Richard Knipper

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,027,490
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,908,830
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor package, semiconductor packa...
- Patent number 11,562,967
- Issue date Jan 24, 2023
- Infineon Technologies AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary post-assisted embedding of semiconductor dies
- Patent number 11,004,700
- Issue date May 11, 2021
- Infineon Technologies AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Power Package With Galvanic Isolation
- Publication number 20250014971
- Publication date Jan 9, 2025
- Infineon Technologies Austria AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SWITCH ASSEMBLY WITH CO-PACKAGED PROTECTION FUNCTION
- Publication number 20240267038
- Publication date Aug 8, 2024
- Infineon Technologies Austria AG
- Wolfgang FRANK
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Semiconductor Device Comprising a Semiconductor Die and a Carrier b...
- Publication number 20220301959
- Publication date Sep 22, 2022
- INFINEON TECHNOLOGIES AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Electronics Carrier
- Publication number 20220278017
- Publication date Sep 1, 2022
- Infineon Technologies Austria AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20220045031
- Publication date Feb 10, 2022
- INFINEON TECHNOLOGIES AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKA...
- Publication number 20210313273
- Publication date Oct 7, 2021
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR DIE EMBEDDED IN A MOLDI...
- Publication number 20210217633
- Publication date Jul 15, 2021
- INFINEON TECHNOLOGIES AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Temporary Post-Assisted Embedding of Semiconductor Dies
- Publication number 20210057234
- Publication date Feb 25, 2021
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS

Richard Knipper

Person

Patents Grantslast 30 patents

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Method for fabricating a semiconductor package, semiconductor packa...

Temporary post-assisted embedding of semiconductor dies

Patents Applicationslast 30 patents

Power Package With Galvanic Isolation

POWER SWITCH ASSEMBLY WITH CO-PACKAGED PROTECTION FUNCTION

Semiconductor Device Comprising a Semiconductor Die and a Carrier b...

Power Electronics Carrier

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKA...

SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR DIE EMBEDDED IN A MOLDI...

Temporary Post-Assisted Embedding of Semiconductor Dies