Richard K. Dennis

Person

Etters, PA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Edge clip terminal
- Patent number 6,261,136
- Issue date Jul 17, 2001
- Die Tech, Inc.
- Richard K. Dennis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder terminal strip
- Patent number 5,411,420
- Issue date May 2, 1995
- Die Tech, Inc.
- Richard K. Dennis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate lead strip mounting machine and method
- Patent number 5,333,375
- Issue date Aug 2, 1994
- Die Tech, Inc.
- Richard K. Dennis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an integrated circuit substrate lead assembly
- Patent number 5,253,415
- Issue date Oct 19, 1993
- Die Tech, Inc.
- Richard K. Dennis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate breaker
- Patent number 5,133,491
- Issue date Jul 28, 1992
- Die Tech, Inc.
- Thomas R. Correll
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Solder terminal
- Patent number 5,015,206
- Issue date May 14, 1991
- Die Tech, Inc.
- Richard K. Dennis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder terminal
- Patent number 4,900,279
- Issue date Feb 13, 1990
- Die Tech, Inc.
- Richard K. Dennis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for connecting lead frame to semiconductor device
- Patent number 4,816,427
- Issue date Mar 28, 1989
- Richard K. Dennis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of connecting lead frame to a semi-conductor device and a d...
- Patent number 4,782,589
- Issue date Nov 8, 1988
- Richard K. Dennis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and mechanism to deposit solder paste upon substrates
- Patent number 4,710,399
- Issue date Dec 1, 1987
- Richard K. Dennis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector block
- Patent number 3,993,384
- Issue date Nov 23, 1976
- E. I. Du Pont de Nemours and Company
- Richard Kay Dennis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless package retaining frame
- Patent number 3,982,159
- Issue date Sep 21, 1976
- E. I. Du Pont de Nemours and Company
- Richard Kay Dennis
- H01 - BASIC ELECTRIC ELEMENTS

Richard K. Dennis

Person

Patents Grantslast 30 patents

Edge clip terminal

Solder terminal strip

Substrate lead strip mounting machine and method

Method of making an integrated circuit substrate lead assembly

Substrate breaker

Solder terminal

Solder terminal

Process for connecting lead frame to semiconductor device

Process of connecting lead frame to a semi-conductor device and a d...

Method and mechanism to deposit solder paste upon substrates

Connector block

Leadless package retaining frame