR CAVITY PACKAGE
Publication number
20170323837
Publication date
Nov 9, 2017
Materion Corporation
Richard J. Koba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL-ON-CERAMIC SUBSTRATES
Publication number
20170151755
Publication date
Jun 1, 2017
Materion Corporation
Richard J. Koba
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
AIR CAVITY PACKAGE
Publication number
20170069560
Publication date
Mar 9, 2017
MATERION CORPORATION
Richard J. Koba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE BOND FOILS
Publication number
20160059535
Publication date
Mar 3, 2016
MATERION CORPORATION
Richard J. Koba
B32 - LAYERED PRODUCTS
Information
Patent Application
AIR CAVITY PACKAGES HAVING HIGH THERMAL CONDUCTIVITY BASE PLATES AN...
Publication number
20140001628
Publication date
Jan 2, 2014
George Michael Wityak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
AIR CAVITY PACKAGES HAVING HIGH THERMAL CONDUCTIVITY BASE PLATES AN...
Publication number
20140001624
Publication date
Jan 2, 2014
George Michael Wityak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Surface mount package for a high power light emitting diode
Publication number
20050093116
Publication date
May 5, 2005
M/A Com, Inc.
William J. Palmteer
H01 - BASIC ELECTRIC ELEMENTS