Richard L. Elliott

Person

Meridian, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Contact integration method
- Patent number 7,294,570
- Issue date Nov 13, 2007
- Micron Technology, Inc.
- Richard L. Elliott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact integration method
- Patent number 6,713,384
- Issue date Mar 30, 2004
- Micron Technology, Inc.
- Richard L. Elliott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact integration article
- Patent number 6,593,657
- Issue date Jul 15, 2003
- Micron Technology, Inc.
- Richard L. Elliott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC mechanical planarization process incorporating two slurry compos...
- Patent number 6,040,245
- Issue date Mar 21, 2000
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B24 - GRINDING POLISHING
Information Patent Grant
IC mechanical planarization process incorporating two slurry compos...
- Patent number 5,994,224
- Issue date Nov 30, 1999
- Micron Technology Inc.
- Gurtej S. Sandhu
- B24 - GRINDING POLISHING
Information Patent Grant
Method for improved bottom and side wall coverage of high aspect ra...
- Patent number 5,985,103
- Issue date Nov 16, 1999
- Micron Technology, Inc.
- John H. Givens
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Trench/hole fill processes for semiconductor fabrication
- Patent number 5,956,612
- Issue date Sep 21, 1999
- Micron Technology, Inc.
- Richard L. Elliott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spiral grooved polishing pad for chemical-mechanical planarization...
- Patent number 5,690,540
- Issue date Nov 25, 1997
- Micron Technology, Inc.
- Richard L. Elliott
- B24 - GRINDING POLISHING
Information Patent Grant
Sputter deposition method for improved bottom and side wall coverag...
- Patent number 5,658,438
- Issue date Aug 19, 1997
- Micron Technology, Inc.
- John H. Givens
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
IC mechanical planarization process incorporating two slurry compos...
- Patent number 5,540,810
- Issue date Jul 30, 1996
- Micron Technology Inc.
- Gurtej Sandhu
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
MATERIAL DEPOSITION SYSTEMS, AND RELATED METHODS, MICROELECTRONIC D...
- Publication number 20210175072
- Publication date Jun 10, 2021
- Micron Technology, Inc.
- Clement Jacob
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact integration method
- Publication number 20040180535
- Publication date Sep 16, 2004
- Micron Technology, Inc.
- Richard L. Elliott
- H01 - BASIC ELECTRIC ELEMENTS

Richard L. Elliott

Person

Patents Grantslast 30 patents

Contact integration method

Contact integration method

Contact integration article

IC mechanical planarization process incorporating two slurry compos...

IC mechanical planarization process incorporating two slurry compos...

Method for improved bottom and side wall coverage of high aspect ra...

Trench/hole fill processes for semiconductor fabrication

Spiral grooved polishing pad for chemical-mechanical planarization...

Sputter deposition method for improved bottom and side wall coverag...

IC mechanical planarization process incorporating two slurry compos...

Patents Applicationslast 30 patents

MATERIAL DEPOSITION SYSTEMS, AND RELATED METHODS, MICROELECTRONIC D...

Contact integration method