Richard J. Ross

Person

Moraga, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Vacuum assisted sealing processes and systems for increasing air ca...
- Patent number 10,115,605
- Issue date Oct 30, 2018
- RJR Technologies, Inc.
- Richard J. Ross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular low stress package technology
- Patent number 8,759,965
- Issue date Jun 24, 2014
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular low stress package technology
- Patent number 8,639,373
- Issue date Jan 28, 2014
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular low stress package technology
- Patent number 8,560,104
- Issue date Oct 15, 2013
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular low stress package technology
- Patent number 8,283,769
- Issue date Oct 9, 2012
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular low stress package technology
- Patent number 8,153,474
- Issue date Apr 10, 2012
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of diverse materials in air-cavity packaging of electronic devices
- Patent number 6,511,866
- Issue date Jan 28, 2003
- RJR Polymers, Inc.
- Raymond S. Bregante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame moisture barrier for molded plastic electronic packages
- Patent number 6,214,152
- Issue date Apr 10, 2001
- RJR Polymers, Inc.
- Richard J. Ross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverted stamping process
- Patent number 5,816,158
- Issue date Oct 6, 1998
- RJR Polymers, Inc.
- Richard J. Ross
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of assembling integrated circuit package
- Patent number 5,706,579
- Issue date Jan 13, 1998
- RJR Polymers, Inc.
- Richard J. Ross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with heat dissipation for high current...
- Patent number 5,572,070
- Issue date Nov 5, 1996
- RJR Polymers, Inc.
- Richard J. Ross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Iso-thermal seal process for electronic devices
- Patent number 5,056,296
- Issue date Oct 15, 1991
- R. J. R. Polymers, Inc.
- Richard J. Ross
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
VACUUM ASSISTED SEALING PROCESSES & SYSTEMS FOR INCREASING AIR CAVI...
- Publication number 20180012776
- Publication date Jan 11, 2018
- RJR Technologies, Inc.
- Richard J. Ross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR LOW STRESS PACKAGE TECHNOLOGY
- Publication number 20110086469
- Publication date Apr 14, 2011
- STMICROELECTRONICS, INC.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR LOW STRESS PACKAGE TECHNOLOGY
- Publication number 20110087356
- Publication date Apr 14, 2011
- STMICROELECTRONICS, INC.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR LOW STRESS PACKAGE TECHNOLOGY
- Publication number 20110084371
- Publication date Apr 14, 2011
- STMICROELECTRONICS, INC.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR LOW STRESS PACKAGE TECHNOLOGY
- Publication number 20110084376
- Publication date Apr 14, 2011
- STMICROELECTRONICS, INC.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR LOW STRESS PACKAGE TECHNOLOGY
- Publication number 20110087353
- Publication date Apr 14, 2011
- STMICROELECTRONICS, INC.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USE OF DIVERSE MATERIALS IN AIR-CAVITY PACKAGING OF ELECTRONIC DEVICES
- Publication number 20030013234
- Publication date Jan 16, 2003
- RJR Polymers, Inc.
- Raymond S. Bregante
- H01 - BASIC ELECTRIC ELEMENTS

Richard J. Ross

Person

Patents Grantslast 30 patents

Vacuum assisted sealing processes and systems for increasing air ca...

Modular low stress package technology

Modular low stress package technology

Modular low stress package technology

Modular low stress package technology

Modular low stress package technology

Use of diverse materials in air-cavity packaging of electronic devices

Lead frame moisture barrier for molded plastic electronic packages

Inverted stamping process

Method of assembling integrated circuit package

Integrated circuit packages with heat dissipation for high current...

Iso-thermal seal process for electronic devices

Patents Applicationslast 30 patents

VACUUM ASSISTED SEALING PROCESSES & SYSTEMS FOR INCREASING AIR CAVI...

MODULAR LOW STRESS PACKAGE TECHNOLOGY

MODULAR LOW STRESS PACKAGE TECHNOLOGY

MODULAR LOW STRESS PACKAGE TECHNOLOGY

MODULAR LOW STRESS PACKAGE TECHNOLOGY

MODULAR LOW STRESS PACKAGE TECHNOLOGY

USE OF DIVERSE MATERIALS IN AIR-CAVITY PACKAGING OF ELECTRONIC DEVICES