Richard L. Mahle

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Dallas, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for reducing stress concentrations on a semiconductor wafer...
- Patent number 7,741,701
- Issue date Jun 22, 2010
- Texas Instruments Incorporated
- Richard L. Mahle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadframe-to-plastic lock for IC package
- Patent number 7,078,271
- Issue date Jul 18, 2006
- Texas Instruments Incorporated
- Richard L. Mahle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing stress concentrations on a semiconductor wafer...
- Patent number 7,041,578
- Issue date May 9, 2006
- Texas Instruments Incorporated
- Richard L. Mahle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadframe-to-plastic lock for IC package
- Patent number 6,794,738
- Issue date Sep 21, 2004
- Texas Instruments Incorporated
- Richard L. Mahle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame type plastic ball grid array package with pre-assembled...
- Patent number 6,534,337
- Issue date Mar 18, 2003
- Texas Instruments Incorporated
- Richard L. Mahle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moat for die pad cavity in bond station heater block
- Patent number 5,558,267
- Issue date Sep 24, 1996
- Texas Instruments Incorporated
- Henry L. Humphrey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method for reducing stress concentrations on a semiconductor wafer...
- Publication number 20060172509
- Publication date Aug 3, 2006
- Richard L. Mahle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for reducing stress concentrations on a semiconductor wafer...
- Publication number 20050003633
- Publication date Jan 6, 2005
- TEXAS INSTRUMENTS INCORPORATED
- Richard L. Mahle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Leadframe-to-plastic lock for IC package
- Publication number 20040175864
- Publication date Sep 9, 2004
- Richard L. Mahle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device package with leadframe-to-plastic lock
- Publication number 20040124505
- Publication date Jul 1, 2004
- Richard L. Mahle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe-to-plastic lock for IC package
- Publication number 20040063244
- Publication date Apr 1, 2004
- Richard L. Mahle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for die transfer
- Publication number 20030064543
- Publication date Apr 3, 2003
- Richard Lee Mahle
- H01 - BASIC ELECTRIC ELEMENTS