Richard J. RASSEL

Person

Essex Junction, VA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit structure with through-metal through-substrate i...
- Patent number 12,062,574
- Issue date Aug 13, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Zhong-Xiang He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for preventing dicing damage
- Patent number 9,759,868
- Issue date Sep 12, 2017
- International Business Machines Corporation
- Brett Cucci
- G02 - OPTICS
Information Patent Grant
Pixel sensor cell including light shield
- Patent number 9,543,356
- Issue date Jan 10, 2017
- GLOBALFOUNDRIES Inc.
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel sensor cell with hold node for leakage cancellation and metho...
- Patent number 9,106,854
- Issue date Aug 11, 2015
- International Business Machines Corporation
- James W. Adkisson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Thick bond pad for chip with cavity package
- Patent number 9,059,180
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoconductor-on-active pixel device
- Patent number 9,059,360
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel sensor cell with hold node for leakage cancellation and metho...
- Patent number 8,836,835
- Issue date Sep 16, 2014
- International Business Machines Corporation
- James W. Adkisson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of fabricating photoconductor-on-active pixel device
- Patent number 8,753,917
- Issue date Jun 17, 2014
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intralevel conductive light shield
- Patent number 8,709,855
- Issue date Apr 29, 2014
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel sensors of multiple pixel size and methods of implant dose co...
- Patent number 8,704,325
- Issue date Apr 22, 2014
- International Business Machines Corporation
- John J. Ellis-Monaghan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-blooming pixel sensor cell with active neutral density filter,...
- Patent number 8,618,588
- Issue date Dec 31, 2013
- International Business Machines Corporation
- Kristin M. Ackerson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Thick bond pad for chip with cavity package
- Patent number 8,450,822
- Issue date May 28, 2013
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Delamination and crack resistant image sensor structures and methods
- Patent number 8,409,899
- Issue date Apr 2, 2013
- Intnernational Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor pixel structure employing a shared floating diffusion
- Patent number 8,405,751
- Issue date Mar 26, 2013
- International Business Machines Corporation
- Jason D. Hibbeler
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Pixel sensors of multiple pixel size and methods of implant dose co...
- Patent number 8,334,195
- Issue date Dec 18, 2012
- International Business Machines Corporation
- John J. Ellis-Monaghan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS pixel sensor cells with poly spacer transfer gates and methods...
- Patent number 8,298,853
- Issue date Oct 30, 2012
- International Business Machines Corporation
- James W. Adkisson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlevel conductive light shield
- Patent number 8,299,475
- Issue date Oct 30, 2012
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad for wafer and package for CMOS imager
- Patent number 8,232,651
- Issue date Jul 31, 2012
- International Business Machines Corporation
- James W. Adkisson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlevel conductive light shield
- Patent number 8,158,988
- Issue date Apr 17, 2012
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming silicide strapping in imager transfer gate device
- Patent number 8,158,453
- Issue date Apr 17, 2012
- International Business Machines Corporation
- James W. Adkisson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures, design structures and methods of fabricating global shu...
- Patent number 8,138,531
- Issue date Mar 20, 2012
- International Business Machines Corporation
- James William Adkisson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad for wafer and package for CMOS imager
- Patent number 8,119,456
- Issue date Feb 21, 2012
- International Business Machines Corporation
- James W. Adkisson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency CMOS image sensor pixel employing dynamic voltage s...
- Patent number 8,023,021
- Issue date Sep 20, 2011
- International Business Machines Corporation
- James W. Adkisson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Pixel sensor cell with frame storage capability
- Patent number 8,009,215
- Issue date Aug 30, 2011
- International Business Machines Corporation
- James W. Adkisson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Pixel sensor cell with frame storage capability
- Patent number 8,009,216
- Issue date Aug 30, 2011
- International Business Machines Corporation
- James W. Adkisson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
IC chip and design structure including stitched circuitry region bo...
- Patent number 8,006,211
- Issue date Aug 23, 2011
- International Business Machines Corporation
- Robert K. Leidy
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
High surface area aluminum bond pad for through-wafer connections t...
- Patent number 7,964,967
- Issue date Jun 21, 2011
- International Business Machines Corporation
- James W. Adkisson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stitched circuitry region boundary identification for stitched IC c...
- Patent number 7,958,482
- Issue date Jun 7, 2011
- International Business Machines Corporation
- Robert K. Leidy
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of making small geometry features
- Patent number 7,935,604
- Issue date May 3, 2011
- International Business Machines Corporation
- James William Adkisson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Delamination and crack resistant image sensor structures and methods
- Patent number 7,928,527
- Issue date Apr 19, 2011
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED DEPLETION AND ENHANCEMENT MODE GALLIUM NITRIDE HIGH-ELEC...
- Publication number 20240063219
- Publication date Feb 22, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Santosh Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-MOBILITY-ELECTRON TRANSISTORS HAVING HEAT DISSIPATING STRUCTURES
- Publication number 20230420326
- Publication date Dec 28, 2023
- GLOBALFOUNDRIES U.S. Inc.
- ZHONG-XIANG HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WITH DUAL ISOLATION STRUCTURE
- Publication number 20230117591
- Publication date Apr 20, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Richard J. RASSEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH THROUGH-METAL THROUGH-SUBSTRATE I...
- Publication number 20230034728
- Publication date Feb 2, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Zhong-Xiang He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR PREVENTING DICING DAMAGE
- Publication number 20170131477
- Publication date May 11, 2017
- International Business Machines Corporation
- Brett CUCCI
- G02 - OPTICS
Information Patent Application
THICK BOND PAD FOR CHIP WITH CAVITY PACKAGE
- Publication number 20150221698
- Publication date Aug 6, 2015
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL SENSOR CELL WITH HOLD NODE FOR LEAKAGE CANCELLATION AND METHO...
- Publication number 20140340548
- Publication date Nov 20, 2014
- James W. ADKISSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOCONDUCTOR-ON-ACTIVE PIXEL DEVICE
- Publication number 20140209986
- Publication date Jul 31, 2014
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICK BOND PAD FOR CHIP WITH CAVITY PACKAGE
- Publication number 20130127035
- Publication date May 23, 2013
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL SENSORS OF MULTIPLE PIXEL SIZE AND METHODS OF IMPLANT DOSE CO...
- Publication number 20130001732
- Publication date Jan 3, 2013
- International Business Machines Corporation
- John J. ELLIS-MONAGHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLEVEL CONDUCTIVE LIGHT SHIELD
- Publication number 20120161299
- Publication date Jun 28, 2012
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Design Structure, Methods, and Apparatus Involving Photoconductor-o...
- Publication number 20120146115
- Publication date Jun 14, 2012
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-BLOOMING PIXEL SENSOR CELL WITH ACTIVE NEUTRAL DENSITY FILTER,...
- Publication number 20120105692
- Publication date May 3, 2012
- International Business Machines Corporation
- Kristin M. ACKERSON
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
BOND PAD FOR WAFER AND PACKAGE FOR CMOS IMAGER
- Publication number 20120098105
- Publication date Apr 26, 2012
- International Business Machines Corporation
- James W. Adkisson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL SENSOR CELL WITH HOLD NODE FOR LEAKAGE CANCELLATION AND METHO...
- Publication number 20120081588
- Publication date Apr 5, 2012
- International Business Machines Corporation
- James W. ADKISSON
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CMOS PIXEL SENSOR CELLS WITH POLY SPACER TRANSFER GATES AND METHODS...
- Publication number 20120037967
- Publication date Feb 16, 2012
- International Business Machines Corporation
- James W. Adkisson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DELAMINATION AND CRACK RESISTANT IMAGE SENSOR STRUCTURES AND METHODS
- Publication number 20110129955
- Publication date Jun 2, 2011
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICK BOND PAD FOR CHIP WITH CAVITY PACKAGE
- Publication number 20110068424
- Publication date Mar 24, 2011
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR INCLUDING STACKED PHOTODIODES
- Publication number 20110072409
- Publication date Mar 24, 2011
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES, DESIGN STRUCTURES AND METHODS OF FABRICATING GLOBAL SHU...
- Publication number 20110062542
- Publication date Mar 17, 2011
- International Business Machines Corporation
- James William Adkisson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL SENSORS OF MULTIPLE PIXEL SIZE AND METHODS OF IMPLANT DOSE CO...
- Publication number 20110057282
- Publication date Mar 10, 2011
- International Business Machines Corporation
- John J. ELLIS-MONAGHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PIXEL STRUCTURE EMPLOYING A SHARED FLOATING DIFFUSION
- Publication number 20110025892
- Publication date Feb 3, 2011
- International Business Machines Corporation
- Jason D. Hibbeler
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD OF MAKING SMALL GEOMETRY FEATURES
- Publication number 20100279480
- Publication date Nov 4, 2010
- James William Adkisson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL SENSOR CELL INCLUDING LIGHT SHIELD
- Publication number 20100230729
- Publication date Sep 16, 2010
- International Business Machines Corporation
- John Ellis-Monaghan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICIDE STRAPPING IN IMAGER TRANSFER GATE DEVICE
- Publication number 20100136733
- Publication date Jun 3, 2010
- International Business Machines Corporation
- James W. Adkisson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH EFFICIENCY CMOS IMAGE SENSOR PIXEL EMPLOYING DYNAMIC VOLTAGE S...
- Publication number 20100097511
- Publication date Apr 22, 2010
- International Business Machines Corporation
- James W. Adkisson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BOND PAD FOR WAFER AND PACKAGE FOR CMOS IMAGER
- Publication number 20100038773
- Publication date Feb 18, 2010
- International Business Machines Corporation
- James W. Adkisson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL SENSOR CELL WITH FRAME STORAGE CAPABILITY
- Publication number 20100013973
- Publication date Jan 21, 2010
- International Business Machines Corporation
- James W. Adkisson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PIXEL SENSOR CELL WITH FRAME STORAGE CAPABILITY
- Publication number 20100013972
- Publication date Jan 21, 2010
- James W. Adkisson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PIXEL SENSOR CELL, METHODS AND DESIGN STRUCTURE INCLUDING OPTICALLY...
- Publication number 20090309143
- Publication date Dec 17, 2009
- International Business Machines Corporation
- James William Adkisson
- H01 - BASIC ELECTRIC ELEMENTS

Richard J. RASSEL

Person

Patents Grantslast 30 patents

Integrated circuit structure with through-metal through-substrate i...

Structures for preventing dicing damage

Pixel sensor cell including light shield

Pixel sensor cell with hold node for leakage cancellation and metho...

Thick bond pad for chip with cavity package

Photoconductor-on-active pixel device

Pixel sensor cell with hold node for leakage cancellation and metho...

Method of fabricating photoconductor-on-active pixel device

Intralevel conductive light shield

Pixel sensors of multiple pixel size and methods of implant dose co...

Anti-blooming pixel sensor cell with active neutral density filter,...

Thick bond pad for chip with cavity package

Delamination and crack resistant image sensor structures and methods

Image sensor pixel structure employing a shared floating diffusion

Pixel sensors of multiple pixel size and methods of implant dose co...

CMOS pixel sensor cells with poly spacer transfer gates and methods...

Interlevel conductive light shield

Bond pad for wafer and package for CMOS imager

Interlevel conductive light shield

Methods of forming silicide strapping in imager transfer gate device

Structures, design structures and methods of fabricating global shu...

Bond pad for wafer and package for CMOS imager

High efficiency CMOS image sensor pixel employing dynamic voltage s...

Pixel sensor cell with frame storage capability

Pixel sensor cell with frame storage capability

IC chip and design structure including stitched circuitry region bo...

High surface area aluminum bond pad for through-wafer connections t...

Stitched circuitry region boundary identification for stitched IC c...

Method of making small geometry features

Delamination and crack resistant image sensor structures and methods

Patents Applicationslast 30 patents

INTEGRATED DEPLETION AND ENHANCEMENT MODE GALLIUM NITRIDE HIGH-ELEC...

HIGH-MOBILITY-ELECTRON TRANSISTORS HAVING HEAT DISSIPATING STRUCTURES

DEVICE WITH DUAL ISOLATION STRUCTURE

INTEGRATED CIRCUIT STRUCTURE WITH THROUGH-METAL THROUGH-SUBSTRATE I...

STRUCTURES FOR PREVENTING DICING DAMAGE

THICK BOND PAD FOR CHIP WITH CAVITY PACKAGE

PIXEL SENSOR CELL WITH HOLD NODE FOR LEAKAGE CANCELLATION AND METHO...

PHOTOCONDUCTOR-ON-ACTIVE PIXEL DEVICE

THICK BOND PAD FOR CHIP WITH CAVITY PACKAGE

PIXEL SENSORS OF MULTIPLE PIXEL SIZE AND METHODS OF IMPLANT DOSE CO...

INTERLEVEL CONDUCTIVE LIGHT SHIELD

Design Structure, Methods, and Apparatus Involving Photoconductor-o...

ANTI-BLOOMING PIXEL SENSOR CELL WITH ACTIVE NEUTRAL DENSITY FILTER,...

BOND PAD FOR WAFER AND PACKAGE FOR CMOS IMAGER

PIXEL SENSOR CELL WITH HOLD NODE FOR LEAKAGE CANCELLATION AND METHO...

CMOS PIXEL SENSOR CELLS WITH POLY SPACER TRANSFER GATES AND METHODS...

DELAMINATION AND CRACK RESISTANT IMAGE SENSOR STRUCTURES AND METHODS

THICK BOND PAD FOR CHIP WITH CAVITY PACKAGE

OPTICAL SENSOR INCLUDING STACKED PHOTODIODES

STRUCTURES, DESIGN STRUCTURES AND METHODS OF FABRICATING GLOBAL SHU...

PIXEL SENSORS OF MULTIPLE PIXEL SIZE AND METHODS OF IMPLANT DOSE CO...

IMAGE SENSOR PIXEL STRUCTURE EMPLOYING A SHARED FLOATING DIFFUSION

METHOD OF MAKING SMALL GEOMETRY FEATURES

PIXEL SENSOR CELL INCLUDING LIGHT SHIELD

SILICIDE STRAPPING IN IMAGER TRANSFER GATE DEVICE

HIGH EFFICIENCY CMOS IMAGE SENSOR PIXEL EMPLOYING DYNAMIC VOLTAGE S...

BOND PAD FOR WAFER AND PACKAGE FOR CMOS IMAGER

PIXEL SENSOR CELL WITH FRAME STORAGE CAPABILITY

PIXEL SENSOR CELL WITH FRAME STORAGE CAPABILITY

PIXEL SENSOR CELL, METHODS AND DESIGN STRUCTURE INCLUDING OPTICALLY...